THS3061DGN - 300MHz CFA, 7000V/us Slew Rate | Texas Instruments
MPN: THS3061DGN β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.1 | $5.10 |
| 10 | $4.59 | $45.90 |
| 100 | $4.08 | $408.00 |
| 500 | $3.67 | $1,835.00 |
| 1,000 | $3.26 | $3,260.00 |
THS3061DGN Overview
A current feedback amplifier (CFA) is a type of high-speed operational amplifier whose architecture uses a low-impedance inverting input to achieve bandwidth that is largely independent of closed-loop gain. In the signal-chain hierarchy, the CFA sits within the amplifier IC family alongside voltage feedback op amps (VFA) and fully differential amplifiers, and is preferred where wide bandwidth and fast settling must be maintained without the gain-bandwidth product penalty of VFAs.
Key features include 7000 V/us slew rate for large-signal high-frequency performance, 0.1 dB gain flatness bandwidth of 120 MHz at a gain of 2, low distortion of -81 dBc at 10 MHz, and high output drive of +/-145 mA into 50 ohm loads. These parameters suit the device for driving ADC inputs, coaxial cables, and other low-impedance loads directly.
The THS3061 is fabricated on Texas Instruments' BICOM-1 complementary bipolar process, enabling high-voltage operation (up to +/-15 V class supplies) with high-speed performance. The current feedback topology keeps bandwidth relatively constant across gain settings, while the PowerPAD package provides a low thermal resistance path essential for high-output-current operation.
Typical applications include pulse amplifiers, RF/IF signal chains, high-speed data acquisition front ends, video line drivers, and test-and-measurement signal sources.
Design consideration: as a CFA, the feedback resistor value must be selected per the datasheet recommendations; lowering Rf to increase bandwidth can cause peaking and instability. Ensure proper PowerPAD soldering to the PCB ground plane for thermal performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for THS3061DGN β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with THS3061DGN (same form factor and footprint) β differing in 0.1 dB Bandwidth, Amplifier Type, Output Current, Package, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
THS3061DGNR
β Drop-Inβ In Stock
$2.7 / Unit
View Datasheet βTHS3061DGNRG4
β Drop-Inπ Reference alternative (not in catalog)
THS3061DGN Maximum Ratings & Electrical Characteristics
| Amplifier Type | Current Feedback Amplifier (CFA) |
| Number of Channels | 1 |
| Unity Gain Bandwidth | 300 MHz |
| 0.1 dB Bandwidth | 120 MHz (G=2) |
| Slew Rate | 7000 V/us |
| Harmonic Distortion | -81 dBc at 10 MHz |
| Output Current | +/-145 mA into 50 ohms |
| Operating Temperature | -40C to +85C |
| Package | 8-Pin HVSSOP (DGN) with PowerPAD |
| Mounting Type | Surface Mount |
| Process Technology | TI BICOM-1 complementary bipolar |
| Thermal Pad | PowerPAD (exposed pad on package bottom) |
THS3061DGN Pin Configuration
| Pin 1 | -IN β Inverting input (low impedance, CFA feedback node) |
| Pin 2 | +IN β Non-inverting input (high impedance) |
| Pin 3 | V- β Negative power supply |
| Pin 4 | NC β Not connected (per datasheet) |
| Pin 5 | NC β Not connected (per datasheet) |
| Pin 6 | OUT β Amplifier output |
| Pin 7 | V+ β Positive power supply |
| Pin 8 | NC β Not connected (per datasheet) |
| Pin PAD | PowerPAD β Exposed thermal pad on package bottom; solder to ground plane for thermal dissipation |
Typical Applications
THS3061DGN is suitable for 6 applications: High-Speed ADC Driver, Pulse and Time-Domain Amplification, RF/IF Signal Chain Gain Block, Video and Coax Line Driving, Test and Measurement Instrumentation, Data Acquisition Front-End Buffering.
High-Speed ADC Driver
The THS3061DGN fits ADC front ends that require a wideband, high-slew buffer ahead of a 10-12 bit converter: its 300 MHz unity gain bandwidth and 7000 V/us slew rate support full-scale signals into the tens of MHz without slew limiting, while -81 dBc distortion at 10 MHz keeps harmonics from dominating the converter's own error budget. In a typical topology the amplifier is configured for gain of 2 with a datasheet-recommended feedback resistor, AC-coupled or DC-coupled to the ADC input, with a series resistor to isolate capacitive kickback. Unlike voltage feedback alternatives, bandwidth stays constant with gain, simplifying gain planning. The trade-off is higher quiescent power and careful PowerPAD thermal design when driving low-impedance ADC input networks continuously.
Recommended
Pulse and Time-Domain Amplification
Pulse amplifiers in test fixtures and timing chains need extreme slew rate and high output drive, which is exactly where the THS3061DGN's 7000 V/us specification delivers: a 5 V step transitions in under one nanosecond of ideal slew time, preserving edge fidelity. The +/-145 mA output current drives 50 ohm back-terminated coaxial lines directly, and the current feedback architecture provides fast settling without the gain-bandwidth penalty of VFAs. Typical use is a gain-of-2 or gain-of-5 stage between a pulse generator and a DUT, AC-coupled with a series 50 ohm resistor. Performance consideration: keep the feedback resistor at the datasheet-recommended value, since CFA stages are sensitive to Rf reduction and will ring on fast edges if over-banded.
