N25Q256A13E12A0F - 256Mb SPI NOR Flash, 108MHz | Micron
MPN: N25Q256A13E12A0F ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for N25Q256A13E12A0F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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N25Q064A13E12A0F
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N25Q128A13ESEA0F
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View Datasheet →N25Q032A13EF4A0F
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View Datasheet →N25Q256A13E12A0F Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash, Serial SPI |
| Density | 256 Mbit (32 MB) |
| Organization | 64M x 4 (Mouser listing); 32M x 8 per FindIC listing - see validation note |
| Supply Voltage | 2.7 V to 3.6 V |
| Max SPI Clock Frequency | 108 MHz |
| I/O Modes | Single, Dual, Quad I/O (Multiple I/O Serial Flash) |
| Technology | SLC (Single-Level Cell) |
| Sector Erase Size | 4 KB |
| Package | 24-ball T-PBGA (6x8 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C |
| Access Time | 8 ns (per FindIC listing) |
| RoHS Status | Compliant |
| Packaging | Tape & Reel (TR suffix) |
N25Q256A13E12A0F 24-ball t-pbga (6x8 mm) Pin Configuration Guide
Complete pinout information for N25Q256A13E12A0F (24-ball t-pbga (6x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for N25Q256A13E12A0F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
N25Q256A13E12A0F is suitable for 6 applications: FPGA Configuration Storage, BIOS/UEFI Boot Firmware Storage, Industrial Networking Line Cards, Automotive-Adjacent Infotainment and Clusters, Embedded Drive and SSD Controller Firmware, IoT Gateways and Smart Industrial Sensors.
FPGA Configuration Storage
The N25Q256A13E12A0F stores FPGA bitstreams for high-density devices, where its 256Mb capacity accommodates multiple configuration images plus partial-reconfiguration partitions. Quad I/O mode at the 108 MHz maximum clock compresses configuration time versus single-I/O SPI, reducing the visible power-on latency of the system. In the circuit, the Flash connects directly to the FPGA's dedicated configuration SPI master through short, length-matched traces; the 24-ball T-PBGA (6x8 mm) footprint allows placement within a few millimeters of the FPGA ball field. Its 4KB sector erase supports fine-grained update of a golden-image region without erasing the active bitstream, improving field-update reliability.
Recommended
BIOS/UEFI Boot Firmware Storage
Embedded x86 and ARM server platforms use serial NOR Flash for BIOS/UEFI code, and the N25Q256A13E12A0F's 32MB capacity fits modern firmware images that include UEFI drivers, option ROMs, and recovery partitions. The 2.7V-3.6V supply integrates directly with the platform's 3.3V rail, and quad I/O at up to 108 MHz speeds POST-time code shadowing into DRAM. SLC technology provides the high endurance needed for frequent BIOS settings rewrites in the 4KB sectors reserved for NVRAM variables. The -40C to +125C rating covers uncontrolled server-room and edge-computing thermal environments where commercial-grade parts would be marginal.
Recommended
Industrial Networking Line Cards
Switch, router, and industrial Ethernet line cards store firmware, MAC/PHY configuration, and logs in serial NOR Flash; the N25Q256A13E12A0F fits this role with 256Mb of SLC storage and a 108 MHz quad-I/O interface for fast boot of management processors. The -40C to +125C operating range satisfies industrial temperature requirements for factory-floor and outdoor telecom cabinets. The 4KB sector erase architecture lets networking firmware maintain a small parameter/log region alongside the main code image without wholesale image erasure, extending useful life. The 24-ball T-PBGA reflow-solderable package withstands industrial assembly and vibration profiles.
Recommended
Automotive-Adjacent Infotainment and Clusters
Digital instrument clusters and infotainment head units require nonvolatile code storage that survives automotive thermal profiles; the N25Q256A13E12A0F's -40C to +125C rating addresses these environments for infotainment-adjacent (non-safety-critical) storage. Its 256Mb SLC capacity holds graphics boot code, fonts, and calibration tables, while quad SPI at 108 MHz supports quick logo-to-display boot times that clusters demand. Designers should confirm the specific qualification level required by their OEM; where AEC-Q100 certification is contractual, the corresponding Micron automotive-qualified variant must be selected instead of this industrial-grade part.
