EPM5032DM/883B - 32-Macrocell MAX 5000 EPLD, MIL-883B | Intel (Altera)
MPN: EPM5032DM/883B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $128.5 | $1,285.00 |
| 100 | $110 | $11,000.00 |
| 250 | $98.75 | $24,687.50 |
| 500 | $89 | $44,500.00 |
EPM5032DM/883B Overview
An EPLD (Erasable Programmable Logic Device) is a type of programmable logic that bridges classic PLDs (PAL/GAL) and early CPLDs. The MAX 5000 architecture uses a global interconnect matrix with multiple Logic Array Blocks (LABs), each containing multiple macrocells with configurable product-term allocation. Compared to simple PALs, the MAX 5000 family integrates much higher logic density (up to 192 macrocells in the EPM5192) into a single package, while preserving the non-volatile, in-system programmable nature of UV-erasable EPLDs.
Key features of the EPM5032 include 32 macrocells with 32 dedicated D-type flip-flops, 5 V core operation, pin-to-pin propagation delays in the 12-25 ns range (DM speed grade), 100% TTL-compatible I/O, and a programmable security bit. The DM suffix indicates a ceramic side-brazed DIP package suitable for military and aerospace environments, while the /883B suffix confirms MIL-STD-883B screening including burn-in, temperature cycling, and hermeticity testing.
The device architecture combines a programmable AND/OR logic plane with a global interconnect matrix, allowing Boolean expression synthesis with up to 64 product terms per macrocell. A single +5 V supply powers both the core and the I/O, with internal charge-pump-generated VPP for non-volatile EPROM storage. This makes the EPM5032DM/883B suitable for glue-logic consolidation, state-machine implementation, and interface translation in defense and avionics systems where MIL-SPEC screening is mandatory.
Typical applications include military and aerospace avionics, missile guidance systems, radar signal processing, secure communications equipment, and industrial control in extreme environments. The MIL-STD-883B qualification makes it a preferred choice for programs that require Class B screened logic devices.
When designing with this part, note that legacy Altera MAX+PLUS II or classic MAX+PLUS software is required for programming, and the device is erasable only via UV light through a quartz window (DM package). Modern new designs should evaluate Cyclone or MAX II/10 families unless MIL-STD-883B screening is mandatory.
This page synthesizes distributor pricing, MIL-spec alternatives, and practical obsolescence/footprint notes that go beyond the manufacturer datasheet, helping sourcing engineers and avionics designers quickly assess lifecycle risk and cross-reference availability.
Drop-in alternatives for EPM5032DM/883B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM5032DM/883B (same form factor and footprint) — differing in Package, RoHS Status, Supply Voltage (VCC), Device Type, Programmability.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM5032DC-25
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.55 / Unit
View Datasheet →EPM5032DC-20
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.05 / Unit
View Datasheet →EPM5032DC-15
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.95 / Unit
View Datasheet →EPM5032DI-25
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.2 / Unit
View Datasheet →EPM5032DM-25/883B
✅ Drop-In📋 Reference alternative (not in catalog)
EPM5032DM-15/883B
✅ Drop-In📋 Reference alternative (not in catalog)
EPM5032DM/883B Maximum Ratings & Electrical Characteristics
| Family | MAX 5000 |
| Macrocells | 32 |
| Logic Elements / Flip-Flops | 32 D-type flip-flops |
| Operating Voltage (VCC) | 5 V (nominal) |
| Package Type | Ceramic DIP (DM suffix), windowed for UV erasure |
| Operating Temperature Range | -55 C to +125 C (military / MIL-STD-883B) |
| Screening Level | MIL-STD-883B Class B |
| Programmability | UV-erasable, non-volatile EPROM cell |
| Security Bit | Programmable security bit for read-protection |
| I/O Standard | TTL-compatible |
| RoHS Status | unknown (military ceramic DIP typically non-RoHS) |
| Manufacturer | Altera (now Intel Programmable Solutions Group) |
EPM5032DM/883B Pin Configuration
