Altera

EPF8820ARI208-4 - FLEX 8000 FPGA, 8K Gates, 5V, 208-RQFP | Intel / Altera

MPN: EPF8820ARI208-4 ✗ End of Life

In Stock Ships in 1-3 business days

5 V Vdss 208-pin RQFP (RQFP-208) Package 125 MHz Speed

From $8.7 USD / Unit

MOQ: 1 |

Price updated: 2026-09-11

Volume Pricing

Qty	Unit Price	Extended
1	$28.2	$28.20
10	$22.5	$225.00
100	$15.8	$1,580.00
500	$11.4	$5,700.00
1,000	$8.7	$8,700.00

ℹ️ All prices are in USD

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EPF8820ARI208-4 Overview

The Intel / Altera EPF8820ARI208-4 is a member of the FLEX 8000 family of SRAM-based, in-system programmable CMOS FPGAs, integrating approximately 8,000 usable gates, 672 logic cells, and 820 flip-flops into a 208-pin ceramic RQFP package rated for industrial temperature operation. It is fabricated on a 0.42 µm CMOS process and operates at a nominal 5 V supply (4.5 V to 5.5 V) with configurable I/O that supports either 3.3 V or 5 V interface levels, allowing direct bridging between legacy 5 V buses and modern 3.3 V peripherals. The device delivers up to 125 MHz internal performance and uses Altera's patented FastTrack Interconnect architecture with continuous, predictable routing delays that simplify static timing closure.

An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital logic without the cost or lead-time of an ASIC. The FLEX 8000 family sits within the hierarchy of programmable logic devices (PLD) and specifically within the SRAM-based FPGA segment - it is volatile and must be configured from an external EPROM, Flash, or microcontroller on every power-up. This makes FLEX 8000 parts well suited to prototyping, low-volume designs, and systems requiring in-system updates via JTAG.

Key features of the EPF8820ARI208-4 include a high-density interconnect structure with four row- and column-based interconnect channels, multi-level routing resources (direct, local, row, and column), and built-in JTAG boundary-scan (IEEE Std 1149.1) for board-level testability. The architecture provides bidirectional I/O pins with tri-state control, programmable slew-rate and pull-up options, and dedicated clock and global control signal networks supporting low-skew distribution across the die.

Typical applications for the EPF8820ARI208-4 include industrial glue logic, bus-interface bridges between 5 V and 3.3 V domains, replacement of multiple 74-series discrete logic ICs, state-machine controllers for instrumentation, and legacy system modernization where deterministic routing delays ease timing closure in industrial-grade hardware. Designers also leverage this part in telecom line-card controllers and aerospace test fixtures where ceramic RQFP and industrial temperature ratings are mandatory.

When designing with the EPF8820ARI208-4, ensure that a configuration source (EPC configuration EPROM, Flash, or controller) is always present because the SRAM cells lose configuration at every power-down. JTAG signals TCK, TMS, TDI, and TDO must be pulled correctly per IEEE 1149.1, and unused I/O pins should be set to tri-state to minimize supply noise. Ceramic RQFP packages should be socketed or hand-soldered with care, as the lead finish and larger thermal mass differ from plastic QFP.

This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, pinout, and lifecycle notes for the EPF8820ARI208-4 in a single reference - information that the Altera datasheet and distributor listings alone do not aggregate.

Drop-in alternatives for EPF8820ARI208-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF8820ARI208-4 (same form factor and footprint) — differing in Package, Process Technology, Usable Gates, Configuration Method, Speed Grade.

EPF8820ARC208-4

Altera

Process Technology: CMOS, 0.5 um (5 V SRAM-based)

Usable Gates: 8,000 (up to 16,000 with utilization)

Speed Grade: -4