SPC574S60E7 - 32-bit Automotive MCU, 3MB Flash | NXP Semiconductors
MPN: SPC574S60E7 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.9 | $6,450.00 |
| 1,000 | $11.75 | $11,750.00 |
Drop-in alternatives for SPC574S60E7 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
SPC574S60E3
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SPC574S64E3
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SPC574S60E7CE0AR
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SPC574S60E7CE0AY
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SPC574S60E3CE0AR
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SPC574S60E3CE0AY
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SPC574S64E3CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S64E3CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E7CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E7CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E3CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E3CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S64E3CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S64E3CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E7CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E7CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E3CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E3CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S64E3CE0AR
β Drop-Inπ Reference alternative (not in catalog)
SPC574S64E3CE0AY
β Drop-Inπ Reference alternative (not in catalog)
SPC574S60E7 Maximum Ratings & Electrical Characteristics
| Core | e200z4 (Power Architecture) |
| Core Speed | 160 MHz |
| Flash Memory | 3 MB |
| RAM | 256 KB |
| Package | LQFP-144 (EPAD) |
| Operating Temperature | -40Β°C to +125Β°C |
| Supply Voltage (I/O) | 3.3V to 5V |
| Core Voltage | 1.2V |
| AEC-Q100 Grade | Grade 1 |
| Functional Safety | ASIL-B |
| ADC | 12-bit, 32 channels |
| Timer | 16-bit eTPU2 |
| DMA Channels | 32 |
| Communication Interfaces | 3 FlexCAN, 3 LIN, 2 SPI, 1 I2C, 1 Ethernet |
| Process Technology | 55nm automotive-grade |
SPC574S60E7 Pin Configuration
| Pin 1 | VDD β Core power supply (1.2V) |
| Pin 2 | VSS β Ground |
| Pin 3 | VDDIO β I/O power supply (3.3V-5V) |
| Pin 4 | RESET β Reset input (active low) |
| Pin 5 | XTAL β Crystal oscillator input |
| Pin 6 | EXTAL β Crystal oscillator output |
| Pin 7 | CAN0_TX β FlexCAN 0 transmit |
| Pin 8 | CAN0_RX β FlexCAN 0 receive |
| Pin 9 | CAN1_TX β FlexCAN 1 transmit |
| Pin 10 | CAN1_RX β FlexCAN 1 receive |
| Pin 11 | LIN0_TX β LIN 0 transmit |
| Pin 12 | LIN0_RX β LIN 0 receive |
| Pin 13 | SPI0_SCK β SPI 0 clock |
| Pin 14 | SPI0_MOSI β SPI 0 master out slave in |
| Pin 15 | SPI0_MISO β SPI 0 master in slave out |
| Pin 16 | I2C0_SCL β I2C 0 clock |
| Pin 17 | I2C0_SDA β I2C 0 data |
| Pin 18 | ETH_TX β Ethernet transmit |
| Pin 19 | ETH_RX β Ethernet receive |
| Pin 20 | ADC0_IN0 β ADC 0 channel 0 input |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
SPC574S60E7 is suitable for 6 applications: Automotive Body Control Module, Gateway Module, Battery Management System, Smart Junction Box, Motor Control, Airbag Control Unit.
Automotive Body Control Module
The SPC574S60E7 is ideal for automotive body control modules (BCM) due to its robust communication interfaces (FlexCAN, LIN) and high-speed processing. It manages lighting, windows, locks, and other body functions. The MCU's 3 MB flash and 256 KB RAM provide ample storage for complex control algorithms. Its AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The dual-core lockstep configuration enhances safety, making it suitable for safety-critical body functions.
Recommended
Gateway Module
The SPC574S60E7 is well-suited for automotive gateway modules that route data between different vehicle networks. Its multiple FlexCAN, LIN, and Ethernet interfaces enable seamless communication between CAN, LIN, and Ethernet networks. The 160 MHz core speed ensures low-latency data forwarding. The MCU's 3 MB flash allows for storing routing tables and diagnostic data. The integrated DMA controller offloads data transfer tasks, improving overall system efficiency. The device's functional safety features (ASIL-B) ensure reliable gateway operation in safety-critical applications.
