K4RBH086VB-BCQK - DDR5 16Gb 4800Mbps DRAM | Samsung
MPN: K4RBH086VB-BCQK ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K4RBH086VB-BCQK — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K4RAH086VB-BCQK
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View Datasheet →K4RBH086VB-BCQK Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16 Gb |
| Organization | 2G x 8 |
| Data Rate | 4800 Mbps |
| Supply Voltage (VDD) | 1.1 V |
| Interface | DDR5 (CA bus, ODECC) |
| On-die ECC | Yes |
| Package | FBGA-82 |
| Mounting Type | Surface Mount |
| Power Supply Rails | VDD/VDDQ 1.1 V (PMIC on module) |
| RoHS Status | Compliant |
K4RBH086VB-BCQK fbga-82 Pin Configuration Guide
Complete pinout information for K4RBH086VB-BCQK (fbga-82 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4RBH086VB-BCQK.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4RBH086VB-BCQK is suitable for 6 applications: Enterprise Server RDIMM, AI Accelerator Host Memory, High-Performance Desktop and Workstation UDIMM, Embedded Computing Modules, Networking and Telecom Equipment, Test, Measurement, and Validation Systems.
Enterprise Server RDIMM
The K4RBH086VB-BCQK fits enterprise server RDIMM designs because its x8 organization, on-die ECC, and 4800 Mbps data rate match the JEDEC DDR5 registered-DIMM architecture used by current Xeon and EPYC platforms. On-module PMIC 5000 regulation delivers the 1.1V VDD/VDDQ rails, offloading the host board. The two independent 8Gb half-pages with separate command/address buses let the memory controller keep one half active while the other refreshes, improving effective bandwidth. Designers should verify RCD compatibility and SPD programming for the specific speed bin when populating 16Gb-based 32GB/64GB RDIMMs.
Recommended
AI Accelerator Host Memory
AI training and inference cards require dense, bandwidth-efficient host memory, and the K4RBH086VB-BCQK delivers 4800 Mbps per pin with on-die ECC for data integrity during long-running workloads. Its 1.1V operation reduces power per transferred bit by roughly 30% versus DDR4, helping stay within accelerator card thermal budgets. Placed as x8 components on ECC-protected memory boards beside GPU/ASIC accelerators, the die's bank-group architecture sustains the random access patterns typical of embedding lookups and KV caches. Ensure the memory controller's training firmware supports this Samsung speed bin for reliable link initialization.
Recommended
High-Performance Desktop and Workstation UDIMM
For workstation UDIMMs, the K4RBH086VB-BCQK provides 16Gb per die, enabling high-capacity modules without doubling component count. DDR5-4800 matches the JEDEC standard bin for mainstream desktop platforms, and on-die ECC improves reliability even on unbuffered modules. The FBGA-82 package keeps interconnects short for signal integrity at multi-gigabit rates. Memory vendors should pair the die with a DDR5 SPD hub and PMIC 5000 and validate CL training across the CPU IMC population, since DDR5 introduces per-module power management and two-subsystem addressing that differ from DDR4 design practice.
Recommended
Embedded Computing Modules
Industrial embedded computers, edge gateways, and COM Express modules use soldered-down DDR5 such as the K4RBH086VB-BCQK for vibration immunity and long product lifecycles. The 16Gb density supports memory-hungry edge-inference workloads, while 4800 Mbps operation matches industrial SoC memory-controller limits. Soldering the FBGA-82 die directly removes socket reliability concerns and allows tight length-matched fly-by routing on the carrier PCB. Designers should specify the industrial-temperature suffix variant (such as K4RAH086VB-BIQK) when ambient conditions exceed the commercial range, and qualify reflow profiles per Samsung's MSL guidance.
Recommended
Networking and Telecom Equipment
Switches, routers, and 5G baseband cards use 16Gb DDR5 dies like the K4RBH086VB-BCQK for packet buffering, flow tables, and control-plane memory. The 4800 Mbps rate provides the headroom needed to feed network processors at line rate, and on-die ECC protects against soft errors in always-on telecom environments. The 1.1V core reduces power density in convection-cooled chassis. Layout teams must maintain fly-by CA topology and matched DQ/DQS lengths on the line card; using the same Samsung DDR5 family across line-card SKUs simplifies SPD/firmware training tables and second-source qualification.
Recommended
Test, Measurement, and Validation Systems
Memory ATE fixtures and signal-integrity benches use K4RBH086VB-BCQK components to characterize DDR5-4800 channels and validate controller training algorithms. The die's DLL-enabled mode operation and published compliance masks for the CA/CS receivers (per Samsung's 16Gb DDR5 specification) make it a reference device for receiver-mask testing. x8 organization supports ECC-injected error-rate studies without a module RCD in the path. Labs should build test boards with reworkable BGA footprints and include provision for probing DQS_vml/DCA signals, since DDR5 training features such as RPMTC and DFE require per-bin characterization data.
Recommended
Recommended Products Summary
Engineering reference data for K4RBH086VB-BCQK — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4RAH086VB-BCQK | K4RAH086VB-BCWM | K4RAH165VB-BCQK |
|---|---|---|---|---|
| Package | FBGA-82 | FBGA-82 - same | FBGA-82 - same | FBGA-82 - same (x16 ballout differs) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | 2G x 8 | 2G x 8 | 2G x 8 | 1G x 16 |
| Data Rate | 4800 Mbps | 4800 Mbps | [DATA_NEEDED] | 4800 Mbps |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| On-die ECC | Yes | Yes | Yes | Yes |
| Temperature Suffix | BC (commercial) | BC (commercial) | BC (commercial) | BC (commercial) |
| Price (qty 1) | RFQ | RFQ | RFQ | RFQ |
Key Differentiators
- Documented DDR5-4800 bin within Samsung's published 16Gb datasheet (vs K4RAH086VB-BCWM)
- On-die ECC without bus overhead (vs DDR4 predecessors (e.g., K4AAG165WM-BCWE))
- Two independent 8Gb half-pages (vs K4RAH165VB-BCQK (x16 variant))
Design Notes
DDR5-4800 fly-by routing is mandatory for CA/CS nets; each die sees staggered command arrival that the controller compensates during training. Keep DQ/DQS length mismatch within the JEDEC DDR5 module spec and reference DQ to a solid VDDQ plane. Per Samsung's 16Gb DDR5 specification, the CA and CS input receivers have defined voltage/timing compliance masks and operate in single-data-rate mode - validate receiver margins with eye scans during bring-up rather than relying on DDR4 design rules.
DDR5 moves regulation onto the module: use a PMIC 5000 to generate the 1.1V VDD/VDDQ rails and manage power-up sequencing per the JEDEC DDR5 specification. Do not reuse DDR4 1.2V power trees. Size the PMIC using Samsung's IDD tables for 4800 Mbps operation rather than estimated currents; soldered-down designs should budget bulk and high-frequency decoupling close to each FBGA-82 die to control rail droop during bank-to-bank bursts.
Verify speed-bin suffix compatibility before substituting family parts: BCQK, BCWM, and BI variants share the FBGA-82 footprint but may differ in CL/timing parameters and temperature range, which affects controller training tables and SPD data. Also note Samsung's datasheet is split between the component specification and a separate Device Operation Datasheet covering common DDR5 features - review both documents before finalizing register settings, and re-run memory training after any die-suffix change in production.
Compliance Information
Samsung semiconductor products are supplied RoHS-compliant and lead-free per Samsung's environmental policy; formal RoHS/REACH/conflict-minerals certificates should be requested with the RFQ as they are revision-dated documents.