Recommended
RF/IF Signal Chain Gain Block
In RF and IF stages operating up to 100 MHz+, the THS3061DGN provides a flexible gain block with 120 MHz of 0.1 dB flatness at G=2, adequate for bandwidth-critical IF strips, and -81 dBc distortion at 10 MHz suitable for moderate-dynamic-range receive chains. The high-voltage supply capability from the BICOM-1 process affords large output swing headroom compared to low-voltage RF amplifiers, improving intermodulation performance for large signals. Used as a post-mixer or pre-ADC gain stage, the amplifier is impedance-matched with a resistive network and AC-coupled into the 50 ohm environment. The trade-off versus dedicated RF gain blocks is higher DC power; the benefit is gain configurability and the ability to handle DC-accurate signals.
Recommended
Video and Coax Line Driving
Driving long coaxial or twisted-pair video lines demands output current and bandwidth simultaneously: the THS3061DGN's +/-145 mA into 50 ohms directly drives a back-terminated 75 or 50 ohm line without an external buffer, and the 7000 V/us slew rate ensures fast video edges and high-resolution formats are not slew-limited. The low distortion at 10 MHz keeps differential gain and phase errors low for composite and component video, while the PowerPAD package manages the dissipation of driving terminated lines continuously. Typical configuration is a gain-of-2 stage compensating the 6 dB insertion loss of a series-terminated cable. Consider that CFA input bias currents require a matched DC path on the inverting side for DC-coupled designs.
Recommended
Test and Measurement Instrumentation
Bench instruments, signal sources, and automated test equipment channels benefit from the THS3061DGN's combination of 300 MHz bandwidth, 7000 V/us slew rate, and high-voltage supply operation on the BICOM-1 process, which allows output swings unattainable with low-voltage high-speed amplifiers. In an ATE pin-driver or arbitrary waveform generator output stage, the amplifier provides the final gain and drive, with the +/-145 mA capability handling reactive and resistive loads during transients. The -40C to +85C industrial rating supports instrument environments without derating. Design consideration: instruments often demand low offset drift, so pair with a precision DC servo or use AC coupling where DC accuracy at the output is required, since CFA input offset is not its strongest parameter.
Recommended
Data Acquisition Front-End Buffering
Industrial data acquisition systems scanning sensors at high sample rates use the THS3061DGN as a multiplexed-input buffer, where its fast settling (supported by 7000 V/us slew rate) prevents channel-to-channel crosstalk after multiplexer switching. The high-voltage supply range accommodates signal chains referred to +/-15 V analog rails common in industrial instrumentation, simplifying level shifting versus 5 V-only amplifiers. The amplifier drives a following S/H or SAR converter input directly given its +/-145 mA charging current into load capacitances. Performance consideration: add an isolated resistive or RC network between amplifier and large capacitive loads to preserve phase margin, and verify thermal dissipation at sustained worst-case loads via the PowerPAD into a ground pour.
Recommended
Recommended Products Summary
Engineering reference data for THS3061DGN β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | THS3061DGNR | THS3061DGNRG4 |
|---|---|---|---|
| Package | 8-Pin HVSSOP (DGN) with PowerPAD | 8-Pin HVSSOP (DGN) with PowerPAD - same | 8-Pin HVSSOP (DGN) with PowerPAD - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Amplifier Type | Single current feedback | Single current feedback | Single current feedback |
| Unity Gain Bandwidth | 300 MHz | 300 MHz | 300 MHz |
| Slew Rate | 7000 V/us | 7000 V/us | 7000 V/us |
| Output Current | +/-145 mA into 50 ohms | +/-145 mA into 50 ohms | +/-145 mA into 50 ohms |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Format | Tube / standard quantity | Tape & Reel (larger qty) | Tape & Reel (green qual) |
| Related Family Members (NOT drop-in) | THS3061DGN (single, DGN package) | Same pinout - true drop-in | Same pinout - true drop-in |
Key Differentiators
- Extreme slew rate for large-signal bandwidth (vs THS4062ID)
- High output drive into low-impedance loads (vs THS4062IDGNR)
- Gain-independent bandwidth via CFA architecture (vs THS4062CDR)
Design Notes
The DGN (HVSSOP) package relies on the PowerPAD for heat removal; the plastic body alone cannot dissipate the power generated when sourcing +/-145 mA outputs. Solder the exposed pad to a grounded thermal land with an array of thermal vias (typically 4-6) to an internal ground plane per TI PowerPAD application guidance. Estimated: at 12 V total supply and a 6 V pk output into a 100 ohm effective load, device dissipation can approach several hundred milliwatts continuously - verify junction temperature against the datasheet thermal resistance with your PCB copper area.
As a current feedback amplifier, the THS3061DGN bandwidth and stability are set by the feedback resistor Rf, not the gain resistors. Use the datasheet's recommended Rf table for the intended gain; reducing Rf below the recommended minimum produces peaking and possible oscillation, and a capacitor directly across Rf will destabilize the CFA loop. Keep the inverting-input node trace short and avoid stray capacitance at pin 1. Decouple V+ and V- with 0.1 uF ceramics placed within a few millimeters of pins 7 and 3, plus bulk tantalum/ceramic storage per supply rail.
Use a solid ground plane under the amplifier with the PowerPAD land connected directly to it. Keep the feedback path compact and symmetrical; for gains other than +2, adjust Rf per datasheet tables rather than copying values from VFA designs. When AC coupling, place the output biasing network after the series termination resistor so the amplifier sees a DC-closed loop. For DC-coupled designs, account for CFA input bias current on the inverting node by matching the DC resistance seen at the inputs where offset matters.
Do not substitute the SOIC (D) package part into a DGN footprint or vice versa - the footprints differ and THS3062DGN (dual) has an entirely different pinout despite the same package outline. Also confirm supply voltage ratings from the TI datasheet before applying rails; the THS3061 family is high-voltage but has absolute maximum limits that must be observed with margin for transients.
Compliance Information
Compliance status not stated in the provided verified data. The DGNRG4 suffix implies TI green/RoHS requalification, but confirm on the TI product page for the specific orderable part.
