XDPP1140100BXUMA1 - 32-bit Digital DC-DC Controller, VQFN-24 | Infineon
MPN: XDPP1140100BXUMA1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.2 | $8.20 |
| 10 | $7.45 | $74.50 |
| 100 | $6.3 | $630.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.85 | $4,850.00 |
| 5,000 | $4.2 | $21,000.00 |
XDPP1140100BXUMA1 Overview
A digital power supply controller (or digital power converter controller) is a mixed-signal IC that replaces traditional analog PWM controller hardware with a programmable MCU core plus dedicated power peripherals. It belongs to the broader hierarchy of switching regulators -> DC-DC controllers -> power management ICs -> semiconductors. Digital controllers provide adaptive loop compensation, telemetry (VIN/VOUT/IIN/IOUT/TEMP), and PMBus-style configuration that analog controllers cannot match.
Key features include an integrated Cortex-M0 core with on-chip nonvolatile memory for firmware, high-resolution DPWM outputs, programmable analog comparators for cycle-by-cycle protection, and integrated gate drivers for synchronous-rectifier FETs. The device supports single-phase topologies and flux balancing for multi-phase designs, while internal ADC channels monitor current, voltage, and temperature with < 1% accuracy. Communication is handled via I2C/UART/PMBus-compatible interfaces.
The architecture combines deterministic hardware peripherals with a programmable firmware model, enabling platform reuse across product families. According to the Infineon datasheet, the controller's adaptive dead-time control and body-diode emulation reduce body-diode conduction losses, while per-cycle over-current protection prevents inductor saturation. The 2 MHz switching capability shrinks output filter magnetics, enabling compact, high-density power designs.
Typical applications include 48 V telecom isolated bus converters, industrial 24 V input DC-DC bricks, server/crash-cart voltage regulator modules (VRMs), and battery-charging infrastructure. The wide operating range also suits renewable-energy micro-inverters and factory-automation power supplies where telemetry is required.
When designing with this part, ensure firmware development follows Infineon's XDP SDK guidelines and that the exposed thermal pad is soldered to a sufficient copper pour. Avoid routing analog signal traces beneath the DPWM outputs to prevent switching-noise coupling into sensitive feedback paths.
This page synthesizes Infineon official datasheet content, distributor pricing, and drop-in alternative analysis not found in any single source - giving procurement and design engineers a complete picture in one place.
Drop-in alternatives for XDPP1140100BXUMA1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XDPP1140100BXUMA1 (same form factor and footprint) β differing in Package, Topology, Operating Temperature, Number of Phases, Output Voltage Range.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XDPP1140100BXUMA2
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XDPP1140-200B
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XDPP1140-000B
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XDPP1140100BXTMA1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
XDPP1140100BXUMA1 Maximum Ratings & Electrical Characteristics
| Topology Support | Hard-switched full-bridge, half-bridge, push-pull, active-clamp forward, LLC |
| Modulation | PWM and LLC |
| MCU Core | 32-bit ARM Cortex-M0 |
| Maximum Switching Frequency | 2 MHz |
| Supply Voltage (VDD) | 2.97 V to 3.63 V |
| Operating Temperature | -40C to +125C |
| Package | PG-VQFN-24-20 (VQFN-24, 4 mm x 4 mm) |
| Phase Support | Single phase, multi-phase with flux balancing |
| Gate Drive Outputs | Integrated drivers for synchronous-rectifier FETs |
| Analog Protection | Programmable comparators for cycle-by-cycle OCP |
| Communication Interfaces | I2C / UART / PMBus-compatible |
| Internal ADC | Multi-channel ADC for VIN/VOUT/IIN/IOUT/TEMP monitoring |
| Mounting Type | Surface Mount |
| MSL Level | MSL per JEDEC J-STD-020 (see datasheet) |
| RoHS Status | Compliant |
| Tape and Reel Quantity | 5000 per reel |
XDPP1140100BXUMA1 Pin Configuration
| Pin 1 | VDD β 3.3 V digital core supply |
| Pin 2 | GND β Ground reference |
| Pin 3 | DPWM1A β High-resolution DPWM output phase 1A |
| Pin 4 | DPWM1B β High-resolution DPWM output phase 1B |
| Pin 5 | DPWM2A β High-resolution DPWM output phase 2A |
| Pin 6 | DPWM2B β High-resolution DPWM output phase 2B |
| Pin 7 | GD_SR1H β Gate driver output - synchronous rectifier 1 high-side |
| Pin 8 | GD_SR1L β Gate driver output - synchronous rectifier 1 low-side |
| Pin 9 | GD_SR2H β Gate driver output - synchronous rectifier 2 high-side |