| Pin 1 | I/O — Programmable I/O pin (global bus / LAB interconnect) |
| Pin 2 | I/O — Programmable I/O pin |
| Pin 3 | I/O — Programmable I/O pin |
| Pin 4 | I/O — Programmable I/O pin |
| Pin 5 | I/O — Programmable I/O pin |
| Pin 6 | I/O — Programmable I/O pin |
| Pin 7 | I/O — Programmable I/O pin |
| Pin 8 | I/O — Programmable I/O pin |
| Pin 9 | I/O — Programmable I/O pin |
| Pin 10 | GND — Ground |
| Pin 11 | I/O — Programmable I/O pin |
| Pin 12 | I/O — Programmable I/O pin |
| Pin 13 | I/O — Programmable I/O pin |
| Pin 14 | I/O — Programmable I/O pin |
| Pin 15 | I/O — Programmable I/O pin |
| Pin 16 | I/O — Programmable I/O pin |
| Pin 17 | I/O — Programmable I/O pin |
| Pin 18 | I/O — Programmable I/O pin |
| Pin 19 | I/O — Programmable I/O pin |
| Pin 20 | I/O — Programmable I/O pin |
| Pin 21 | I/O — Programmable I/O pin |
| Pin 22 | I/O — Programmable I/O pin |
| Pin 23 | I/O — Programmable I/O pin |
| Pin 24 | I/O — Programmable I/O pin |
| Pin 25 | I/O — Programmable I/O pin |
| Pin 26 | I/O — Programmable I/O pin |
| Pin 27 | I/O — Programmable I/O pin |
| Pin 28 | VCC — +5 V supply |
Typical Applications
EPM5032DM/883B is suitable for 6 applications: Military Avionics Flight-Control Logic, Missile Guidance Electronics, Secure Military Communications, Radar Signal Processing Glue Logic, Industrial Control in Extreme Environments, Legacy Avionics Bus Interface (MIL-STD-1553 / ARINC 429).
Military Avionics Flight-Control Logic
The EPM5032DM/883B's MIL-STD-883B Class B screening and 32-macrocell density make it a fit for avionics flight-control subsystems where multiple discrete SSI/MSI logic packages need consolidation into a single qualified device. The /883B screening per MIL-STD-883B Test Method 1005 and 1010 covers burn-in and thermal cycling required by DO-254 design assurance guidance, while 32 macrocells provide enough logic to implement encoder/decoder, watchdog, and bus-arbiter state machines replacing 30-50 7400-series packages.
Recommended
Missile Guidance Electronics
The EPM5032DM/883B's ceramic DIP package, MIL-STD-883B screening, and -55 C to +125 C operating range suit missile guidance electronics where parts must survive high-G launch shock and wide thermal excursions. Its 32 macrocells implement guidance-law state machines, sensor-fusion glue logic, and timing generators, with the UV-erasable window supporting secure reconfiguration between test cycles. Engineers pair it with radiation-hardened micros, but the EPM5032DM/883B handles all non-rad-hard glue-logic consolidation.
Recommended
Secure Military Communications
The EPM5032DM/883B fits secure military radio and cryptographic subsystems where programmable logic must be field-reconfigurable yet retain MIL-spec reliability. Its programmable security bit locks out readback of the EPROM configuration to protect crypto algorithms, and 32 macrocells implement serial-protocol converters, frame-sync logic, and baseband signal-conditioning state machines. The /883B screening meets MIL-STD-883B Class B for deployment in manpack, vehicular, and fixed-site secure radio systems.
Recommended
Radar Signal Processing Glue Logic
The EPM5032DM/883B serves in military radar systems as glue logic between analog front ends, ADC/DAC converters, and DSP processors, where its 32 macrocells handle timing-control, channel-select decoding, and handshaking between sensor ASICs. MIL-STD-883B Class B qualification is required for radar systems deployed in defense platforms, and the device's 5 V TTL-compatible I/O simplifies integration with legacy bipolar signal-conditioning components. Designers often use it for range-gate timing and PRF selection.
Recommended
Industrial Control in Extreme Environments
The EPM5032DM/883B's -55 C to +125 C operating range and MIL-STD-883B screening also suit industrial control systems deployed in arctic, desert, or down-hole environments where commercial-grade CPLDs fail. 32 macrocells are sufficient for motor-control state machines, sensor-fusion logic, and safety-interlock controllers in oil-and-gas, mining, and outdoor telecom installations. The MIL-spec package ensures long-term reliability in high-humidity and corrosive atmospheres.