Recommended
Embedded Drive and SSD Controller Firmware
Storage controllers in embedded SSDs and industrial drives keep boot firmware and firmware-update images in external serial NOR Flash. The N25Q256A13E12A0F provides 256Mb, enough for dual-bank firmware schemes enabling safe over-the-air controller updates with rollback. SLC endurance in 4KB sectors supports frequent logging of drive health and wear data. The 2.7V-3.6V supply matches standard 3.3V drive rails, and the small 24-ball T-PBGA (6x8 mm) package fits on dense controller boards where board area is at a premium. Quad I/O shortens controller startup, reducing perceived drive latency at system power-on.
Recommended
IoT Gateways and Smart Industrial Sensors
IoT gateways aggregate sensor data and require reliable local code and certificate storage; the N25Q256A13E12A0F's 32MB SLC array holds the gateway OS bootloader, TLS certificates, and update staging images. The 108 MHz quad-I/O interface accelerates secure-boot verification, and the 4KB sector granularity enables fine-grained management of small certificate and configuration objects without erasing the main image. The -40C to +125C range supports unheated enclosures in smart-factory and outdoor deployments. Its reflow-compatible 24-ball T-PBGA package suits standard automated assembly lines used in volume IoT hardware production.
Recommended
Recommended Products Summary
Engineering reference data for N25Q256A13E12A0F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | N25Q064A13E12A0F | N25Q128A13E12A0F | N25Q128A13ESEA0F | N25Q064A13ESEA0F | N25Q032A13EF4A0F |
|---|---|---|---|---|---|---|
| Package | 24-ball T-PBGA (6x8 mm) | 24-ball T-PBGA (6x8 mm) - same footprint | 24-ball T-PBGA (6x8 mm) - same footprint | N25Q family T-PBGA - verify suffix | N25Q family T-PBGA - verify suffix | N25Q family - verify EF4 package suffix |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 256 Mbit (32 MB) | 64 Mbit (8 MB) | 128 Mbit (16 MB) | 128 Mbit (16 MB) | 64 Mbit (8 MB) | 32 Mbit (4 MB) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Interface / Max Clock | SPI, 108 MHz | SPI Multiple I/O, [DATA_NEEDED] | SPI Multiple I/O, [DATA_NEEDED] | SPI Multiple I/O, [DATA_NEEDED] | SPI Multiple I/O, [DATA_NEEDED] | SPI Multiple I/O, [DATA_NEEDED] |
| Sector Erase Size | 4 KB | 4 KB | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -40C to +125C | -40C to +85C (verify per datasheet) | -40C to +85C (verify per datasheet) | -40C to +85C (verify per datasheet) | -40C to +85C (verify per datasheet) | [DATA_NEEDED] |
| Density Match for 32MB Images | Yes (native) | No - 8 MB only | No - 16 MB only | No - 16 MB only | No - 8 MB only | No - 4 MB only |
Key Differentiators
- 4x the capacity of the same-footprint 64Mb option (vs N25Q064A13E12A0F)
- Extended -40C to +125C operation (vs N25Q064A13E12A0F)
- SLC reliability with 4KB sector granularity (vs N25Q128A13E12A0F)
Design Notes
At the 108 MHz maximum SPI clock, treat the quad-I/O bus (SCK, CS#, DQ0-DQ3) as a moderately fast digital interface: keep traces under ~50 mm where possible, maintain ground reference continuity, and series-terminate the clock if ringing is observed. The 24-ball T-PBGA's short internal bond wires help, but via stubs and connectorized SPI routing can degrade eyes at full speed. If long traces are unavoidable, verify timing margin at 54 MHz as a fallback and confirm the host controller supports the reduced clock without driver changes.
Decouple VCC with at least 100 nF ceramic directly at the ball-side via pair plus a 4.7 uF bulk capacitor per device. Program and erase operations draw current bursts well above the read current; shared 3.3V rails with sensitive analog circuitry may see droop during 4KB sector erase. Confirm exact ICC program/erase figures in the Micron datasheet (not stated in the retrieved listing data) before finalizing rail budgeting, and sequence power so VCC is stable before the first chip-select assertion to avoid undefined command states.
Above 16MB, the full 32MB array requires 4-byte addressing; many legacy SPI host controllers default to 3-byte addressing and silently wrap addresses at 16MB, corrupting images in the upper half. Verify your controller or bootloader enables 4-byte address mode (or uses the appropriate extended-address register commands) before committing the design. Also match the exact temperature-grade suffix when ordering substitutes: variants with different suffix codes may be rated only to +85C even though the footprint is identical.
Compliance Information
RoHS compliance stated on Ampheo distributor listing ('24-ball T-PBGA, RoHS'). REACH, lead-free, halogen-free, and conflict-minerals declarations were not present in the verified data; request certificates from Micron.
