10AX090R1F40I1SG - Arria 10 GX FPGA, 900K LE, 1517-BGA | Intel / Altera
MPN: 10AX090R1F40I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4607.5 | $46,075.00 |
| 100 | $4365 | $436,500.00 |
| 500 | $4074 | $2,037,000.00 |
| 1,000 | $3783 | $3,783,000.00 |
Drop-in alternatives for 10AX090R1F40I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090R1F40E1SG
✅ Drop-In✓ In Stock
$6700 / Unit
View Datasheet →10AX090N3F40I2SG
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View Datasheet →10AX090N3F45I2SG
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View Datasheet →10AX090N2F40I2SG
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View Datasheet →10AX090N4F40I3LG
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View Datasheet →10AX090R1F40I1SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 900,000 |
| Adaptive Logic Modules (ALM) | 339,620 |
| Embedded Memory | 47.32 Mbit |
| User I/O Pins | 342 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1517-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial |
| Packaging | Tray |
| RoHS Status | Compliant |
| Device Type | FPGA - Field Programmable Gate Array |
| MSL Level | 3 (168 hours) |
10AX090R1F40I1SG 1517-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090R1F40I1SG (1517-bbga, fcbga package) with 342 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090R1F40I1SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 342 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090R1F40I1SG is suitable for 6 applications: 10G/40G Ethernet Switching Fabric, Digital Video Broadcast Encoder, Software-Defined Radio (SDR) Platform, High-Speed Data Acquisition System, Wireless Baseband Processing, ASIC Prototyping Platform.
10G/40G Ethernet Switching Fabric
The 10AX090R1F40I1SG's 12.5 Gbps transceivers (R1 grade) directly support 10G Ethernet, 40G Ethernet (via four 10G lanes), and PCIe Gen3 x8. With 339,620 ALMs and 47.32 Mbit embedded memory, it can implement full L2/L3 forwarding tables, queue management, and packet parsing engines. The F40 FCBGA package provides 342 user I/O pins for parallel side-band interfaces, MDIO, and CPU attach buses. This makes it ideal for top-of-rack switches, network interface cards, and carrier Ethernet equipment where deterministic latency and bandwidth aggregation are required.
Recommended
Digital Video Broadcast Encoder
The 10AX090R1F40I1SG suits broadcast encoder applications including 4K HEVC, JPEG2000, and contribution video transport over SDI. Its 20 nm process and 339K ALMs enable real-time encoding at 60 fps while the hardened DSP blocks accelerate motion estimation and transform operations. The 47.32 Mbit embedded buffer memory holds multiple reference frames, and the transceivers interface directly to 12G SDI serializers. According to the Altera Arria 10 Device Datasheet, the F40 package's signal integrity is qualified for the high-speed serial requirements of broadcast video.
Recommended
Software-Defined Radio (SDR) Platform
For software-defined radio platforms, the 10AX090R1F40I1SG offers the DSP density and ADC/DAC interfacing required for wideband baseband processing. Its hardened floating-point DSP blocks accelerate FFT, channelization, and modulation/demodulation algorithms. The R1 transceivers interface to JESD204B Class 1 ADCs/DACs at data rates up to 12.5 Gbps, while the 47.32 Mbit embedded memory supports deep sample buffers. The industrial temperature grade (I1) is suitable for outdoor SDR deployments such as tactical communications or radio astronomy.
Recommended
High-Speed Data Acquisition System
The 10AX090R1F40I1SG is well suited for high-speed data acquisition in test and measurement, medical imaging, and radar preprocessing. Its 47.32 Mbit embedded memory and 339K ALMs allow continuous capture from parallel ADC arrays, real-time DSP filtering, and trigger detection. The R1 transceivers accept JESD204B data streams at 12.5 Gbps per lane, enabling aggregate acquisition rates exceeding 50 Gbps. Industrial temperature grade supports deployment in factory automation and outdoor instrumentation.