Recommended
Battery Management System
The SPC574S60E7 is ideal for battery management systems (BMS) in electric and hybrid vehicles. Its 12-bit ADC with 32 channels enables precise monitoring of battery voltage, current, and temperature. The MCU's robust communication interfaces (FlexCAN, LIN) allow it to communicate with battery cells and the vehicle's central control unit. The 3 MB flash provides ample storage for battery management algorithms and calibration data. The device's functional safety features (ASIL-B) ensure safe operation in critical battery management applications. The wide operating temperature range (-40Β°C to +125Β°C) makes it suitable for under-hood BMS installations.
Recommended
Smart Junction Box
The SPC574S60E7 is well-suited for smart junction boxes that distribute power and control signals in vehicles. Its multiple FlexCAN and LIN interfaces enable communication with various vehicle modules. The MCU's high-speed processing (160 MHz) allows for real-time control of power distribution. The 3 MB flash provides storage for power management algorithms. The device's robust I/O capabilities and 12-bit ADC enable precise monitoring of current and voltage. The AEC-Q100 Grade 1 qualification ensures reliable operation in demanding automotive environments.
Recommended
Motor Control
The SPC574S60E7 is ideal for motor control applications, such as brushless DC (BLDC) motors in automotive systems. Its 16-bit eTPU2 timer provides precise PWM generation for motor control. The 12-bit ADC enables accurate current and voltage sensing. The MCU's high-speed processing (160 MHz) supports complex motor control algorithms. The 3 MB flash provides storage for motor control firmware. The device's functional safety features (ASIL-B) ensure safe operation in motor control applications. The wide operating temperature range makes it suitable for under-hood motor control modules.
Recommended
Airbag Control Unit
The SPC574S60E7 is well-suited for airbag control units (ACU) due to its high reliability and safety features. The dual-core lockstep configuration ensures fault detection and safe operation. The MCU's 3 MB flash provides storage for airbag deployment algorithms. The 12-bit ADC enables precise sensing of crash sensors. The device's functional safety features (ASIL-B) meet the stringent safety requirements for airbag systems. The AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The wide operating temperature range (-40Β°C to +125Β°C) makes it suitable for ACU installations.
Recommended
Recommended Products Summary
Engineering reference data for SPC574S60E7 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC574S60E3 | SPC574S64E3 | SPC574S60E7CE0AR |
|---|---|---|---|---|
| Package | LQFP-144 (EPAD) | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 160 MHz | 140 MHz | 140 MHz | 160 MHz |
| Flash Memory | 3 MB | 1 MB | 1.5 MB | 3 MB |
| RAM | 256 KB | 128 KB | 192 KB | 256 KB |
| ADC Channels | 32 | 32 | 32 | 32 |
| Ethernet | Yes (10/100 Mbps) | No | No | Yes (10/100 Mbps) |
| Functional Safety | ASIL-B | ASIL-B | ASIL-B | ASIL-B |
Key Differentiators
- Higher memory capacity (vs SPC574S60E3)
- Ethernet interface (vs SPC574S60E3)
- Higher core speed (vs SPC574S60E3)
Design Notes
Ensure proper decoupling of the core (1.2V) and I/O (3.3V-5V) power supplies. Place 100nF ceramic capacitors close to each power pin and a 10uF bulk capacitor near the power input. This minimizes voltage ripple and ensures stable operation of the MCU.
Follow the recommended PCB layout for the LQFP-144 package. Use a solid ground plane and route high-speed signals (Ethernet, FlexCAN) with controlled impedance. Keep the exposed pad (EPAD) connected to ground for optimal thermal performance.
Ensure the external crystal or oscillator is connected correctly to the XTAL and EXTAL pins. Use a separate low-power oscillator for the RTC. Avoid exceeding the maximum input voltage on any pin, as this can damage the MCU.
Compliance Information
AEC-Q100 Grade 1 qualified. RoHS and REACH compliant per NXP product page.