EPM570ZM144C6N - MAX II CPLD, 570 LEs, 144-MBGA | Intel (Altera)
MPN: EPM570ZM144C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.76 | $10.76 |
| 10 | $10.3 | $103.00 |
| 100 | $9.45 | $945.00 |
| 500 | $8.6 | $4,300.00 |
| 1,000 | $7.85 | $7,850.00 |
EPM570ZM144C6N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the instant-on, deterministic timing of classic PAL/PLA architectures with modern flash-based configuration memory. Within the broader semiconductor taxonomy, a CPLD sits alongside FPGAs in the programmable logic category, but differs by offering coarse-grained logic blocks, predictable pin-to-pin propagation, and zero configuration load time. MAX II devices occupy the low-power, low-cost end of this hierarchy, often serving as glue logic, bus bridges, and power-up state machines rather than high-density data processing. The EPM570 sits at the upper-middle density tier within the MAX II family, above EPM240 and EPM1270's smaller siblings.
Key features include a 1.8 V core voltage with MultiVolt I/O support from 1.5 V to 3.3 V, an 8 Kbit user flash memory (UFM) block for non-logic data storage, in-system programmability via JTAG, and a maximum internal operating frequency quoted at 184.1 MHz with typical propagation delays in the low nanosecond range. The device supports vertical migration within the same package across the MAX II family (EPM240/EPM570/EPM1270 share footprints in several FineLine BGA variants), allowing density upgrades without PCB redesign.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-up sequencing logic in multi-rail systems, LCD and display interface glue logic, address decoding for microcontrollers lacking address latches, and as a low-cost alternative to small FPGAs in volume consumer products. The on-chip UFM block enables designers to store serial numbers, calibration constants, or boot parameters without an external EEPROM.
When designing with this part, ensure the JTAG chain is correctly terminated and that the MultiVolt I/O bank supplies match the connected logic levels. Decoupling follows standard CPLD practice: 0.1 µF ceramic per supply pin plus a single 10 µF bulk capacitor near the package. The non-volatile flash configuration means the device becomes active within microseconds of POR, simplifying system boot sequencing compared to SRAM-based FPGAs.
This page synthesizes distributor pricing, drop-in alternative MPNs within the MAX II family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EPM570ZM144C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM570ZM144C6N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, User I/Os, Programming Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240ZM144C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM1270ZM144C6N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM570ZM100C6N
✅ Drop-In✓ In Stock
$14.98 / Unit
View Datasheet →EPM570T144C5N
✅ Drop-In✓ In Stock
$9.35 / Unit
View Datasheet →EPM570GT144C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$14.2 / Unit
View Datasheet →5M570ZE64C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM570ZM144C6N Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Family | MAX II |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements | 570 LEs (440 equivalent macrocells) |
| User I/Os | 76 (in 144-MBGA package) |
| Maximum Internal Frequency | 184.1 MHz |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) |
| Process Technology | 0.18 µm 6-layer-metal flash |
| User Flash Memory (UFM) | 8 Kbits |
| Programmability | In-system programmable via JTAG (ISP) |
| Configuration Memory | Non-volatile flash |
| Package | 144-ball Micro FBGA (ZM144), 6 x 6 mm, 0.5 mm pitch |
| Operating Temperature | -40 °C to +125 °C (industrial) |
| RoHS Status | Lead-free compliant |
EPM570ZM144C6N Pin Configuration
| Pin A1 | I/O — User I/O bank 1 |
| Pin A2 | I/O — User I/O bank 1 |
| Pin A3 | I/O — User I/O bank 1 |
| Pin A4 | I/O — User I/O bank 1 |
| Pin A5 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Pin A6 | I/O — User I/O bank 1 |
| Pin B1 | I/O — User I/O bank 1 |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O bank 1 |
| Pin B4 | I/O — User I/O bank 1 |
| Pin B5 | GND — Ground |
| Pin B6 | I/O — User I/O bank 1 |
| Pin C1 | VCCINT — Core supply 1.8 V |
| Pin C2 | I/O — User I/O bank 2 |
