10AX090N3F45E2LG - Arria 10 GX 900K LE FPGA | Intel | BGA-1932
MPN: 10AX090N3F45E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 25 | $2540 | $63,500.00 |
| 50 | $2420 | $121,000.00 |
| 100 | $2285 | $228,500.00 |
Drop-in alternatives for 10AX090N3F45E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N3F45E2SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX090N3F40E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2280 / Unit
View Datasheet →10AX090N2F45E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6095.25 / Unit
View Datasheet →10AX090N2F45E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4943.22 / Unit
View Datasheet →10AX090N2F40E2LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX090N2F40I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6903.28 / Unit
View Datasheet →10AX090N3F45E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 (about 59.2 Mbit) |
| DSP Blocks | 768 (variable-precision, with hardened FP) |
| Process Technology | 20 nm TSMC |
| Core Voltage (VCC) | 0.9 V |
| Transceivers | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| Hard PCIe IP | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | DDR4 up to 1600 MHz |
| Package | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Temperature Grade | Extended (E2) |
| Speed Grade | 3 (mid) |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (requires external flash) |
| Toolchain | Intel Quartus Prime Pro Edition |
10AX090N3F45E2LG 1932-ball fcbga, f45 (29 mm x 29 mm) Pin Configuration Guide
Complete pinout information for 10AX090N3F45E2LG (1932-ball fcbga, f45 (29 mm x 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N3F45E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N3F45E2LG is suitable for 6 applications: High-Performance DSP Pipelines, PCIe Accelerator Cards (Gen3), Broadcast Video Processing (4K/8K UHD), 100G Wireline Bridging and OTN, Medical Imaging Acceleration (CT/MRI Reconstruction), Test & Measurement Instrumentation.
High-Performance DSP Pipelines
The 10AX090N3F45E2LG delivers 768 variable-precision DSP blocks with hardened single-precision floating-point multipliers and adders, sustaining multi-GHz FIR, FFT, and matrix-multiply pipelines. Designers map radar FFTs, beamforming weights, and channelizer banks into the DSP fabric and reserve remaining logic for control-plane state machines. The 12.5 Gbps transceivers aggregate ADC sample streams into the FPGA at sustained terabit-per-second rates. Versus a DSP-processor alternative, this Arria 10 GX implementation delivers deterministic low-latency throughput and reduces host CPU load to near zero in a real-time beamforming or radar-frontend chassis.
Recommended
PCIe Accelerator Cards (Gen3)
The 10AX090N3F45E2LG integrates a hard PCIe Gen3 x8 controller, offloading all PCIe TLP processing from soft logic and delivering the full 8 GT/s per lane. The card exposes a DMA engine plus 900K LE of user compute to the host CPU, suited to FPGA-accelerated databases, machine-learning inference, and storage offload. The 900K LE margin covers custom co-processors plus PCIe, DMA, and platform glue logic in a single chip. Designers use Quartus Prime's PCIe HIP example design to verify link-up before committing to PCB layout, saving one or two board spins versus custom PHY development.
Recommended
Broadcast Video Processing (4K/8K UHD)
The 10AX090N3F45E2LG's 900K logic elements and 59 Mbit embedded memory support 4K and 8K UHD up-/down-/cross-conversion, HDR tone-mapping, and color-space conversion at broadcast frame rates. Embedded memory absorbs multi-line frame buffering while the DSP fabric runs scaler kernels; SDI and HDMI interfaces map onto the multi-protocol transceivers. The hard PCIe controller enables direct ingest from capture cards. Compared to a pure ASIC, the Arria 10 GX lets broadcasters update codecs (HEVC, AV1) via bitstream rewrite, future-proofing their investment as standards evolve.
Recommended
100G Wireline Bridging and OTN
At 12.5 Gbps per channel the Arria 10 GX transceivers can be bonded to deliver 100 Gbps Ethernet, OTU4, or CPRI fronthaul pipelines inside a single 10AX090N3F45E2LG. Hard PCS blocks simplify 100G KR4/CR4 PMA implementation, while the LE budget covers MAC/IP framing, OAM, and statistics. This density makes the device a strong fit for top-of-rack switches and transport gear bridging client 100GE to OTN uplinks. Designers can swap a 10AX090 part for the higher 10AX115 variant on the same PCB to add telemetry or in-line encryption.