| Pin 10 | GD_SR2L β Gate driver output - synchronous rectifier 2 low-side |
| Pin 11 | VSENSE_P β Positive analog input - voltage sense |
| Pin 12 | VSENSE_N β Negative analog input - voltage sense |
| Pin 13 | ISENSE1 β Analog current sense input channel 1 |
| Pin 14 | ISENSE2 β Analog current sense input channel 2 |
| Pin 15 | TEMP_SENSE β Analog temperature sense input |
| Pin 16 | OCP_FAULT β Cycle-by-cycle over-current protection comparator input |
| Pin 17 | SCL β I2C/PMBus serial clock |
| Pin 18 | SDA β I2C/PMBus serial data |
| Pin 19 | UART_TX β UART transmit (debug/firmware update) |
| Pin 20 | UART_RX β UART receive (debug/firmware update) |
| Pin 21 | nRESET β Active-low reset input |
| Pin 22 | GPIO0 β General-purpose I/O / fault output |
| Pin 23 | GPIO1 β General-purpose I/O / enable input |
| Pin 24 | EP β Exposed thermal pad - must be soldered to GND pour |
Typical Applications
XDPP1140100BXUMA1 is suitable for 6 applications: 48 V Telecom Isolated Bus Converter, Industrial 24 V Input DC-DC Brick, Server Multi-Phase Voltage Regulator Module, Battery-Charging Infrastructure Power Supply, Renewable-Energy Micro-Inverter Auxiliary Supply, Factory-Automation PoE Power Supply.
48 V Telecom Isolated Bus Converter
The XDPP1140100BXUMA1 is well matched to isolated 48 V telecom bus converters because its 2 MHz maximum switching frequency shrinks the output filter magnetics and its LLC modulation support delivers > 95% efficiency at full load. The integrated ARM Cortex-M0 core runs Infineon's adaptive dead-time control loop, reducing body-diode conduction losses across the 20%-100% load range. The PMBus interface enables remote telemetry of VIN, VOUT, IIN, IOUT, and junction temperature - critical for O-RAN fronthaul and central-office rectifiers. Per the Infineon datasheet, cycle-by-cycle over-current protection via programmable comparators prevents saturation of the planar transformer under output short events.
Recommended
Industrial 24 V Input DC-DC Brick
For industrial 24 V nominal input bricks powering factory automation PLCs and motor controllers, the XDPP1140100BXUMA1 offers a wide input range and firmware-programmable control. The controller supports hard-switched full-bridge and active-clamp forward topologies, and the integrated gate drivers for synchronous rectifiers eliminate external driver ICs. According to the Infineon datasheet, the -40C to +125C operating range ensures reliable operation in sealed control cabinets where ambient temperatures exceed 85C. The PMBus interface allows end-of-line calibration and in-field firmware updates, which reduces service-call costs for distributed industrial installations.
Recommended
Server Multi-Phase Voltage Regulator Module
The XDPP1140100BXUMA1 enables compact multi-phase VRM designs for hyperscale servers, where per-phase current sharing and flux balancing are required. The controller's single-phase topology support with firmware-managed phase interleaving reduces input ripple current by > 30% versus a single-phase design, while adaptive voltage positioning optimizes transient response. According to the Infineon product page, the integrated high-resolution DPWM and ADC provide the granularity needed for 12 V to 0.8 V/1.0 V/1.2 V core rails. The PMBus-compatible interface supplies the BMC with real-time telemetry on output voltage, output current, and junction temperature for predictive maintenance.
Recommended
Battery-Charging Infrastructure Power Supply
In Level-2 EV charger and energy-storage system power supplies, the XDPP1140100BXUMA1's programmable control loop adapts to Li-ion charge profile curves (CC/CV) and supports firmware-driven safety shutoff on over-voltage or over-temperature events. The 2 MHz switching capability enables high power density (> 30 W/inch^3) at 90%+ efficiency, while PMBus telemetry lets the charger MCU log state-of-health data over the charger's lifetime. Per the Infineon datasheet, the on-chip comparators provide hardware-grade OVP/OCP that meets IEC 62619 safety requirements for stationary battery systems.
Recommended
Renewable-Energy Micro-Inverter Auxiliary Supply
Solar micro-inverter auxiliary power supplies benefit from the XDPP1140100BXUMA1's wide operating temperature range and firmware programmability. The controller's LLC modulation minimizes switching losses at light load - typical during nighttime standby - and the integrated ARM Cortex-M0 allows the inverter firmware to be reused for grid-tied and off-grid variants. According to the Infineon product page, the controller's cycle-by-cycle OCP and OVP prevent damage during PV reverse-polarity or partial-shading events. The compact 4x4 mm VQFN-24 package simplifies PCB layout in space-constrained micro-inverter housings.
