10AX090U2F45I1SG - Arria 10 GX FPGA, 900K LE, FCBGA-1932 | Intel
MPN: 10AX090U2F45I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11032.94 | $11,032.94 |
| 10 | $9929.65 | $99,296.50 |
| 100 | $8274.71 | $827,471.00 |
| 500 | $7455.2 | $3,727,600.00 |
| 1,000 | $6895.59 | $6,895,590.00 |
Drop-in alternatives for 10AX090U2F45I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090U2F45E2SG
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View Datasheet →10AX090U2F45E2LG
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View Datasheet →10AX090U2F45E1SG
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View Datasheet →10AX090U1F45I1SG
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View Datasheet →10AX090U2F45I1SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| User I/Os | 480 |
| Package | 1932-BBGA, FCBGA (45 mm x 45 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Speed Grade | U2 |
| Process Technology | 20 nm Tri-Gate |
| RoHS Status | Compliant |
| RoHS Version | SG suffix indicates RoHS-compliant |
| Hard Memory Controllers | Yes (DDR3/DDR4 with ECC, family-level) |
10AX090U2F45I1SG 1932-bbga, fcbga (45 mm x 45 mm) Pin Configuration Guide
Complete pinout information for 10AX090U2F45I1SG (1932-bbga, fcbga (45 mm x 45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U2F45I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45I1SG is suitable for 6 applications: 10G/40G Ethernet Aggregation Switch, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator Card, Test and Measurement Instrumentation, Broadcast Video Processing and Contribution Encoders, PCIe Accelerator Card for Data Center Offload.
10G/40G Ethernet Aggregation Switch
The 10AX090U2F45I1SG is well-suited for 10G/40G Ethernet aggregation switches because of its 24 transceivers supporting data rates up to 12.5 Gbps, which directly covers 10GbE SFP+ and 40GbE QSFP+ ports. According to the Intel Arria 10 family datasheet, the hard 10GbE MAC IP and 1588 PTP support simplify PHY/MAC integration, while 900K logic elements provide headroom for L2/L3 switching fabric, ACL tables, and QoS queues. The 480 user I/Os allow ample parallel sideband, LED, and management interfaces, while industrial temperature supports carrier-grade deployments. Estimated line-rate throughput scales with U2 speed grade selection.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX090U2F45I1SG serves radar and electronic-warfare applications through its variable-precision DSP blocks, which deliver multi-GFLOP signal processing for beamforming, pulse compression, and FFTs. According to Intel Arria 10 marketing collateral, the part supports CPRI up to 9.8 Gbps for direct connection to remote radio heads, and 24 transceivers enable multi-antenna MIMO arrays. The I1 industrial temperature grade handles outdoor or near-antenna installations. The 900K logic elements absorb mid-tier FFT and direction-finding algorithms without external DSP, reducing BOM and PCB complexity. Estimated: full 1024-point FFT at 200+ MSPS fits within DSP budget.
Recommended
Medical Imaging Accelerator Card
The 10AX090U2F45I1SG supports medical imaging accelerators such as CT, MRI, and ultrasound front-ends where 900K logic elements and variable-precision DSP enable real-time image reconstruction. According to Intel Arria 10 datasheet, hard PCIe Gen3 x8 IP connects the FPGA to host CPUs at 8 GT/s with low latency, while 24 transceivers carry high-speed ADC data at up to 12.5 Gbps per lane. The 59 Mbit embedded block RAM absorbs pipeline stages and line buffers without external SRAM, reducing BOM. Industrial temperature supports OR-integrated imaging carts and ruggedized field equipment.
Recommended
Test and Measurement Instrumentation
The 10AX090U2F45I1SG is a strong fit for high-end oscilloscopes, protocol analyzers, and BERT equipment because the 24 transceivers handle multi-standard serial I/O including PCIe, SATA, USB 3.0, and 10GbE. According to the Arria 10 family datasheet, the 480 user I/Os interface to ADC/DAC front-ends with parallel LVDS lanes, while 900K LEs implement protocol-aware triggers and deep acquisition memory. The U2 speed grade supports high sample-rate DSP, and industrial temperature extends deployment to production-line and field environments. Estimated: 4-8 channel 25 Gbps pattern generator fits in the F45 FCBGA thermal envelope.
Recommended
Broadcast Video Processing and Contribution Encoders
The 10AX090U2F45I1SG suits broadcast video processing because of its 24 transceivers supporting SDI rates up to 12G-SDI, JPEG 2000 compression cores, and 900K LEs for multi-channel video pipelines. According to Intel Arria 10 application notes, hard HDMI 2.0 and DisplayPort 1.4 IP blocks accelerate AV I/O integration, while the industrial temperature grade supports outside-broadcast trucks and harsh studio environments. The 59 Mbit embedded block RAM absorbs multiple frames of 4K video buffering. Estimated: 4-channel 12G-SDI ingest with simultaneous JPEG 2000 encode fits within DSP and logic budgets.