Recommended
Medical Imaging Acceleration (CT/MRI Reconstruction)
The hardened single-precision floating-point DSP in the 10AX090N3F45E2LG accelerates back-projection, iterative-reconstruction, and denoising kernels used in CT and MRI reconstruction. A single FPGA can replace multiple DSP boards, reducing system power and board count. The PCIe Gen3 link streams raw projection data from the host at line rate, while the embedded memory buffers slice data without external DRAM. For medical OEMs the 900K LE density provides the right balance between per-unit cost and reconstruction throughput for clinical-grade imaging equipment.
Recommended
Test & Measurement Instrumentation
High-end oscilloscopes, BERTs, and arbitrary waveform generators leverage the 10AX090N3F45E2LG for real-time signal processing, deep memory acquisition, and multi-channel protocol analysis. The 768 DSP blocks drive long FFTs at multi-GS/s sample rates, while the 12.5 Gbps transceivers handle industry-standard interconnect lanes. Logic capacity covers real-time triggering and protocol-decode firmware in a single chip. Quartus partial reconfiguration lets T&M vendors ship hardware with multiple personalities (oscilloscope, BERT, protocol analyzer) selected by license, lowering SKU complexity.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N3F45E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N3F45E2SG | 10AX090N3F40E2LG | 10AX090N2F45E2LG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F40) | 1932-ball FCBGA (F45) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | N3 (mid) | N3 (mid) | N3 (mid) | N2 (slower) |
| Temperature Grade | E2 (extended) | E2 (extended) | E2 (extended) | E2 (extended) |
| DSP Blocks | 768 | 768 | 768 | 768 |
| Embedded Memory | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit |
| Ball Finish | Lead-free (LG) | Leaded (SG) | Lead-free (LG) | Lead-free (LG) |
Key Differentiators
- Highest speed grade (N3) within the 900K LE Arria 10 GX F45 family (vs 10AX090N2F45E2LG)
- Lead-free ball finish for RoHS manufacturing (vs 10AX090N3F45E2SG)
- 900K logic elements in the F45 1932-ball FCBGA package (vs 10AX066 family)
Design Notes
Estimated: at typical 0.9V core with 90 percent logic utilization running 200 MHz on DSP fabric, plan for about 12-18 W of dissipation. The F45 1932-ball FCBGA has a measured theta_JA near 6-8 C/W with 8-layer 1oz copper and top-side airflow of 1 m/s; expect a 70-110 C junction rise above ambient. Provide a heatsink or heat-spreader for industrial enclosures and always validate with the Quartus Early Power Estimator before committing to the mechanical envelope.
Use the Arria 10 GX Pin Connection Guidelines verbatim - especially for the hard PCIe HIP reference clock pins and the dedicated transceiver REFCLK inputs. Decouple every VCC/VCCPT/VCCIO rail with 0.1 uF X7R + 10 uF bulk within 100 mil of the relevant balls. Break all high-speed serial lanes on a tuned stripline stack-up with 100 ohm differential impedance, and use the Arria 10 High-Speed Signal Layout Guidelines for via anti-pad and length-tuning guidance.
Do not swap an F45 (this part) for an F40 (10AX090N3F40E2LG) without re-validating the PCB footprint - the F45 and F40 share the 1932-ball count but differ in body and ball pitch. Also, mixing the LG and SG ball finishes affects reflow peak temperature and RoHS scope; select the suffix that matches your assembly process. Finally, never leave the configuration DONE pin floating - tie it through a 4.7 kohm pull-up to VCCIO of the configuration bank.
For multi-gigabit transceivers above 10 Gbps, isolate the analog supply (VCCA_PLL, VCCR, VCCT) with ferrite beads from the digital core supply. Match transceiver trace lengths to within 5 mil of the reference-clock input. For DDR4 interfaces use the read/write leveling results from the Quartus EMIF Toolkit to set per-byte deskew taps, and never skip the write leveling sequence on the memory controller debug flow.
Compliance Information
LG suffix denotes lead-free ball finish; RoHS and REACH compliance follow Intel's standard FPGA product declarations. AEC-Q100 is not applicable for an FPGA in this category.