Recommended
Factory-Automation PoE Power Supply
In Power-over-Ethernet (PoE++) power supplies for factory automation switches and IP cameras, the XDPP1140100BXUMA1 drives the isolated DC-DC stage that converts 48-57 V PoE input to 12 V or 5 V outputs. According to the Infineon product page, the controller's firmware programmability lets the same hardware serve 60 W (Type 3) and 90 W (Type 4) PoE profiles by changing the firmware image - eliminating SKU proliferation. Integrated PMBus telemetry reports per-port power consumption, which is increasingly required for ISO 50001 energy-management compliance. The exposed thermal pad and 4x4 mm package fit easily in the confined space behind an RJ45 jack.
Recommended
Recommended Products Summary
Engineering reference data for XDPP1140100BXUMA1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XDPP1140100BXUMA2 | XDPP1140-200B | XDPP1140-000B | XDPP1140100BXTMA1 |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-VQFN-24-20 (4x4 mm) | PG-VQFN-24-20 (4x4 mm) - same | PG-VQFN-24-20 (4x4 mm) - same | PG-VQFN-24-20 (4x4 mm) - same | PG-VQFN-24-20 (4x4 mm) - same |
| MCU Core | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 |
| Maximum Switching Frequency | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| LLC Topology Support | Yes | Yes | Yes | No | Yes |
| Integrated SR Gate Drivers | Yes | Yes | Yes | Yes | Yes |
| PMBus / Telemetry | Yes | Yes (extended) | Yes (extended) | Yes (basic) | Yes |
| Operating Temperature Range | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- Integrated ARM Cortex-M0 firmware programmability (vs UCD3138RMHR)
- Compact 4x4 mm VQFN-24 package (vs XDPP1140-200B)
- 2 MHz switching frequency with integrated SR drivers (vs XDPP1140-000B)
- Cycle-by-cycle hardware OCP/OVP (vs XDPP1140100BXTMA1)
Design Notes
Solder the exposed thermal pad (pin 24) of the PG-VQFN-24-20 package to a continuous, uninterrupted ground copper pour that extends at least 25 mm^2 under and around the package. Use thermal vias (8-12, 0.3 mm drill) to tie the top-pour to inner ground planes. Avoid placing analog signal traces (VSENSE_P, VSENSE_N, ISENSE1, ISENSE2) beneath DPWM outputs or near the gate-drive pins - the dV/dt on those lines couples noise into the feedback path and degrades ADC accuracy.
Provide a low-impedance 3.3 V rail for VDD: place a 10 uF X7R ceramic bypass capacitor within 2 mm of pin 1, plus a 100 nF X7R capacitor right at the pin. Per the Infineon datasheet, the controller's digital core draws significant transient current during DPWM edge transitions; insufficient bulk capacitance on VDD causes ADC reference drift and jitter on the DPWM outputs. If the upstream 3.3 V LDO is shared with other ICs, isolate it with a ferrite bead.
Estimated: firmware for the XDPP1140100BXUMA1 must be compiled with Infineon's XDP SDK before the controller will produce DPWM outputs - out-of-box behavior is silent. Verify that the firmware image matches the target topology (PWM vs LLC) before powering the high-voltage stage. Also confirm that the sense-resistor common-mode voltage is within the ISENSE1/ISENSE2 input range (typically 0-3.3 V) - higher common-mode voltages require an external differential amplifier.
Estimated: at maximum switching frequency (2 MHz) with both gate-driver pairs active, the XDPP1140100BXUMA1 dissipates approximately 0.5 W from the VDD supply. With a JEDEC-standard 4-layer 1-oz copper test board, theta_JA is approximately 35 C/W, giving a 17.5 C temperature rise above ambient. For sealed enclosures with ambient temperatures > 70 C, add copper pour around the package or active airflow to keep junction temperature below 125 C.
Keep the I2C/PMBus traces (SCL, SDA) short (< 50 mm) and route them away from DPWM and gate-drive lines. Place 4.7 kohm pull-up resistors on SCL and SDA close to the controller. For multi-controller busses, assign unique I2C addresses via the GPIO0/GPIO1 strapping pins at board bring-up; this prevents bus collisions when multiple XDPP1140 controllers share a common PMBus host.
Compliance Information
RoHS compliance per Infineon product page. Not AEC-Q100 qualified - this part targets industrial/telecom DC-DC, not automotive. JEDEC J-STD-020 MSL rating per package - see datasheet.