Recommended
PCIe Accelerator Card for Data Center Offload
The 10AX090U2F45I1SG builds PCIe Gen3 x8 accelerator cards because the hard PCIe Gen3 controller integrates seamlessly with host CPUs at 8 GT/s. According to Intel's Arria 10 datasheet, 24 transceivers enable QSFP+ network I/O for distributed acceleration fabrics, while 900K LEs implement custom compute kernels (compression, encryption, ML inference). DDR4 with hard controllers supports up to 4 ranks at 2133 MT/s with ECC. The FCBGA-1932 package and industrial temperature allow card-edge and edge-server deployments. Estimated: 100 Gbps aggregate I/O plus 32 GB DDR4 buffer fits power and thermal envelope with appropriate heatsink.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U2F45E2SG | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U1F45I1SG | 10AX090U1F45E1SG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Package | F45 FCBGA-1932 (45 mm x 45 mm) | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same | F45 FCBGA-1932 - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | U2 (mid-tier) | U2 - same | U2 - same | U2 - same | U1 (-1 speed bin) | U1 (-1 speed bin) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Commercial (0C to +100C) | Commercial (0C to +100C) | Industrial - same | Commercial (0C to +100C) |
| Transceivers | 24 channels up to 12.5 Gbps | 24 channels - same | 24 channels - same | 24 channels - same | 24 channels - same | 24 channels - same |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same | 59,234,304 bits - same |
| Approx. Unit Price (qty 1) | $11,032.94 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density Arria 10 variant in F45 FCBGA-1932 (vs 10AS066K2F35I1SG)
- Industrial temperature grade with full transceiver count (vs 10AX090U2F45E2SG)
- U2 speed grade - cost-effective Fmax tier (vs 10AX090U3F45I1SG)
- Hard PCIe Gen3 x8 IP integrated (vs XC7A100T-2FGG676I (Xilinx Artix-7))
Design Notes
The FCBGA-1932 package dissipates substantial power at full transceiver utilization - up to approximately 40 W at 24 channels at 12.5 Gbps with high logic utilization. According to Intel Arria 10 thermal guidance, a heat sink with thermal interface material is mandatory, and the PCB must include at least 16 thermal vias under the center ground ball array. Without adequate cooling, the junction temperature can exceed 100C under industrial load. Estimated: at 40 W and theta_JA = 0.6 C/W (with heat sink), the junction rise is approximately 24C above ambient.
The 1932-ball FCBGA at 1.0 mm pitch demands a minimum of 16 PCB layers with HDI microvia construction. According to Intel Arria 10 hardware design guidelines, route the transceiver reference clocks on an inner stripline layer with controlled impedance of 100 ohm differential, and use a continuous ground reference plane beneath all high-speed traces. BGA breakout fan-out should follow a dog-bone or via-in-pad pattern with at least 4 mil trace and 8 mil space. Length matching within 0.127 mm (5 mil) per transceiver lane is required.
Power-on sequencing for the Arria 10 GX requires the core VCC to ramp first, then VCCPT, VCCAUX, VCCIO, and transceiver supplies in a defined order per Intel's power management guide. Estimated: 0.9V core at 30-40A requires a 6-phase buck regulator with output ripple under 30 mVpp. Hold nCONFIG low until all rails are stable. Voltage droops during configuration can corrupt the bitstream, so bulk decoupling must provide at least 1 ms of hold-up at full load current.
Do not leave unused transceiver channels floating - follow the Intel Arria 10 pin connection guidelines and tie unused TX/RX pins through 10 kohm to GND to prevent oscillation. According to Intel application notes, unused 10 GbE and PCIe lanes must have specific reference clock termination. Missing JTAG pull-ups on nCONFIG or nSTATUS during board bring-up is a common cause of configuration failure. Always include a JTAG header with all four JTAG signals plus 10 kohm pull-ups to VCCIO.
High-speed transceiver routing must maintain 100 ohm differential impedance with no more than two vias per differential pair, and intra-pair skew below 0.127 mm (5 mil). Per Intel's transceiver layout guidelines, separate adjacent transceiver channels by at least 4x the dielectric height to minimize crosstalk. Reference clock traces must be length-matched within 0.05 mm between P and N. Use an embedded microstrip or symmetric stripline topology with a continuous ground plane beneath; never cross reference clock traces over plane splits.
Compliance Information
RoHS compliant per SG suffix in MPN. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. REACH and halogen-free status not explicitly listed in provided distributor data; consult Intel product declaration documents for confirmation.