Recommended
Wireless Baseband Processing
In wireless infrastructure (small cells, LTE/5G baseband units, microwave backhaul), the 10AX090R1F40I1SG provides the DSP throughput needed for PHY-layer processing, channel coding, and beamforming. Its hardened floating-point DSP blocks deliver up to 1.5 TFLOPs of DSP performance per the Arria 10 datasheet. The transceivers support CPRI (Common Public Radio Interface) up to 9.8 Gbps, enabling direct connection to remote radio heads. The F40 FCBGA package has the signal integrity required for these high-speed serial links.
Recommended
ASIC Prototyping Platform
The 10AX090R1F40I1SG serves as an effective ASIC prototyping platform for mid-complexity designs requiring up to 900K ASIC gates equivalent. Engineers can partition ASIC RTL across multiple Arria 10 devices and validate system behavior at near-ASIC speeds using the R1 transceivers for chip-to-chip bridging. The 20 nm process timing models closely match leading-edge ASIC geometries. Industrial temperature grade supports pre-silicon validation in automotive and industrial customer environments.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090R1F40I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090R1F40E1SG | 10AX090N3F40I2SG | 10AX090N3F45I2SG | 10AX090N2F40I2SG | 10AX090N4F40I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F45) - different package | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE | 900,000 LE |
| Embedded Memory | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit | 47.32 Mbit |
| Transceiver Grade | GX (R1 = up to 12.5 Gbps) | GX (R1 = up to 12.5 Gbps) | N3 (no transceivers) | N3 (no transceivers) | N2 (lower speed grade transceivers) | N4 (no transceivers) |
| Temperature Grade | Industrial (I1) | Commercial (E1) | Industrial (I2) | Industrial (I2) | Industrial (I2) | Industrial (I3) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Highest density Arria 10 GX variant with industrial temp grade (vs 10AX090R1F40E1SG)
- Cost-effective transceiver option within Arria 10 family (vs 10AX090R2F40I1SG / 10AX090R3F40I1SG)
- Integrated transceivers vs N-series drop-in alternatives (vs 10AX090N3F40I2SG)
Design Notes
The 1517-ball FCBGA package requires a high-density PCB with at least 8 layers. Use a 1.0 mm or finer BGA pitch PCB with microvia stack-ups (e.g., 1-2-1 or 2-4-2). Place a continuous ground plane beneath the BGA to control return paths for the high-speed transceivers. Maintain 100-ohm differential impedance for transceiver lanes and 50-ohm single-ended for LVCMOS I/O.
The 10AX090R1F40I1SG requires multiple supply rails: 0.9 V core, 1.2 V or 1.5 V transceiver supply, 1.8 V or 2.5 V auxiliary, and 3.0 V configuration supply. Estimated core power consumption under typical workloads is 15-25 W, with peak transients during configuration. Use a sequence controller such as the LTC2977 or equivalent to enforce proper rail sequencing. Decoupling: place 0402-size 0.1 uF and 10 uF capacitors within 1 ball pitch of each supply ball.
Estimated: at 20 W total power dissipation, the F40 FCBGA package's junction-to-ambient thermal resistance (theta_JA) of approximately 8-10 C/W with a heat sink attached results in 160-200 C junction temperature rise above ambient. Industrial temperature grade requires junction temperature below 100 C, so a heat sink with thermal interface material and adequate airflow (>= 200 LFM) is mandatory. The Altera Arria 10 Thermal Modeling Tool provides device-specific thermal data.
Do not assume all 10AX090 variants are pin-compatible - only F40-package variants share ball assignments. Configuring the FPGA requires either an external configuration device (EPCS or compatible flash) or JTAG programming via USB-Blaster II. The MSL3 moisture sensitivity level (168 hours floor life at 30 C/60% RH) requires proper dry-bag handling and bake-out before reflow if exposure exceeds the floor life.
Compliance Information
RoHS compliant per DigiKey product listing. Industrial temperature grade (I1) per Altera ordering code convention; not AEC-Q100 qualified (FPGAs typically not AEC-Q100 qualified as discrete components - system-level qualification required).