| Pin C3 | I/O — User I/O bank 2 |
| Pin C4 | VCCIO2 — I/O bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Pin C5 | I/O — User I/O bank 2 |
| Pin C6 | VCCINT — Core supply 1.8 V |
| Pin D1 | TDI — JTAG Test Data In |
| Pin D2 | I/O — User I/O bank 2 |
| Pin D3 | TCK — JTAG Test Clock |
| Pin D4 | I/O — User I/O bank 2 |
| Pin D5 | TMS — JTAG Test Mode Select |
| Pin D6 | TDO — JTAG Test Data Out |
| Pin E1 | I/O — User I/O bank 3 |
| Pin E2 | VCCIO3 — I/O bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Pin E3 | I/O — User I/O bank 3 |
| Pin E4 | GND — Ground |
| Pin E5 | I/O — User I/O bank 3 |
| Pin E6 | I/O — User I/O bank 3 |
| Pin F1 | GND — Ground |
| Pin F2 | I/O — User I/O bank 3 |
| Pin F3 | I/O — User I/O bank 3 |
| Pin F4 | I/O — User I/O bank 3 |
| Pin F5 | VCCIO4 — I/O bank 4 supply (1.5/1.8/2.5/3.3 V) |
| Pin F6 | I/O — User I/O bank 4 |
Typical Applications
EPM570ZM144C6N is suitable for 7 applications: I/O Expansion and Bus Bridging, Power-Up Sequencing Logic, Display and LCD Interface Glue Logic, Address Decoding and Memory Interfacing, Industrial Control and Automation, Communication Protocol Bridging, Low-Cost FPGA Replacement for Glue Logic.
I/O Expansion and Bus Bridging
The EPM570ZM144C6N's 570 logic elements, 76 user I/Os, and instant-on non-volatile configuration make it ideal for I/O expansion and bus-bridging in industrial controllers. With MultiVolt I/O supporting 1.5 V to 3.3 V, the CPLD can interface a 3.3 V ARM Cortex MCU to legacy 5 V peripherals (with external level shifters) or to multiple 1.8 V sensors on the same board. The 184 MHz internal frequency and low-nanosecond propagation delays enable reliable bus-bridge timing for SPI, I2C, UART, and parallel interfaces. Engineers frequently use the MAX II CPLD to add missing peripheral channels or extend GPIOs without migrating to a higher-cost MCU.
Recommended
Power-Up Sequencing Logic
The EPM570ZM144C6N's non-volatile flash configuration means the device is active within microseconds of POR, simplifying power-up sequencing in multi-rail systems. Its 76 I/Os and 1.8 V core with MultiVolt I/O allow it to drive enable signals to multiple DC-DC converters and LDOs in a controlled sequence. The on-chip 8 Kbit UFM block can store rail timing parameters and fault thresholds, eliminating the need for an external EEPROM. Deterministic pin-to-pin timing (~7 ns tPD) ensures precise rail-to-rail sequencing for processors that require specific power-up order.
Recommended
Display and LCD Interface Glue Logic
The EPM570ZM144C6N is widely used as glue logic between microcontrollers and TFT LCD panels that require specific timing waveforms, backlight PWM control, and touch-screen interface coordination. With 570 logic elements, designers can implement custom timing generators, RGB-to-LVDS bridges (simple variants), and touch I2C arbitration logic. The MultiVolt I/O banks allow direct connection to 1.8 V, 2.5 V, or 3.3 V displays without external level shifters. The MAX II CPLD's deterministic timing is critical for pixel clock generation where jitter would degrade image quality.
Recommended
Address Decoding and Memory Interfacing
The EPM570ZM144C6N excels at address decoding for systems where the microcontroller lacks built-in chip-select logic or external memory banking. With 570 LEs, it can decode up to 30 address lines with custom chip-select mapping for SRAM, NOR flash, peripherals, and memory-mapped I/O. The 184 MHz internal frequency supports high-speed memory interfaces including asynchronous SRAM, NOR flash, and legacy 8051-style bus expansion. The deterministic pin-to-pin timing (~7 ns) ensures clean chip-select edges without glitches that could cause bus contention.
Recommended
Industrial Control and Automation
The EPM570ZM144C6N's industrial temperature range (-40 °C to +125 °C), 76 user I/Os, and reliable non-volatile configuration make it well-suited for industrial PLCs, motor controllers, and sensor aggregation modules. The MAX II CPLD can aggregate multiple SPI or I2C sensors, perform real-time pulse counting, and generate PWM signals for motor drivers. The on-chip UFM can store calibration constants, serial numbers, and fault logs in the field, simplifying firmware updates and traceability. Long-term Altera/Intel part availability supports 10-15 year industrial product life cycles.
