10AX090R3F40I2SG - Arria 10 GX FPGA 900K LE 1517-FCBGA | Intel
MPN: 10AX090R3F40I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6889.94 | $6,889.94 |
| 10 | $6200.95 | $62,009.50 |
| 100 | $5511.95 | $551,195.00 |
| 500 | $4822.96 | $2,411,480.00 |
| 1,000 | $4133.96 | $4,133,960.00 |
Drop-in alternatives for 10AX090R3F40I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090R3F40I2LG
✅ Drop-In✓ In Stock
$3640 / Unit
View Datasheet →10AX090R3F40E2SG
✅ Drop-In✓ In Stock
$5400 / Unit
View Datasheet →10AX090R2F40I2SG
✅ Drop-In✓ In Stock
$6290.55 / Unit
View Datasheet →10AX090R2F40I2LG
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Contact for price
View Datasheet →10AX090R1F40I1SG
✅ Drop-In✓ In Stock
$3783 / Unit
View Datasheet →10AX090R3F40I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Process Technology | 20 nm TSMC |
| User I/O Count | 342 |
| Package | 1517-BBGA, FCBGA (F40), 40 x 40 mm |
| Speed Grade | -3 |
| Temperature Grade | Industrial (I) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| Supply Voltage (Core) | 0.9 V |
| Operating Temperature | -40C to +100C |
10AX090R3F40I2SG 1517-bbga, fcbga (f40), 40 x 40 mm Pin Configuration Guide
Complete pinout information for 10AX090R3F40I2SG (1517-bbga, fcbga (f40), 40 x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090R3F40I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090R3F40I2SG is suitable for 6 applications: 4K Video Processing and Broadcast Encoder, Software-Defined Radio Platform, PCIe Gen3 Accelerator Card, Test and Measurement Instrumentation, Military Radar and Electronic Warfare, 100G Line-Card Prototyping and MAC Aggregation.
4K Video Processing and Broadcast Encoder
The 10AX090R3F40I2SG's 900,000 logic elements and 59.2 Mbits of embedded memory make it ideal for 4K video processing and broadcast encoder pipelines where multi-stream parallel processing is required. The -3 speed grade supports the high clock rates needed for real-time HEVC/H.264 encoding, while the Arria 10 GX transceiver fabric enables SDI, HDMI 2.0, and 12G-SDI I/O without external ASSPs. Designers typically instantiate multiple encoder cores plus color-space conversion blocks; the 1517-ball FCBGA F40 package delivers 342 user I/O for parallel video data paths and GPIO expansion. A typical 4K mezzanine card uses 60-70% of logic and 50% of transceivers, leaving headroom for run-time reconfigurable overlays.
Recommended
Software-Defined Radio Platform
For software-defined radio (SDR) platforms, the 10AX090R3F40I2SG delivers the DSP throughput and transceiver density required for multi-channel wideband baseband processing. The device's variable-precision DSP blocks implement parallel FIR filtering and FFT cores directly in fabric, while the Arria 10 GX transceivers handle ADC/DAC JESD204B/C links and antenna data aggregation. With 900K LE available, designers can run multiple concurrent channels at rates up to 245.76 Msps in LTE or 5G NR configurations. The industrial temperature grade supports outdoor base-station deployments where ambient swings exceed commercial limits.
Recommended
PCIe Gen3 Accelerator Card
The 10AX090R3F40I2SG is a strong fit for PCIe Gen3 accelerator cards that need both hard IP for PCIe and abundant programmable fabric for custom compute kernels. Intel integrates hardened PCIe Gen3 controllers in Arria 10 GX, eliminating soft-IP timing risks while the 900K LE budget supports HLS-generated compute pipelines such as cryptography, compression, or ML inference. The transceiver count accommodates x8 Gen3 plus sideband SERDES for multi-card scaling. The FCBGA F40 footprint is compatible with standard PCIe card mechanical envelopes when paired with the appropriate heatsink and airflow.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments - logic analyzers, protocol testers, arbitrary waveform generators - benefit from the 10AX090R3F40I2SG's combination of high logic density, abundant transceivers, and ample M20K memory for deep capture buffers. Industrial temperature rating suits production-floor burn-in racks, while the -3 speed grade enables fast acquisition rates and real-time protocol decoding. Designers leverage the FPGA's parallelism to implement multi-channel pattern generation and error detection simultaneously. The 1517-FCBGA package's 342 user I/O support wide LVDS banks and parallel ADCs/DACs without external muxes.
