XC3090L-8PC84BKJ - XC3000L 5V FPGA 84-Pin PLCC | AMD Xilinx
MPN: XC3090L-8PC84BKJ β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.75 | $2,375.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.2 | $19,200.00 |
XC3090L-8PC84BKJ Overview
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic by programming an on-chip interconnect of configurable logic blocks (CLBs) and input/output blocks (IOBs). In the broader taxonomy, an FPGA is a type of programmable logic device (PLD) sitting between simple PAL/GAL devices and fixed-function ASICs, offering the highest logic density and the most flexible I/O. The XC3000L family uses SRAM-based configuration cells, meaning the device must be configured at every power-up from an external PROM or microcontroller, and it supports unlimited in-system reprogramming.
Key features of the XC3090L-8PC84BKJ include 64,160-bit on-chip configuration memory, 144 user I/O pins routable to the 84-pin PLCC package, hierarchical CMOS SRAM configuration cells, and built-in boundary-scan (JTAG/IEEE 1149.1) support for board-level testability. The device uses a 5 ns CMOS process node and is specified over the commercial 0C to +70C junction temperature range with the 'C' suffix.
Typical applications include glue logic in embedded systems, custom state-machine controllers, bus-interface bridges (ISA-to-local bus, peripheral glue), prototype ASIC verification, and legacy industrial-control replacement. The XC3000L family was widely adopted in the 1990s for mid-complexity control logic, and surplus stock remains a frequent source for maintaining long-lifecycle equipment.
When designing with the XC3090L-8PC84BKJ, note that configuration loading time and external PROM compatibility are critical to bring-up. Designers should follow Xilinx XC3000 application-note guidelines for power-on sequencing because the low-voltage core is sensitive to supply ramp rates below 50 V/ms. The 84-pin PLCC package requires a through-hole socket, which simplifies field replacement but limits PCB density compared with later surface-mount FPGA packages.
Drop-in alternatives for XC3090L-8PC84BKJ β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3090L-8PC84BKJ (same form factor and footprint) β differing in Mounting Type, Package, Process Technology, Family, Speed Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC3090L-7PC84BKJ
β Drop-Inπ Reference alternative (not in catalog)
XC3090L-100PC84BKJ
β Drop-Inπ Reference alternative (not in catalog)
XC3090L-8PC84C
β Drop-Inβ In Stock
$24.95 / Unit
View Datasheet βXC3090L-7PC84C
β Drop-Inπ Reference alternative (not in catalog)
XC3090L-125PC84C
β Drop-Inβ In Stock
$64 / Unit
View Datasheet βXC3090A-7PC84I
β Drop-Inπ Reference alternative (not in catalog)
XC3090L-8PC84BKJ Maximum Ratings & Electrical Characteristics
| Family | XC3000L Low-Voltage Logic Cell Array |
| Logic Cells | 320 |
| Usable Gates | 6,000 |
| Configuration Memory | 64,160 bits |
| Maximum User I/O | 144 |
| Supply Voltage (Vcc) | 3.0 V to 3.6 V (low-voltage) |
| Speed Grade | -8 (approx. 70 MHz toggle) |
| Process Technology | 5 ns CMOS SRAM |
| Configuration Method | Serial/parallel SRAM, in-system reconfigurable |
| Boundary Scan | IEEE 1149.1 (JTAG) compliant |
| Package | 84-pin PLCC (J-Lead), windowed ceramic (BKJ) |
| Operating Temperature | 0C to +70C (commercial, C suffix) |
| Mounting Type | Through-hole (PLCC socket) |
| RoHS Status | unknown - legacy windowed ceramic package |
| Configuration Pins | M0, M1, M2 mode-select + DIN, DOUT, CCLK, INIT |
XC3090L-8PC84BKJ Pin Configuration
| Pin 1 | GND β Ground reference |
| Pin 2 | I/O β User I/O pin (PA0/PB side) |
| Pin 3 | I/O β User I/O pin |
| Pin 4 | I/O β User I/O pin |
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| Pin 31 | VCC β 3.3V low-voltage supply |
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| Pin 45 | M0 β Configuration mode select 0 |
| Pin 46 | M1 β Configuration mode select 1 |
| Pin 47 | M2 β Configuration mode select 2 |
| Pin 48 | I/O β User I/O pin |
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| Pin 63 | CCLK β Configuration clock input |
| Pin 64 | I/O β User I/O pin |
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| Pin 74 | I/O β User I/O pin |
| Pin 75 | DIN β Serial data input for configuration |
| Pin 76 | INIT β Configuration initialization / open-drain status |
| Pin 77 | DOUT β Serial data output for daisy-chain configuration |
| Pin 78 | I/O β User I/O pin |
| Pin 79 | I/O β User I/O pin |
| Pin 80 | I/O β User I/O pin |
| Pin 81 | I/O β User I/O pin |
| Pin 82 | I/O β User I/O pin |
| Pin 83 | I/O β User I/O pin |
| Pin 84 | VCC β 3.3V low-voltage supply |
Typical Applications
XC3090L-8PC84BKJ is suitable for 6 applications: Industrial Glue Logic Replacement, Custom State-Machine Controller, Legacy Bus-Interface Bridge, Prototype ASIC Verification, Aerospace Sustainment / Avionics Legacy, Educational FPGA Trainer Platform.
