EPM3512AFC256-7N - MAX 3000A CPLD, 512 Macrocells, 208 I/O | Altera
MPN: EPM3512AFC256-7N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $86 | $860.00 |
| 100 | $76.5 | $7,650.00 |
| 500 | $68.25 | $34,125.00 |
| 1,000 | $61 | $61,000.00 |
EPM3512AFC256-7N Overview
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a central interconnect matrix, providing fast deterministic propagation delays, predictable timing, and instant-on behavior from on-chip EEPROM. CPLDs sit between simple SPLDs/GALs and large SRAM-based FPGAs in the programmable logic taxonomy: SPLD < CPLD < FPGA. The MAX 3000A family uses 3.3V core supply with multi-voltage VCCIO support for mixed 3.3V/2.5V I/O interfacing.
Key features include in-system programmability compliant with IEEE Std. 1532 (concurrent ISP across vendors), a 116.3 MHz internal fMAX, 5V-tolerant I/O pins, JTAG boundary-scan test support, and programmable power-saving modes per macrocell. The 256-pin FBGA (1.0 mm pitch, FineLine BGA) package provides dense I/O with controlled-impedance signal paths suitable for high-speed glue-logic applications.
The EPM3512AFC256-7N is built on a 0.30 micrometer CMOS EEPROM process with a 4-wire JTAG interface and a MultiVolt I/O architecture. Its deterministic timing model allows software tools (Quartus II / MAX+PLUS II) to compute exact worst-case fMAX before fabrication, eliminating timing closure iterations common with SRAM FPGAs.
Typical applications include bus interface bridging, address decoding and glue logic, peripheral I/O expansion, state-machine controllers, and system-level reset/sequencing blocks in telecom, industrial, and consumer products. The 208 user I/Os make it especially useful where many parallel control signals must be aggregated without requiring an FPGA.
Designers should use the Quartus II (legacy) or MAX+PLUS II toolchain to compile designs. A 1.0 mm-pitch FBGA requires careful PCB layout with microvia or via-in-pad technology; an external JTAG header (TCK, TMS, TDI, TDO, plus optional TRST) is required for ISP. Decouple each VCC and VCCIO pin with a 0.1 uF ceramic capacitor placed within 3 mm of the pin.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives drawn from the same MAX 3000A family, and practical design notes not found in the manufacturer datasheet, giving an engineer a single decision-ready reference for sourcing EPM3512AFC256-7N.
Drop-in alternatives for EPM3512AFC256-7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM3512AFC256-7N (same form factor and footprint) β differing in Package, Programming Interface, Speed Grade, In-System Programmability, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM3512AFC256-7
β Drop-Inβ In Stock
$58.4 / Unit
View Datasheet βEPM3512AFC256-10N
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View Datasheet βEPM3512AFC256-10
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$17.5 / Unit
View Datasheet βEPM3512AFC256-5C
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View Datasheet βEPM3512AFC256-3N
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View Datasheet βEPM3512AFC256-2N
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$25.8 / Unit
View Datasheet βEPM3512AFC256-7N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Product Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| User I/Os | 208 |
| Logic Blocks | 16 (32 macrocells each) |
| Propagation Delay (tPD) | 7.5 ns |
| Maximum Internal Frequency (fMAX) | 116.3 MHz |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 2.5 V |
| 5V Tolerant I/O | Yes |
| In-System Programmability | IEEE Std. 1532 compliant |
| Programming Interface | JTAG (IEEE 1149.1) |
| Process Technology | CMOS EEPROM, 0.30 um |
| Package | 256-pin FineLine BGA (FBGA-256), 1.0 mm pitch |
| Operating Temperature | 0 C to 70 C (commercial) |
| Mounting Type | Surface Mount |
EPM3512AFC256-7N 256-pin fineline bga (fbga-256), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPM3512AFC256-7N (256-pin fineline bga (fbga-256), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512AFC256-7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM3512AFC256-7N is suitable for 7 applications: Bus Interface Bridging and Address Decoding, Industrial Control and Factory Automation Glue Logic, Peripheral I/O Expansion for Embedded Microcontrollers, State Machine Controllers for Telecom and Datacom, Legacy Board Repair and Obsolescence Maintenance, Power Sequencing and System Reset Generation, Test and Measurement Equipment Front-End Logic.
