EPM5032DC-20 - 600-Gate, 32-Macrocell MAX 5000 CPLD DIP-20 | Intel
MPN: EPM5032DC-20 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.05 | $8.05 |
| 10 | $7.2 | $72.00 |
| 100 | $6.4 | $640.00 |
| 500 | $5.65 | $2,825.00 |
| 1,000 | $5.05 | $5,050.00 |
EPM5032DC-20 Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs (PALs/GALs) and higher-density FPGAs in the programmable logic hierarchy (CPLD -> PLD -> programmable logic -> digital IC). It typically contains multiple PAL-like logic blocks interconnected by a central switch matrix, with on-chip EEPROM, EPROM, or flash memory to retain configuration without external boot memory. Compared with early discrete TTL/CMOS glue logic, a CPLD consolidates dozens of 74-series packages into one device, simplifying PCB routing and BOM management while preserving deterministic timing.
Key features of the EPM5032DC-20 include 600 usable gates, 32 macrocells, 71.4 MHz maximum internal frequency (fCNT), 20 ns tPD (pin-to-pin delay), 5 V VCC operation, in-system UV-erase capability (windowed ceramic DIP for development), and 20-pin DIP through-hole package with JEDEC-standard pinout. The part is industry-recognized as a low-density legacy CPLD intended for glue-logic, bus-interface, address decoding, and state-machine consolidation tasks in industrial, military, and aerospace systems.
Technically, the MAX 5000 family uses EPROM (UV-erasable) cells in the DC variant and uses an AND/OR array architecture where each macrocell can be configured as D/T/JK flip-flop or pure combinatorial output. The -20 speed grade corresponds to 20 ns pin-to-pin delay and 71.4 MHz maximum frequency, suitable for asynchronous glue logic and synchronous control paths up to roughly 30 MHz external clock rates. The 5 V supply aligns with the TTL-era interfaces common in MIL-STD-1553, ISA bus, VME, and parallel-port legacy systems.
Typical applications include bus-address decoding in VME/ISA/PCI bridge logic, glue-logic consolidation in industrial controllers, state-machine replacement in legacy military and aerospace systems, address mapping in microcontroller-based designs, I/O expansion for 8-bit and 16-bit microprocessors, and pin-compatible replacement of older 24-pin PAL/GAL devices.
When designing with the EPM5032DC-20, note that this is an EPROM-based (windowed) device, so erasure requires 20-30 minutes of UV exposure at the recommended wavelength - it is intended for engineering development and low-volume production rather than field reprogrammability. Designers targeting modern 3.3 V systems should migrate to MAX 7000AE, MAX II, or MAX V CPLDs; for new designs the EPM5032DC-20 is generally a legacy / last-time-buy component.
Drop-in alternatives for EPM5032DC-20 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM5032DC-20 (same form factor and footprint) — differing in Package, Device Type, Operating Temperature, Supply Voltage (VCC), Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM5032DC-15
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPM5032DC-2
✅ Drop-In✓ In Stock
$8.75 / Unit
View Datasheet →EPM5032DC
✅ Drop-In✓ In Stock
$10.4 / Unit
View Datasheet →EPM5016DC-20
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.5 / Unit
View Datasheet →EPM5016DC-15
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10.75 / Unit
View Datasheet →EPM5032DC-20 Maximum Ratings & Electrical Characteristics
| Product Family | MAX 5000 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Programmable Technology | UV-Erasable / OTP EPROM |
| Usable Gates | 600 |
| Macrocells | 32 |
| Maximum Frequency (fCNT) | 71.4 MHz |
| Pin-to-Pin Delay (tPD) | 20 ns |
| Speed Grade | -20 |
| Supply Voltage (VCC) | 5 V |
| Package | 20-pin DIP (Windowed Ceramic, 0.3" wide) |
| Mounting Type | Through-Hole |
| Logic Blocks | 4 Logic Array Blocks (LABs) |
| RoHS Status | Compliant (per IC-Components listing) |
| Manufacturer | Altera (now Intel Programmable Solutions Group) |
| Programming Method | Altera MAX+PLUS II / Quartus (legacy support) |
EPM5032DC-20 Pin Configuration
| Pin 1 | I/O — General-purpose I/O / macrocell input-output |
| Pin 2 | I/O — General-purpose I/O / macrocell input-output |
| Pin 3 | I/O — General-purpose I/O / macrocell input-output |
| Pin 4 | I/O — General-purpose I/O / macrocell input-output |