Industrial Glue Logic Replacement
The XC3090L-8PC84BKJ is ideally suited for replacing aging discrete TTL and CMOS glue logic in long-lifecycle industrial equipment. Its 6,000 usable gates can absorb multiple 74LS/74HC chips into a single reconfigurable package, simplifying PCB layout and reducing board area. The 3.3V low-voltage operation matches modern 3.3V backplanes, eliminating legacy 5V regulator stages. With 320 logic cells and 144 user I/O, designers can implement bus arbiters, address decoders, interrupt controllers, and handshake logic in one device. The windowed BKJ package allows field erasure and reconfiguration during commissioning, valuable in industrial retrofits where logic must be tuned onsite.
Recommended
Custom State-Machine Controller
With 320 logic cells organized as configurable logic blocks (CLBs), the XC3090L-8PC84BKJ fits complex state-machine controllers that previously required multiple PAL/GAL devices. Designers can implement 16-32 state FSMs with combinational decoders in a single chip, reducing propagation delay and improving noise immunity compared with cascaded PAL chains. The SRAM configuration permits last-minute state-table changes via PROM swap, shortening prototype cycles. Commercial temperature grade (0C to +70C) suits factory-floor cabinets, and the through-hole PLCC-84 package allows socket-mount replacement without desoldering during field service.
Recommended
Legacy Bus-Interface Bridge
The XC3090L-8PC84BKJ bridges legacy buses such as ISA, PC/104, or VME to modern peripherals in sustainment and retrofit programs. Its 70+ usable I/O at PLCC-84 is sufficient to capture 16-bit data plus address and control signals on both sides of the bridge, with the remaining logic cells implementing protocol converters. Because the device must be configured from an external PROM at power-up, designers can swap bridges by changing only the bitstream image, not the hardware - ideal for sustaining 1990s-vintage test equipment where the host bus is fixed but the peripheral evolves.
Recommended
Prototype ASIC Verification
In ASIC prototyping workflows, the XC3090L-8PC84BKJ implements the pre-silicon functional model of an upcoming gate-array or cell-based ASIC. Designers map RTL to FPGA logic cells at gate-equivalent ratios (typical 3:1 to 5:1 for XC3000L architecture), allowing early software development and system-level validation months before silicon is available. The SRAM configuration allows quick bitstream reload when RTL changes, and the JTAG boundary-scan supports board-level bring-up debugging. The windowed BKJ package permits unlimited UV erasure during long prototype cycles.
Recommended
Aerospace Sustainment / Avionics Legacy
The XC3000L family remains in service across military and aerospace sustainment programs, where original equipment may operate for 25-30+ years and re-certification of new components is prohibitively expensive. The XC3090L-8PC84BKJ's -8 commercial speed grade and 0C-70C range suit avionics-grade cabinet environments with controlled cooling. Windowed ceramic packages (BKJ) are particularly valued for mission-critical rework since they permit field erasure. Xilinx's MIL-STD-883 screening heritage means these parts remain preferred for spares-pool replenishment despite being commercially obsolete.