Bus Interface Bridging and Address Decoding
The EPM3512AFC256-7N's 512 macrocells and 208 user I/Os are well suited for bridging between legacy and modern buses (ISA/PCI to local-bus glue, asynchronous SRAM to microcontroller, etc.) and for centralized address decoding in systems with many peripheral selects. Its deterministic 7.5 ns pin-to-pin propagation delay provides tight chip-select timing without timing closure iterations typical of FPGAs. Use it where the design is mostly combinational decode plus a few state machines, with 3.3V core and 2.5V/3.3V VCCIO banks allowing direct interface to mixed-voltage peripherals without external level shifters.
Recommended
Industrial Control and Factory Automation Glue Logic
In industrial control cabinets, the EPM3512AFC256-7N aggregates many 24V-to-3.3V opto-isolated control signals and re-drives them to motor drivers, PLCs, and HMIs. The 208 I/Os allow direct parallel connection to dozens of isolated inputs/outputs without external muxing, while 5V-tolerant I/Os simplify interfacing to legacy 5V sensors. Deterministic timing enables reliable PLC scan-time behavior, and JTAG ISP lets field engineers reprogram the device without removing it from the panel via a JTAG header on the front door.
Recommended
Peripheral I/O Expansion for Embedded Microcontrollers
The EPM3512AFC256-7N is ideal for expanding the limited I/O count of small microcontrollers (e.g., 80C51, MSP430, Cortex-M0) where designers need dozens of PWM outputs, GPIOs, or chip selects. Its 512 macrocells can host multiple UART/SPI/I2C controllers, custom timers, and watchdog logic, freeing the MCU to focus on application code. The 3.3V core matches modern MCUs, while 2.5V VCCIO banks allow connection to lower-voltage peripherals. JTAG ISP allows field firmware updates via a simple 4-wire header.
Recommended
State Machine Controllers for Telecom and Datacom
Telecom and datacom line cards frequently require deterministic hardware state machines for protocol sequencing (e.g., HDLC framing, T1/E1 line-card glue, SERDES initialization). The EPM3512AFC256-7N's 7.5 ns propagation delay and 116.3 MHz fMAX are well matched to 8.192 MHz / 16.384 MHz backplane clocks, while the 512 macrocells can host multiple independent state machines in a single device. EEPROM-based non-volatile storage ensures instant-on behavior without external boot flash.
Recommended
Legacy Board Repair and Obsolescence Maintenance
Many long-lifecycle industrial, medical, and aerospace boards originally built around the EPM3512AFC256-7N are still in field service. Because the part is obsolete (NRND), repair depots must keep an inventory of direct drop-in replacements. The EPM3512AFC256-10N, EPM3512AFC256-7, and other speed-grade variants in the same 256-ball FBGA package serve as repair substitutes, allowing a depot to consolidate orders across speed bins and reduce stock-out risk on a single MPN.
Recommended
Power Sequencing and System Reset Generation
The EPM3512AFC256-7N can host complex multi-rail power-up/power-down sequencers and watchdog reset logic for systems with 8-16 voltage rails (CPU core, GPU, memory, I/O, PLLs). Its non-volatile EEPROM allows the sequencing order to be stored on-chip, eliminating external boot PROMs. The 208 I/Os are sufficient to drive dozens of enable and PG (power-good) signals directly, and the JTAG port lets field engineers re-tune sequencing without re-spinning firmware.