Recommended
Military Radar and Electronic Warfare
Defense radar and electronic-warfare systems rely on the 10AX090R3F40I2SG for its high logic capacity, hardened transceivers, and industrial temperature rating that survives harsh airborne and shipboard environments. The device hosts digital beamforming, pulse compression, and adaptive filtering at multi-GHz effective sample rates. Its DDR3/DDR4 hard memory controllers feed beamforming memory matrices at line-rate, while the high pin count supports parallel RF ADC/DAC interfaces. The industrial temperature grade combined with Intel's reliability data suits mission-critical defense platforms.
Recommended
100G Line-Card Prototyping and MAC Aggregation
The 10AX090R3F40I2SG enables prototyping of 100G Ethernet line cards where transceiver density and parallel MAC processing must coexist. Arria 10 GX devices deliver multiple 10/25 Gbps channels simultaneously, and the 900K LE budget absorbs full soft-MAC implementations plus classification, policing, and oversubscription logic. Combined with 59 Mbits of embedded RAM for packet buffering, the device can act as a single-chip 100G aggregation block. Designers move from prototype to production on the same footprint, shortening NPI cycles.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090R3F40I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090R3F40I2LG | 10AX090R3F40E2SG | 10AX090R2F40I2SG | 10AX090R2F40I2LG | 10AX090R1F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) 40x40 mm | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Mbits) | 59.23 | 59.23 | 59.23 | 59.23 | 59.23 | 59.23 |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Ball Finish | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
| Typical Unit Price (qty 1, USD) | 6889.94 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density Arria 10 GX in a single package (vs 10AX066N3F40I2SG)
- -3 speed grade delivers highest Fmax within Arria 10 family (vs 10AX090R2F40I2SG)
- Industrial temperature rating vs commercial (vs 10AX090R3F40C2SG (commercial variant))
Design Notes
Estimated: at full transceiver utilization the 10AX090R3F40I2SG can dissipate 15-25 W depending on toggle rate. Use a thermal interface material (TIM) and a heatsink with at least 1 C/W thermal resistance, or design chassis airflow of 200 LFM minimum. Junction temperature must stay below 100C for the I2 industrial rating; derate from 125C maximum to 100C by budgeting 25C margin. Arria 10 GX thermal models are available in Intel's thermal advisor tool within Quartus Prime.
The 1517-ball FCBGA F40 package requires a 12+ layer PCB stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers, microvia-in-pad for the inner-row ball escape, and matched impedance (100 ohm differential for transceivers, 50 ohm SE for general I/O). Use Intel's pin-out files (.pin) to verify the exact ball map for the 10AX090 variant. Decoupling: place 0.1 uF and 10 uF capacitors on every VCC/VCCIO/GND pair within 100 mil of the ball.
Arria 10 GX transceivers require matched-length routing within 0.127 mm (5 mil) tolerance for the longest/shortest trace pair to keep intra-pair skew below 0.15 UI at 10.3125 Gbps. Reference Intel's Arria 10 Transceiver Layout Guide (UG-1034) for via pattern, AC coupling capacitor placement, and PCB material recommendations. Use the Quartus Prime Transceiver Toolkit to validate link BER after layout.
Common pitfalls: (1) using a -2 speed grade part when the design needs -3 timing, causing hold-time violations at high transceiver rates; (2) missing the configuration mode pins (MSEL) selection resistor network, which causes configuration failure on power-up; (3) ignoring the POR (power-on reset) delay and not sequencing the 0.9 V core before the 1.8 V/2.5 V/3.3 V rails; (4) not programming the AS configuration device properly, leaving the FPGA in JTAG fallback.
Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet before PCB layout to budget regulator sizing. The 10AX090R3F40I2SG typically needs a 0.9 V core regulator rated 15-25 A, plus VCCIO and VCCR/VCCP rails for transceivers. Add a sequencer IC such as the LTC2977 or use FPGA-controlled rails. Validate that the inrush current of all rails combined does not exceed the bulk capacitor bank's ESR budget at startup.
Compliance Information
RoHS compliance per the G-suffix in the Altera OPN decoder (lead-free). Industrial temperature rating is per the I2 suffix. AEC-Q100 does not apply (FPGA is not an automotive-qualified part per Altera/Intel catalog).
