H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
MPN: H5TC4G63AFR-PBI ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
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View Datasheet →H5TC4G63AFR-PBI Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Organization | 256M x 16 |
| Total Memory Size | 4 Gb |
| Data Rate | DDR3-1600 (PC3L-12800) |
| Supply Voltage | 1.35 V |
| Number of Banks | 8 |
| Burst Length | 8 (BL8) |
| CAS Latency | Programmable |
| On-Die Termination (ODT) | Yes |
| Refresh Period | 7.8 us at 85°C |
| Operating Temperature Range | -40°C to +95°C |
| Package | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| Mounting Type | Surface Mount |
| Number of Terminals | 96 |
| RoHS Status | Compliant |
H5TC4G63AFR-PBI Pin Configuration
| Pin A1 | VDD — Power supply for core logic |
| Pin A2 | VSS — Ground |
| Pin A3 | DQ0 — Data input/output bit 0 |
| Pin A4 | DQ1 — Data input/output bit 1 |
| Pin A5 | VDDQ — Power supply for I/O |
| Pin A6 | VSSQ — Ground for I/O |
| Pin A7 | DQ2 — Data input/output bit 2 |
| Pin A8 | DQ3 — Data input/output bit 3 |
| Pin A9 | VDD — Power supply for core logic |
| Pin A10 | VSS — Ground |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ4 — Data input/output bit 4 |
| Pin B3 | DQ5 — Data input/output bit 5 |
| Pin B4 | VDDQ — Power supply for I/O |
| Pin B5 | VSSQ — Ground for I/O |
| Pin B6 | DQ6 — Data input/output bit 6 |
| Pin B7 | DQ7 — Data input/output bit 7 |
| Pin B8 | VDD — Power supply for core logic |
| Pin B9 | VSS — Ground |
| Pin B10 | CK — Clock input |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63AFR-PBI is suitable for 6 applications: Network Routers and Switches, Industrial Automation Controllers, Embedded Computing Modules, Test and Measurement Equipment, Networking Appliances, Medical Monitoring Devices.
Network Routers and Switches
The H5TC4G63AFR-PBI provides 4Gb DDR3L memory for packet buffering and routing tables in network equipment. Its 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the 96-ball FBGA package saves board space. With DDR3-1600 speed, it handles high-throughput packet processing without bottlenecking the CPU.
Recommended
Industrial Automation Controllers
In industrial PLCs and robotics controllers, the H5TC4G63AFR-PBI offers reliable memory for real-time control algorithms and data logging. Its -40°C to +95°C range withstands factory floor temperatures, and the low 1.35V supply reduces heat generation in sealed enclosures. The 256Mx16 organization provides ample storage for program code and sensor data. The device's on-die termination improves signal integrity in noisy industrial environments.
Recommended
Embedded Computing Modules
The H5TC4G63AFR-PBI is ideal for single-board computers and embedded modules that require a balance of performance and power efficiency. Its 4Gb capacity supports Linux-based applications, and the 1.35V operation extends battery life in portable systems. The 96-ball FBGA package is compatible with standard manufacturing processes, and the industrial temperature grade allows deployment in outdoor kiosks and digital signage. The DDR3-1600 speed ensures smooth multitasking.
Recommended
Test and Measurement Equipment
In oscilloscopes, spectrum analyzers, and data acquisition systems, the H5TC4G63AFR-PBI provides high-speed memory for waveform capture and processing. Its DDR3-1600 data rate enables fast sampling, and the 16-bit interface matches ADC output widths. The industrial temperature range ensures accuracy in lab and field environments. The low 1.35V supply reduces noise coupling into analog front-ends, preserving measurement integrity.
Recommended
Networking Appliances
The H5TC4G63AFR-PBI is used in firewalls, VPN concentrators, and load balancers for session state storage and packet buffering. Its 4Gb density supports large connection tables, and the 1.35V operation reduces power in dense chassis. The industrial temperature range is suitable for server rooms with variable cooling. The device's burst length of 8 optimizes throughput for network traffic patterns.
Recommended
Medical Monitoring Devices
In patient monitors and diagnostic equipment, the H5TC4G63AFR-PBI provides reliable memory for real-time data processing and storage. Its industrial temperature range ensures operation in clinical environments, and the low 1.35V supply is suitable for battery-powered portable devices. The 4Gb capacity supports high-resolution waveform storage, and the 16-bit interface simplifies integration with medical-grade MCUs. The device's low power consumption extends battery life.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63AFR-PBI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63AFR-PBR | H5TC4G63CFR-PBA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) | 96-ball FBGA (same) | 96-ball FBGA (same) | 96-ball FBGA (same) |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | DDR3-1600 | DDR3-1600 | DDR3-1600 | DDR3-1600 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Temperature Range | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| Lifecycle Status | Obsolete | Obsolete | Active | Active |
Key Differentiators
- Industrial temperature grade (vs H5TC4G63AFR-PBR)
- Low voltage operation (vs MT41K256M16HA-125)
- Pin compatibility with newer Hynix parts (vs H5TC4G63CFR-PBA)
Design Notes
The H5TC4G63AFR-PBI requires a stable 1.35V supply for VDD and VDDQ. Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each power pin to decouple high-frequency noise. A bulk capacitor (10uF) should be placed near the memory device to handle transient currents during refresh and burst operations. Ensure the power supply can deliver peak current without voltage droop.
Follow the PCB layout guidelines in the SK Hynix datasheet to minimize signal integrity issues. Route DQ, DQS, and address/command lines with matched lengths to maintain timing. Use ground planes beneath the memory to reduce noise. Place termination resistors for ODT as recommended. Keep the clock traces short and shielded to avoid crosstalk.
The industrial temperature range (-40°C to +95°C) allows operation in harsh environments, but proper thermal management is still required. Ensure adequate airflow or heatsinking if the device is placed near other heat-generating components. The 96-ball FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values and design accordingly.
Compliance Information
RoHS compliant per Kynix product page. Not AEC-Q100 qualified. Other compliance data not available in provided sources.