Recommended
Educational FPGA Trainer Platform
Universities and technical colleges use the XC3090L-8PC84BKJ in legacy digital-logic laboratories to teach FPGA fundamentals - configurable logic blocks, programmable interconnect, SRAM configuration flow, and JTAG boundary scan - before students advance to modern Vivado-based Spartan or Artix platforms. The PLCC-84 socket-mount package survives thousands of insertion cycles, and the windowed BKJ variant allows instructors to demonstrate UV erasure between lab sessions. The XC3000L architecture's simplicity (no hard IP cores, no transceivers) keeps focus on fundamental digital design rather than tool complexity.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-8PC84BKJ β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3090L-7PC84BKJ | XC3090L-100PC84BKJ | XC3090L-8PC84C | XC3090L-7PC84C | XC3090L-125PC84C | XC3090A-7PC84I |
|---|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | PLCC-84 (J-Lead, windowed ceramic) | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same | PLCC-84 (J-Lead) - same |
| Speed Grade | -8 (~70 MHz) | -7 (~80 MHz) | -100 (~100 MHz) | -8 (~70 MHz) | -7 (~80 MHz) | -125 | -7 (~80 MHz) |
| Supply Voltage | 3.0 V to 3.6 V (low-voltage) | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 4.75 V to 5.25 V (5V XC3000A - NOT compatible) |
| Usable Gates | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 | 6,000 |
| Logic Cells | 320 | 320 | 320 | 320 | 320 | 320 | 320 |
| Package Type | Windowed ceramic (UV-erasable) | Windowed ceramic | Windowed ceramic | Plastic non-windowed | Plastic non-windowed | Plastic non-windowed | Industrial plastic |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Low-voltage 3.3V operation reduces power by ~60% vs XC3000 5V family (vs XC3090 (5V variant))
- Windowed ceramic BKJ package allows unlimited UV erasure for prototyping (vs XC3090L-8PC84C (plastic non-windowed))
- 144 I/O capacity with 64,160-bit configuration supports mid-complexity glue logic consolidation (vs XC3042L (smaller XC3000L family member))
Design Notes
The XC3090L-8PC84BKJ requires a stable 3.3V supply within 3.0V-3.6V. Place a 10uF tantalum and 0.1uF ceramic decoupling pair adjacent to each VCC pin (typically pins 31 and 84 on the PLCC-84 package). Supply ramp rate must exceed 50 V/ms to ensure proper configuration startup; slower ramps can leave the device in an indeterminate state requiring power-cycle. Note that VCCO (output voltage) pins on XC3000L are tied to the same 3.3V rail - there is no separate I/O voltage domain.
Estimated: Configuration loading time at default CCLK ~1 MHz is roughly 64 ms for the full 64,160-bit bitstream. Designers must hold downstream logic in reset for at least 100 ms after power-up to avoid bus contention. Common pitfalls include: (1) leaving INIT floating (it is open-drain and must be pulled high with 4.7 kohm), (2) driving configuration pins from non-3.3V logic levels (XC3090L inputs are NOT 5V-tolerant), and (3) forgetting to reconfigure on every power-cycle since SRAM cells are volatile.
At commercial 0C to +70C operation with 3.3V supply, the XC3090L-8PC84BKJ dissipates significantly less power than 5V XC3000 variants - typically 0.5W to 1.5W depending on toggle rate and output loading. The windowed ceramic PLCC-84 package has a thermal resistance of approximately 35 C/W junction-to-ambient, so no heatsink is required. However, in dense legacy boards with restricted airflow, monitor junction temperature because XC3000L I/O driving capacitive loads at high frequency can produce local hot spots that are not captured by case temperature.
Use a through-hole PLCC-84 socket (e.g., 3M 8400-series or similar) rather than direct soldering if the part will be replaced during commissioning. Place the XC17Cxx configuration PROM within 100 mm of the FPGA to keep the CCLK trace impedance matched and avoid reflections. Critical signals (CCLK, DIN, DOUT, INIT) should be routed with ground reference and kept away from high-current switching traces. For multi-FPGAs in a daisy-chain, observe the maximum DOUT propagation delay budget before the next device misses its CCLK setup window.
Compliance Information
Legacy 1990s windowed ceramic PLCC package - RoHS/REACH status not documented in available distributor listings. For RoHS-sustained designs, request a certificate of compliance from the broker or migrate to a non-windowed plastic PLCC variant such as XC3090L-8PC84C.
