10AX090N3F40I2LG - Arria 10 GX 900K LE FPGA, 1517-FCBGA | Intel
MPN: 10AX090N3F40I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $11200 | $1,120,000.00 |
| 500 | $10500 | $5,250,000.00 |
| 1,000 | $9800 | $9,800,000.00 |
Drop-in alternatives for 10AX090N3F40I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N3F40E2LG
✅ Drop-In✓ In Stock
$2280 / Unit
View Datasheet →10AX090N2F40I2LG
✅ Drop-In✓ In Stock
$6903.28 / Unit
View Datasheet →10AX090N2F40I2SG
✅ Drop-In✓ In Stock
$6185 / Unit
View Datasheet →10AX090N2F40I1SG
✅ Drop-In✓ In Stock
$2985 / Unit
View Datasheet →10AX090N2F45I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →10AX090N3F40I2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 |
| User I/O Count | 600 |
| Package | 1517-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 14.1 Gbps |
| Hard Memory Controllers | DDR4 with hardened PHY |
| PCIe Hard IP | PCIe Gen3 x8 |
| RoHS Status | Compliant |
10AX090N3F40I2LG 1517-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090N3F40I2LG (1517-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N3F40I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N3F40I2LG is suitable for 6 applications: 5G Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging and Diagnostics, Broadcast and Professional Video Processing, Test and Measurement Instrumentation, High-Performance Computing Accelerator Card.
5G Wireless Baseband Processing
The 10AX090N3F40I2LG's 900,000 logic elements and 14.1 Gbps transceivers make it well suited to 5G baseband and fronthaul CPRI/eCPRI processing. Its hardened floating-point DSP blocks accelerate FFT, channel estimation, and MIMO detection pipelines at line rate, while the 600 user I/Os and DDR4 hardened PHY enable wide parallel radio interfaces. Industrial temperature rating supports outdoor radio units and base-station deployments.
Recommended
Radar and Electronic Warfare Signal Processing
Defense and aerospace radar systems benefit from the 10AX090N3F40I2LG's high DSP throughput, 14.1 Gbps transceivers for digital-RF data conversion, and 900K LE capacity for adaptive beamforming algorithms. The industrial temperature grade suits outdoor phased-array installations, while partial reconfiguration enables runtime mode switching between search, track, and electronic-countermeasure profiles. Hard PCIe Gen3 x8 supports direct host-coupled processing.
Recommended
Medical Imaging and Diagnostics
The 10AX090N3F40I2LG supports real-time processing in CT, MRI, and ultrasound imaging systems, where its 900K logic elements, embedded DSP, and DDR4 controllers handle parallel image-reconstruction pipelines. The 14.1 Gbps transceivers enable high-speed links to detector arrays and host servers, while the industrial temperature rating supports integration into imaging carts and stationary equipment. Low-latency parallel compute is decisive for image-quality and patient-throughput gains.
Recommended
Broadcast and Professional Video Processing
The 10AX090N3F40I2LG is a strong fit for 4K/8K broadcast video routers, format converters, and live-production switchers. Its 600 user I/Os and high-density fabric handle multi-stream SDI/HDMI aggregation, while the 14.1 Gbps transceivers support SMPTE 2022/2110 IP-based video transport over 10/25 GbE. Industrial temperature rating suits outside-broadcast vans and 24/7 studio operation.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators rely on the 10AX090N3F40I2LG's combination of DSP horsepower, fast transceivers, and parallel I/O for real-time DSP, trigger correlation, and waveform synthesis. The 900K LE budget accommodates deep acquisition-memory address generators and FFT engines, while DDR4 interfaces sustain multi-gigasample capture rates. Industrial temperature rating supports lab and field-deployed instrument chassis.
Recommended
High-Performance Computing Accelerator Card
The 10AX090N3F40I2LG operates as a host-coupled accelerator in compute-dense PCIe cards for financial analytics, genomics, or scientific workloads. Its hardened PCIe Gen3 x8 block provides low-latency host connectivity, while 900K logic elements support custom datapath accelerators that outperform CPUs on parallel kernels. The 14.1 Gbps transceivers also enable direct GPU-to-FPGA or FPGA-to-FPGA fabric links for multi-card scaling.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N3F40I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N3F40E2LG | 10AX090N2F40I2LG | 10AX090N2F40I2SG | 10AX090N2F40I1SG | 10AX090N2F45I2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same | 1517-FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Transceiver Max Data Rate | 14.1 Gbps | 14.1 Gbps | 12.5 Gbps | 12.5 Gbps | 10 Gbps | 12.5 Gbps |
| Temperature Grade | Industrial (-40C to +100C) | Extended | Industrial | Industrial | Industrial | Industrial |
| Speed Grade | 3 (fastest) | 3 | 2 | 2 | 1 | 2 |
| User I/O | 600 | 600 | 600 | 600 | 600 | 600 |
| Embedded SRAM | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
Key Differentiators
- Highest transceiver speed grade in the 10AX090N family (vs 10AX090N2F40I2LG)
- Industrial temperature grade for harsh environments (vs 10AX090N3F40E2LG)
- Highest logic density in the Arria 10 GX family at 900K LE (vs 10AX066N2F40E1SG)
Design Notes
Estimated: the 10AX090N3F40I2LG in a 1517-FCBGA can dissipate 25 W to 40 W at full utilization, per typical Arria 10 GX power-characterization reports. Apply a heatsink with thermal interface material and ensure at least 150 LFM of airflow; without forced cooling, junction temperature may exceed the +100C industrial limit. Designers should run the Intel Quartus Prime Early Power Estimator before layout commitment.
The FCBGA-1517 substrate requires a high-layer-count PCB (often 14 to 18 layers) with stacked micro-vias and via-in-pad construction to break out the 1.0 mm pitch BGA. All transceiver lanes must have impedance-controlled differential routing (typically 85/100 ohm) with length matching to within 5 mil. Power distribution requires multiple voltage rails with bulk, ceramic, and decoupling capacitors placed adjacent to each ball pair.
Do not assume the 10AX090N3F40I2LG can be replaced by a different speed-grade Arria 10 part without re-running Quartus Prime timing analysis - the speed suffix (1/2/3) changes timing closure margins. Confirm the package code (F40 vs F45) matches the pin-out file before board assembly, since some F-suffix variants differ in ball mapping despite identical package bodies. Always load the latest device pin-out file from intel.com before schematic capture.
Compliance Information
RoHS and REACH compliant per Intel product environmental disclosures. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-qualified IC.