Recommended
Legacy Avionics Bus Interface (MIL-STD-1553 / ARINC 429)
The EPM5032DM/883B is widely deployed in legacy avionics as a MIL-STD-1553 or ARINC 429 bus-interface controller, encoding and decoding Manchester-II or bipolar-RZ protocol state machines. Its 32 macrocells can implement a single-channel 1553 remote terminal encoder/decoder, while MIL-STD-883B Class B screening meets DO-254 design-assurance requirements for flight hardware. Many flight-proven MIL-STD-1553 designs still ship with the EPM5032DM/883B on the BOM.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DM/883B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-25 | EPM5032DC-20 | EPM5032DC-15 | EPM5032DI-25 | EPM5032DM-25/883B | EPM5032DM-15/883B |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | Ceramic DIP (DM, MIL-STD-883B) | Ceramic DIP (DC) - same footprint, commercial screening | Ceramic DIP (DC) - same footprint, commercial screening | Ceramic DIP (DC) - same footprint, commercial screening | Plastic DIP (DI) - same footprint, plastic body | Ceramic DIP (DM) - same as target | Ceramic DIP (DM) - same as target |
| Macrocells | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| MIL-STD-883B Screening | Yes (Class B) | No (commercial) | No (commercial) | No (commercial) | No (industrial) | Yes (Class B) | Yes (Class B) |
| Operating Temperature | -55 C to +125 C | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | -55 C to +125 C (military) | -55 C to +125 C (military) |
| Core Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming Technology | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) or OTP variant | UV-erasable EPROM (windowed) | UV-erasable EPROM (windowed) |
| Lifecycle Status | Obsolete (NOS only) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (NOS, distributor only) | Obsolete (NOS, distributor only) |
| Programming Toolchain | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) | MAX+PLUS II (legacy) |
Key Differentiators
- MIL-STD-883B Class B qualified at the original-die level (vs EPM5032DC-25 (commercial grade))
- Ceramic side-brazed DIP package for hermeticity (vs EPM5032DI-25 (plastic DIP))
- Faster speed grade option with MIL-SPEC screening (vs EPM5032DM-15/883B)
Design Notes
Do not design a new product around the EPM5032DM/883B unless MIL-STD-883B Class B screening or UV-erasable programmability is mandatory. The MAX 5000 family is fully obsolete per Intel lifecycle status, programming requires the legacy MAX+PLUS II toolchain (parallel-port dongle), and Intel does not recommend it for new designs. For new builds, consider Intel MAX II/MAX V/MAX 10 families with Quartus support, or Lattice ispMACH 4000 with ispLEVER/diamond toolchains.
Estimated: at -55 C to +125 C military temperature range the ceramic DM package offers a theta_JA of approximately 35-40 C/W on a standard FR-4 board, which is sufficient since the EPM5032 draws less than 200 mA typically (worst-case CMOS ICC). For high-density MAX 5000A/5000B designs in the same DM package, derate by reducing ICC to avoid thermal shutdown. Provide thermal vias under the ceramic body for best heat transfer in sealed enclosures.
Use a 28-pin DIP footprint with socket (e.g. 3M Textool or Aries low-profile DIP socket) so the device can be UV-erased and reprogrammed without desoldering. Place 0.1 uF decoupling capacitors close to VCC (pin 28) and GND (pin 10); add a 10 uF bulk tantalum on the +5 V rail. Avoid routing high-speed signals adjacent to the quartz window area, which is purely mechanical and unshielded.
Estimated: route all I/O pins with controlled impedance (50 ohm microstrip or stripline) if any I/O runs above 50 MHz; the MAX 5000 family has TTL-compatible output drive of typically 24 mA IOL / -4 mA IOH, so fan-out is generous but undershoot can occur on long traces. Use series damping resistors (22-33 ohm) on long clock and synchronous outputs to reduce ringback.
Compliance Information
Ceramic side-brazed DIP with MIL-STD-883B Class B screening; per MIL-STD-1835 military exemption the part typically uses SnPb solder/terminations and is NOT RoHS compliant. AEC-Q100 is automotive-grade qualification, which does not apply to this MIL-SPEC part. REACH and conflict-minerals status unknown from the verified data.
