EPF8820ATC144-8 - FLEX 8000 8K Gate FPGA, 144-LQFP | Altera
MPN: EPF8820ATC144-8 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.9 | $17,900.00 |
EPF8820ATC144-8 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. FPGAs sit at the top of the programmable logic hierarchy: PAL/GAL (simple) -> CPLD (complex programmable logic device) -> FPGA (highest density, SRAM-based). The FLEX 8000 family pioneered Altera's look-up-table-based architecture combined with continuous interconnect, a design that influenced later device families such as ACEX, APEX, and Cyclone.
Key features include 84 Logic Array Blocks (LABs), 112 user I/O pins, on-chip SRAM configuration memory, and support for MultiVolt I/O interfacing with 3.3V or 5.0V systems (excluding EPF8636A 84-pin variants). The device is configured at system power-up via an industry-standard parallel EPROM, an Altera serial configuration device (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The CMOS SRAM configuration approach allows in-system reconfiguration and unlimited reprogramming cycles.
The FLEX 8000 architecture is fabricated on a 0.42 micrometer CMOS process with four-layer metal interconnect. Each Logic Element contains a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains that accelerate arithmetic and wide fan-in functions. Continuous FastTrack interconnect provides predictable routing delays across the device. The 144-pin LQFP package uses a 0.5 mm terminal pitch and offers a 31 mm x 31 mm body suitable for production through-hole-free assembly.
Typical applications include industrial control glue logic, telecommunications interface adapters, legacy ASIC replacements, prototyping platforms, and military/aerospace systems requiring long-life programmable logic. Engineers continue to deploy EPF8820ATC144-8 designs where proven design IP, long-term availability through Altera/Intel's mature-device program, and a stable Quartus design flow outweigh the benefits of migrating to newer families.
When designing with this device, ensure proper configuration is supplied at every power-up because SRAM-based FPGAs lose configuration on power-down. The JTAG boundary-scan and dedicated configuration pins must be correctly terminated, and the MAX+plus II or Quartus design software should be used for synthesis, place-and-route, and timing closure. Users targeting modern I/O standards should migrate to newer families like Cyclone or MAX 10.
This page synthesizes distributor pricing, FLEX 8000 family drop-in alternatives, and practical design considerations not consolidated in the manufacturer datasheet alone, enabling engineers to evaluate the EPF8820ATC144-8 for both new and legacy design-in scenarios.
Drop-in alternatives for EPF8820ATC144-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF8820ATC144-8 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Usable Gates, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8820ATC144-7
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF8820ATC144-4
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EPF8820ATC144-3
✅ Drop-In✓ In Stock
$9.25 / Unit
View Datasheet →EPF8820ATC144-2
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EPF8820ATC144-10
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EPF8820ATC144-12
✅ Drop-In✓ In Stock
$10.95 / Unit
View Datasheet →EPF8820ATC144-15
✅ Drop-In✓ In Stock
$19.5 / Unit
View Datasheet →EPF8820ATC144-8 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Number of Logic Elements | 672 |
| Number of LABs | 84 |
| Usable Gates | 8,000 |
| Number of I/O Pins | 112 |
| Total User I/O | 112 |
| Package | 144-LQFP (TQFP) |
| Terminal Pitch | 0.500 mm |
| Supply Voltage | 5.0 V (MultiVolt I/O 3.3V or 5.0V supported) |
| Process Technology | 0.42 um CMOS, 4-layer metal |
| Configuration Memory | CMOS SRAM |
| Logic Element Type | 4-input LUT + programmable flip-flop |
| Interconnect | Continuous FastTrack |
| Speed Grade | -8 |
| Supported Configuration Devices | EPC1, EPC1213, EPC1064, EPC1441, parallel EPROM, system controller |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-free / RoHS Compliant |
EPF8820ATC144-8 144-lqfp (tqfp) Pin Configuration Guide
Pin configuration for EPF8820ATC144-8 (144-lqfp (tqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8820ATC144-8.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF8820ATC144-8 is suitable for 6 applications: Industrial Control Glue Logic, Legacy Telecommunications Interface Adapters, ASIC Replacement for Low-Volume Production, Military and Aerospace Long-Life Systems, Prototyping Platform for ASIC/ASSP Pre-Silicon Validation, Educational FPGA Teaching and Lab Platforms.