Recommended
Test and Measurement Equipment Front-End Logic
Test instruments (oscilloscopes, logic analyzers, function generators) often require custom front-end routing and trigger logic that does not fit neatly into an FPGA's SRAM-based fabric. The EPM3512AFC256-7N's deterministic timing, EEPROM-based non-volatility, and 208 I/Os allow it to host a trigger matrix, channel multiplexer, and status indicator logic that boots instantly on power-up. Its 3.3V core and MultiVolt I/O support direct connection to modern ADC/DAC front ends.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFC256-7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-7 | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFC256-5C | EPM3512AFC256-3N |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (1.0 mm pitch) | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same | FBGA-256 (1.0 mm pitch) - same |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Speed Grade (tPD) | 7.5 ns (-7) | 7.5 ns (-7) | 10 ns (-10) | 10 ns (-10) | 5 ns (-5) | 3.5 ns (-3) |
| Lead-Free (Pb-Free) | Yes (N suffix) | No (SnPb finish) | Yes (N suffix) | No (SnPb finish) | Yes (per datasheet) | Yes (N suffix) |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/Os | 208 | 208 | 208 | 208 | 208 | 208 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) | 0 C to 70 C (commercial) |
| Lifecycle Status | Obsolete (NRND) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible drop-in coverage across the entire -3 / -5 / -7 / -10 speed-grade matrix (vs EPM3512AFC256-7)
- Higher logic density (512 macrocells) than smaller MAX 3000A family members (vs EPM3256AFC256-10)
- MultiVolt I/O with 2.5V/3.3V VCCIO banks (vs Xilinx XC95288XL-7BG256)
- IEEE 1532 ISP compliance (vs Legacy MAX 3000 (non-A) variants)
Design Notes
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, which demands either microvia (uVia) PCB technology or via-in-pad construction for reliable fan-out. Standard 0.1 mm laser-drilled microvias are recommended; tented or plugged microvias are required for fine-line BGA escape routing. Place at least one 0.1 uF X7R ceramic decoupling capacitor within 3 mm of every VCC and VCCIO pin, plus bulk 10 uF tantalum or polymer capacitors on each supply rail. A continuous ground plane on the layer immediately beneath the BGA is essential to control return paths and reduce simultaneous switching noise (SSN).
Do not confuse the 256-ball FBGA (1.0 mm pitch) with the larger 1.27 mm pitch BGA variants; land-pattern mistakes will cause shorts or opens. The VCCIO pins are banked, and each bank must be tied to either 3.3V or 2.5V; mixing voltages across banks without proper decoupling leads to CMOS input latch-up. The JTAG TRST pin (if present on the package variant) must be tied low through a 10 kohm resistor or driven by the programmer, otherwise the TAP controller may power up in an undefined state.
The FBGA-256 package has a theta-JA of approximately 18 C/W with a standard JEDEC test board, but in practice real-world designs with limited inner-plane copper can show 25 to 35 C/W. The MAX 3000A family's CMOS EEPROM process draws very low quiescent current (typically under 50 mA at 3.3V core), so thermal management is rarely a problem unless the design forces all 208 outputs to switch at the maximum 116.3 MHz simultaneously. Estimated: at 50% toggle rate and 50 pF load per pin, dynamic current adds ~10 mA, raising total to ~60 mA, well within the package's thermal envelope.
Place the JTAG header (TCK, TMS, TDI, TDO, plus optional TRST and VCC sense) on the board edge for in-system programming access without disassembling the chassis. Keep JTAG traces under 100 mm total length and series-terminate TCK with a 22 ohm resistor if the trace exceeds 50 mm. Quiescent VCCIO noise below 50 mVpp is required for reliable JTAG ISP; add a ferrite bead or pi-filter if the VCCIO rail is shared with high-di/dt loads. Reserve four general-purpose I/O pins for future ISP-triggered user-code update if field upgrades are anticipated.
Compliance Information
RoHS compliance unknown because the part was originally released by Altera before RoHS documentation standardization. The 'N' suffix indicates Pb-free terminal finish, which suggests RoHS-compliant solder-joint compatibility, but a RoHS declaration document is not confirmed in the Verified Web Data.