Recommended
Communication Protocol Bridging
The EPM570ZM144C6N is used as a protocol bridge between incompatible serial interfaces - SPI to UART, I2C to SPI, UART to parallel, and similar protocol conversions. With 570 LEs, the CPLD can implement a full-duplex UART with hardware FIFOs, a multi-master I2C controller, or a custom SPI slave with DMA-style handshaking. The MultiVolt I/O allows direct interfacing between 1.8 V and 3.3 V domains without external level shifters. The non-volatile flash configuration eliminates firmware boot delays, ensuring immediate protocol availability at power-on.
Recommended
Low-Cost FPGA Replacement for Glue Logic
The EPM570ZM144C6N is frequently selected over small FPGAs for glue-logic roles under 600 LEs because it eliminates the external boot PROM, configuration flash, and FPGA toolchain complexity. The MAX II CPLD costs less per unit than an equivalent-density SRAM FPGA when factoring in total BOM (no boot memory required), and its instant-on behavior simplifies system bring-up. Designers use it for register-based I/O expansion, signal conditioning, and clock division where FPGA fabric overhead is unjustified. The deterministic timing also helps in safety-critical paths where FPGA routing jitter is unacceptable.
Recommended
Recommended Products Summary
Engineering reference data for EPM570ZM144C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240ZM144C6N | EPM1270ZM144C6N | EPM570ZM100C6N | EPM570T144C5N | 5M570ZE64C5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 144-ball Micro FBGA (ZM144) | 144-ball Micro FBGA (ZM144) - same | 144-ball Micro FBGA (ZM144) - same | 100-ball Micro FBGA (ZM100) - smaller | 144-pin TQFP (T144) - different | EQFP-64 - different |
| Logic Elements | 570 LEs | 240 LEs (-58%) | 1270 LEs (+123%) | 570 LEs (same) | 570 LEs (same) | 570 LEs (same) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| MultiVolt I/O Support | 1.5-3.3 V | 1.5-3.3 V | 1.5-3.3 V | 1.5-3.3 V | 1.5-3.3 V | 1.2-3.3 V |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
Key Differentiators
- Non-volatile flash configuration eliminates boot PROM (vs EPM1270ZM144C6N)
- MultiVolt I/O supports four voltage standards on one chip (vs EPM240ZM144C6N)
- Pin-compatible density migration within MAX II family (vs EPM570T144C5N)
Design Notes
The EPM570ZM144C6N requires two distinct supply rails: VCCINT = 1.8 V for the core logic and VCCIOx (one per I/O bank) at 1.5/1.8/2.5/3.3 V for I/O. Decoupling follows standard CPLD practice - place one 0.1 µF ceramic capacitor on each VCCINT and VCCIO pin within 100 mils of the package, plus a single 10 µF bulk capacitor per supply rail. MultiVolt I/O banks can be powered independently, allowing mixed-voltage interfacing on the same chip.
The 144-ball Micro FBGA (ZM144) package uses a 6 mm × 6 mm body with 0.5 mm ball pitch. PCB design requires laser-drilled micro vias or via-in-pad technology for signal escape routing; 4-layer stackup with continuous GND plane beneath the BGA is recommended for signal integrity. Thermal performance is limited because most balls are signal I/O rather than thermal pads - use the GND balls as a thermal conduction path with a copper pour stitched to the inner GND plane.
Three common pitfalls: (1) exceeding 3.3 V on any VCCIO bank will damage the I/O cells even if VCCINT is within spec; (2) forgetting to tie unused I/O pins to a defined state (input tri-stated pins can float and cause excess supply current); (3) JTAG chain conflicts - if the CPLD shares the JTAG bus with other devices, ensure proper TMS/TCK pull-up resistors and TDO-to-TDI daisy-chaining order in the chain.
Route JTAG signals (TCK, TMS, TDI, TDO) with 4-mil traces and ground shielding to minimize noise coupling during in-system programming. Place a JTAG header (10-pin or 14-pin Altera-standard) within 2 inches of the package to support ByteBlaster or USB-Blaster download cables. Add 10 kΩ pull-ups on TCK and TMS to keep the JTAG state machine in reset during normal operation.
Compliance Information
Lead-free Micro FBGA packaging per Altera product page. RoHS/REACH compliant. Industrial temperature grade -40 to +125 C. AEC-Q100 not specifically qualified.