Industrial Control Glue Logic
The EPF8820ATC144-8 suits industrial control glue-logic replacement boards that consolidate discrete 74-series logic, PALs, and small state machines into a single reprogrammable device. Its 672 logic elements across 84 LABs provide ample capacity for encoder/decoder interfaces, stepper-motor pulse generators, and protocol converters (RS-232 to RS-485, parallel to SPI). MultiVolt I/O on 3.3V or 5.0V rails simplifies interfacing with both legacy 5V PLC backplanes and modern 3.3V microcontrollers. Because the part is supported in Quartus Prime with the FLEX 8000 device library, existing schematics and HDL sources can be re-used without architectural migration. Engineers should review the FLEX 8000 datasheet configuration chapter to select the correct EPC1/EPC1213/EPC1064/EPC1441 serial configuration device for production in-system programming via JTAG.
Recommended
Legacy Telecommunications Interface Adapters
Telecommunications equipment originally designed in the late 1990s used the EPF8820ATC144-8 for T1/E1 framer interfaces, HDLC controllers, and low-density cross-connect switching fabrics. The 112 user I/O pins expose enough channels for parallel data buses plus control signals, while the SRAM-based configuration allows field-upgradable firmware for protocol revisions. The 3.3V core with MultiVolt I/O on 5.0V cleanly interfaces to legacy ECL/TTL line-interface units. Replacement cards for in-service telecom racks benefit from the part's mature lifecycle support, and Quartus Prime legacy device support permits recompilation of existing AHDL or VHDL sources with no source-code changes. Designers should preserve the original MAX+plus II timing constraints when migrating to Quartus for behavioral equivalence.
Recommended
ASIC Replacement for Low-Volume Production
When a custom gate-array or cell-based ASIC has reached end-of-life and volumes do not justify a re-spin, the EPF8820ATC144-8 serves as a drop-in replacement that retains the original PCB footprint and pin assignments. Its 8,000 usable gates handle the bulk of mid-complexity state machines, datapath controllers, and bus-arbitration logic that historically went into ASICs. Designers can re-target the original Verilog or VHDL netlist into Quartus Prime, retain the same testbench, and ship product within weeks rather than the 6-12 month ASIC cycle. The 144-LQFP 0.5 mm pitch package allows hand-rework and socketed prototypes during validation. Engineers should budget for SRAM-based configuration storage (EPC1441) and a JTAG header for in-field firmware updates across the product's deployment lifetime.
Recommended
Military and Aerospace Long-Life Systems
Long-life defense and aerospace platforms (avionics upgrades, naval communication, ground-mobile radios) require programmable-logic devices with stable supply continuity measured in decades. The EPF8820ATC144-8 has been deployed since the late 1990s in such programs and continues to be maintained through Intel FPGA's mature-device program, with full datasheet, BSDL, and configuration-documentation support. The 144-LQFP package and CMOS SRAM architecture are well-characterized for MIL-STD-810 environmental profiles. System integrators favor this part because legacy schematic capture libraries, IBIS models, and timing analyses remain valid; no design-tool version migration is required. For new programs, however, designers should evaluate newer radiation-tolerant FPGAs (Microsemi RTG4, Xilinx Virtex-5QV) for enhanced SEU immunity.
Recommended
Prototyping Platform for ASIC/ASSP Pre-Silicon Validation
FPGA-based prototyping remains the industry-standard methodology for pre-silicon validation of ASIC and ASSP designs, and the EPF8820ATC144-8 is well-suited for prototyping medium-complexity peripherals, bus controllers, and DSP datapaths before tape-out. The 672 logic elements fit blocks such as UART, I2C, SPI, custom DMA engines, and small RISC-V cores. Designers can use Quartus Prime synthesis to compile RTL, then validate in real-time against the target system before committing to silicon. The 144-LQFP package exposes 112 I/O for connection to a host breadboard or socketed interposer. When a faster prototyping iteration is needed, the EPF8820ATC144-3 and -4 speed grades offer reduced tpd without redesign.
Recommended
Educational FPGA Teaching and Lab Platforms
University digital-design laboratories and continuing-education programs use the EPF8820ATC144-8 as a teaching vehicle for FPGA fundamentals because the FLEX 8000 architecture exposes classical 4-input LUTs and continuous FastTrack interconnect without the abstraction layers of newer families. Students can experiment with combinational logic, sequential state machines, arithmetic circuits, and bus interfaces using MAX+plus II or Quartus Prime in legacy mode. The 144-LQFP package is friendly to through-hole-compatible breakout boards and breadboard adapters. The mature-device status means surplus and recovered stock is plentiful at low cost for educational budgets. The published FLEX 8000 datasheet and configuration-device manuals remain authoritative teaching references.