| Pin 5 | I/O — General-purpose I/O / macrocell input-output |
| Pin 6 | I/O — General-purpose I/O / macrocell input-output |
| Pin 7 | I/O — General-purpose I/O / macrocell input-output |
| Pin 8 | I/O — General-purpose I/O / macrocell input-output |
| Pin 9 | I/O — General-purpose I/O / macrocell input-output |
| Pin 10 | GND — Ground (0 V) |
| Pin 11 | I/O — General-purpose I/O / macrocell input-output |
| Pin 12 | I/O — General-purpose I/O / macrocell input-output |
| Pin 13 | I/O — General-purpose I/O / macrocell input-output |
| Pin 14 | I/O — General-purpose I/O / macrocell input-output |
| Pin 15 | I/O — General-purpose I/O / macrocell input-output |
| Pin 16 | I/O — General-purpose I/O / macrocell input-output |
| Pin 17 | I/O — General-purpose I/O / macrocell input-output |
| Pin 18 | I/O — General-purpose I/O / macrocell input-output |
| Pin 19 | I/O — General-purpose I/O / macrocell input-output |
| Pin 20 | VCC — +5 V supply voltage |
Typical Applications
EPM5032DC-20 is suitable for 6 applications: VME / ISA Bus Address Decoding, Glue-Logic Consolidation in Industrial Controllers, Legacy Military / Aerospace State-Machine Replacement, Microprocessor Address / I/O Expansion, Pin-Compatible Replacement for Older 24-pin PAL/GAL Devices, Field-Repair / Legacy Board Sustainment.
VME / ISA Bus Address Decoding
The EPM5032DC-20 fits VME and ISA bus address-decoding applications because its 32 macrocells are sufficient to decode multiple address and chip-select lines, while the 20 ns pin-to-pin delay keeps decode latency under one bus cycle. Its 5 V TTL-compatible I/O interfaces directly to 74LS245 / 74FCT logic without level shifters, and the UV-erasable windowed DIP package supports engineering rework and field repairs of legacy VME boards. Compared with discrete 74-series decoders, the EPM5032DC-20 consolidates 4-6 decoder packages into one device, reducing PCB area by ~60%. Designers should place the device near the bus buffers and keep decode paths under 20 ns to meet bus timing.
Recommended
Glue-Logic Consolidation in Industrial Controllers
The EPM5032DC-20 is well-suited for consolidating 74-series glue logic in industrial controllers (PLC backplanes, motor-control interface boards, instrumentation front-ends) because its 600 usable gates and 32 macrocells replace roughly 8-12 discrete SSI/MSI packages. The 71.4 MHz internal frequency handles synchronous control paths up to 30 MHz external clock, and the 20-pin DIP footprint simplifies through-hole PCB assembly for legacy industrial designs. Compared with a GAL22V10 / PALCE22V10, the EPM5032DC-20 provides 50% more macrocells, a richer AND/OR array, and EPROM-based programming. Designers should allocate I/O pins for board-level test points and route the JTAG-equivalent programming signals to a header.
Recommended
Legacy Military / Aerospace State-Machine Replacement
The EPM5032DC-20 targets legacy military and aerospace state-machine replacement because it replaces 5-10 74LS / 54LS flip-flop packages with one programmable device, and the windowed ceramic DIP package supports MIL-STD-883B screening flows used on legacy avionics boards. Its 20 ns tPD handles asynchronous control signals typical in flight-control and weapons-system interfaces, and 5 V operation matches MIL-STD-1553 and ARINC 429 transceiver rails. Compared with modern flash-based CPLDs, the EPM5032DC-20 is preferred only when exact bit-for-bit legacy compatibility is required; otherwise MAX II with on-chip flash is recommended. Designers should validate programming files against the original ABEL/CUPL source.
Recommended
Microprocessor Address / I/O Expansion
The EPM5032DC-20 fits 8-bit and 16-bit microprocessor address and I/O expansion applications (8051, 68HC11, Z80, 8086 designs) because its 32 macrocells decode up to 32 chip-selects and generate chip-enable signals for memory and peripheral banks. The 5 V I/O directly interfaces to the microprocessor bus without external buffers, and the 20 ns tPD satisfies the address-to-chip-enable timing of 10-25 MHz MPUs. Compared with discrete 74LS138 / 74LS139 decoders, the EPM5032DC-20 implements a complete 8-bank or 16-bank decoder with strobe and qualification logic in one chip. Designers should use Quartus II legacy mode (or MAX+PLUS II) to import ABEL/CUPL designs.
Recommended
Pin-Compatible Replacement for Older 24-pin PAL/GAL Devices
The EPM5032DC-20 fits pin-compatible replacement of legacy 24-pin PAL/GAL devices (PALCE24V10, GAL6001, etc.) where 32 macrocells and 600 gates are sufficient for the target logic equation. Its 20-pin DIP footprint is mechanically smaller than 24-pin alternatives, allowing it to fit on legacy boards with 20-pin socket footprints. The 5 V operation and TTL I/O match original PAL/GAL signaling, and the 20 ns tPD is comparable to 25 ns PAL devices. Compared with modern Lattice ispMACH 4000ZE, the EPM5032DC-20 preserves EPROM-based programming compatible with original development flows. Designers should verify that the target board's 20-pin socket pinout matches the EPM5032DC-20 datasheet pinout before substitution.
Recommended
Field-Repair / Legacy Board Sustainment
The EPM5032DC-20 is the go-to part for field-repair and legacy board sustainment because Intel PSG no longer manufactures MAX 5000 but maintains pin-compatible stocks via brokers for legacy board refurbishment programs. Its UV-erasable windowed package allows engineering to recover original programming, and the 20 ns tPD preserves the original timing budget of 1980s/1990s designs. Compared with modern CPLDs that require PCB rework for new packages, the EPM5032DC-20 enables drop-in socket replacement of failed MAX 5000 devices without layout changes. Designers should stock EPM5032DC-15 and EPM5032DC-20 as alternates because broker availability fluctuates.
Recommended
Recommended Products Summary
Engineering reference data for EPM5032DC-20 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM5032DC-15 | EPM5032DC-2 | EPM5032DC | EPM5016DC-20 | EPM5016DC-15 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 20-pin DIP (Windowed Ceramic) | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP (Windowed Ceramic) - same | 20-pin DIP - same | 20-pin DIP - same |
| Usable Gates | 600 | 600 | 600 | 600 | 400 | 400 |
| Macrocells | 32 | 32 | 32 | 32 | 16 | 16 |
| Pin-to-Pin Delay (tPD) | 20 ns | 15 ns (faster) | 25 ns (slower) | default (typically 25 ns) | 20 ns (same) | 15 ns (faster) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programming Technology | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM | UV-Erasable / OTP EPROM |
Key Differentiators
- Higher logic density vs EPM5016 family (vs EPM5016DC-20)
- Balanced speed grade for 5 V TTL systems (vs EPM5032DC-15)
- Pin-compatible with all MAX 5000 20-pin DIP variants (vs EPM5032DC-2)
Design Notes
The EPM5032DC-20 in the windowed ceramic DIP package has typical CMOS power dissipation of 100-300 mW at 5 V VCC, well within the package's thermal envelope (theta_JA approximately 50-60 C/W for ceramic DIP-20). Estimated: at 200 mW dissipation the junction temperature rise is ~10-12 C above ambient, so no heatsink is required. However, designers should provide at least 1 oz copper pour on power and ground planes and maintain ambient temperature below 70 C for reliable long-term operation in legacy industrial enclosures.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to the VCC pin (pin 20), with the ground return to pin 10 (GND) via a short, wide trace. Add a 10 uF tantalum or electrolytic bulk capacitor on the 5 V rail within 1 inch of the device for supply noise suppression. Estimated: a 0.1 uF + 10 uF decoupling pair reduces VCC ripple by >20 dB in the 1-100 MHz band, which is critical because MAX 5000 I/O switching can inject 50-100 mV of noise onto the supply without proper bypass.
Do not attempt to reprogram the EPM5032DC-20 in-circuit - the MAX 5000 EPROM cells require UV erasure (253.7 nm wavelength, 20-30 minutes at 12-15 mW/cm^2 intensity) through the quartz window before reprogramming, and OTP (one-time-programmable) variants cannot be erased at all. Always verify programming success on a programmer (e.g. Altera PL-MAXPLUS-PUB or BP Microsystems) before socket installation. Note: this part is obsolete and Intel PSG does not provide new factory programming files - existing JEDEC/BitStream files must be retained by the customer.
For VME and ISA bus designs, keep all I/O traces to the EPM5032DC-20 under 50 mm (2 inches) to minimize propagation delay and ringing. Match trace impedance to 50 ohms for clocked I/O, and avoid stubs by using daisy-chain routing for multi-drop signals. Estimated: each inch of improperly-terminated trace adds ~1-2 ns of delay, which can exceed the 20 ns tPD budget on -20 grade parts and cause decode glitches. Use a ground plane under all I/O traces for return-path integrity.
Compliance Information
RoHS compliance per IC-Components listing for EPM5032DC-20. Reach, halogen-free, and lead-free status not confirmed in the verified web data and flagged as unknown. Part is obsolete - REACH SVHC declaration may no longer be maintained by Intel PSG.