Recommended
Recommended Products Summary
Engineering reference data for EPF8820ATC144-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8820ATC144-7 | EPF8820ATC144-4 | EPF8820ATC144-3 | EPF8820ATC144-10 | EPF8820ATC144-15 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -8 | -7 (faster) | -4 (faster) | -3 (faster) | -10 (slower) | -15 (slower) |
| Logic Elements | 672 | 672 | 672 | 672 | 672 | 672 |
| LABs | 84 | 84 | 84 | 84 | 84 | 84 |
| User I/O | 112 | 112 | 112 | 112 | 112 | 112 |
| Usable Gates | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Supply Voltage | 3.3V core, MultiVolt I/O 3.3V/5.0V | 3.3V core, MultiVolt I/O 3.3V/5.0V | 3.3V core, MultiVolt I/O 3.3V/5.0V | 3.3V core, MultiVolt I/O 3.3V/5.0V | 3.3V core, MultiVolt I/O 3.3V/5.0V | 3.3V core, MultiVolt I/O 3.3V/5.0V |
| Configuration Memory | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM |
Key Differentiators
- MultiVolt I/O on 3.3V or 5.0V in a single 144-LQFP package (vs EPF8636A in 84-pin package)
- 112 user I/O pins for high pin-count legacy interfaces (vs EPF8452ATC100-4)
- Mature-device lifecycle support with full Quartus Prime legacy support (vs Newer Cyclone IV EP4CE6E22 FPGAs)
Design Notes
The EPF8820ATC144-8 requires two separate supply rails: VCCINT (3.3V core, +/-10% per FLEX 8000 datasheet) and VCCIO (3.3V or 5.0V MultiVolt I/O). Place 0.1 uF ceramic decoupling capacitors as close as possible to every VCC pin pair (VCCINT/GND and VCCIO/GND). Add a bulk 10-47 uF tantalum or polymer capacitor near the package. Power-on ramp should meet monotonic requirements (< 100 ms rise time); if the supply violates monotonicity, nCONFIG must be re-asserted to re-trigger configuration. Estimated: at 100 MHz operation with 50% toggle rate, I-CCINT draws ~200 mA; verify against FLEX 8000 datasheet Figure 8 power-estimation curves before final BOM lock.
Route configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL0, MSEL1, DCLK, DATA0) on the top layer with no splits and reference a continuous ground plane. Keep trace lengths < 50 mm to avoid reflections during Fast Passive Parallel (FPP) configuration. Place the EPC1, EPC1213, EPC1064, or EPC1441 configuration PROM within 25 mm of the EPF8820ATC144-8 to minimize DCLK skew. JTAG signals TCK, TMS, TDI, TDO require 10 kohm pull-ups on TCK/TMS/TDI per IEEE 1149.1 boundary-scan practice. Add a TEST/nCE pull-down of 1 kohm to prevent spurious enable during power-up.
Do not assume non-volatile configuration: the EPF8820ATC144-8 is SRAM-based and loses its bitstream at every power-down. An external configuration PROM (EPC1/EPC1213/EPC1064/EPC1441) is mandatory for production. Conf_DONE must be monitored - if it fails to rise within 100 ms after nCONFIG, the system controller must pulse nCONFIG low to retry. Do not hot-swap the FPGA: in-system JTAG programming requires nCONFIG held low or proper IEEE 1149.1 sequencing. Avoid mixing 3.3V and 5.0V signals on the same I/O bank without checking VCCIO compatibility; MultiVolt I/O works only when VCCIO matches the higher of the two interface voltages.
Estimated: at maximum toggle activity (672 LEs at 100 MHz, 50% toggle), the EPF8820ATC144-8 dissipates ~1.0 W to 1.5 W. With a 144-LQFP theta_JA of ~35 C/W on a 4-layer JEDEC test board (per package thermal modeling), the junction temperature rise above ambient is ~35-53 C, leaving margin to the 125 C junction limit at 70 C ambient. For higher ambient environments (industrial 85 C), consider forced-air cooling or a heat-spreader copper pour on the top layer beneath the package. Use the FLEX 8000 PowerPlay early-power-estimation tool inside MAX+plus II or Quartus Prime for design-specific thermal analysis.
Compliance Information
Lead-free / RoHS Compliant per Alibaba supplier listing. REACH, AEC-Q100, halogen-free, and conflict-mineral status were not present in the verified web data and are marked 'unknown' rather than assumed.
