10AX090U2F45E2SG - Arria 10 GX FPGA 900K LE 1932-FCBGA | Intel
MPN: 10AX090U2F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7610.3 | $7,610.30 |
| 10 | $7230 | $72,300.00 |
| 100 | $6850 | $685,000.00 |
| 500 | $6420 | $3,210,000.00 |
| 1,000 | $5995 | $5,995,000.00 |
Drop-in alternatives for 10AX090U2F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U2F45E2LG
✅ Drop-In✓ In Stock
$3647.5 / Unit
View Datasheet →10AX090U2F45E1SG
✅ Drop-In✓ In Stock
$5895 / Unit
View Datasheet →10AX090U2F45E1LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX090U1F45E1SG
✅ Drop-In✓ In Stock
$8750 / Unit
View Datasheet →10AX090U1F45I1SG
✅ Drop-In✓ In Stock
$9750 / Unit
View Datasheet →10AX090U2F45E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory (bits) | 59234304 |
| User I/O Count | 480 |
| Package | 1932-BBGA, FCBGA |
| Package Type | FC-FBGA (F45) |
| Speed Grade | -E2 |
| Temperature Grade | Industrial (S) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Device Family Variant | 10AX090 |
| Ordering Code Suffix | U2F45E2SG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount |
10AX090U2F45E2SG Pin Configuration
| Pin 1 | VCC — Core/auxiliary supply (refer to F45 ballout for exact rail assignment) |
| Pin 2 | GND — Common ground return |
| Pin 3 | IO_BANK_1A — User I/O bank 1A (LVDS/CMOS programmable) |
| Pin 4 | GXB_TX — Transceiver transmit differential pair |
| Pin 5 | GXB_RX — Transceiver receive differential pair |
| Pin 6 | REFCLK — Reference clock input for transceiver/PLL |
| Pin 7 | CONFIG_DONE — Configuration complete status output |
| Pin 8 | nSTATUS — Configuration status flag (active low) |
| Pin 9 | nCONFIG — Configuration initiate (active low) |
| Pin 10 | MSEL — Configuration mode select |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45E2SG is suitable for 7 applications: Wireless Baseband Processing, Radar Signal Processing, Medical Imaging Acceleration, Broadcast Video Processing, High-Performance Computing (HPC) Coprocessor, ASIC Prototyping, Test & Measurement Instrumentation.
Wireless Baseband Processing
The 10AX090U2F45E2SG's 900K logic elements, integrated DSP blocks, and high-speed transceivers up to 28 Gbps make it well-suited for 4G/5G baseband digital up/down-conversion, CFR/DPD signal processing, and multi-antenna MIMO pipelines. The 59.2 Mbits embedded SRAM buffers FFT working sets without external memory stalls, while the 480 user I/O interfaces to analog RF front-ends and external DDR4 buffers.
Recommended
Radar Signal Processing
Military and weather radar systems rely on the 10AX090U2F45E2SG's 20nm process for high MTBF and its industrial temperature grade for field deployment. The variable-precision DSP blocks accelerate pulse-compression, MTI filtering, and CFAR detection pipelines, while the transceiver count handles multi-channel ADC data ingest up to 6.144 Gbps per lane. The 1932-ball FC-FBGA's thermal performance is critical for sustained compute loads in airborne platforms.
Recommended
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the 10AX090U2F45E2SG to accelerate back-projection, beamforming, and image-reconstruction algorithms. The 900K logic elements and 59.2 Mbits embedded SRAM allow real-time 3D rendering, while the PCI Express Gen3 hard IP connects to host CPUs over standard PCIe backplanes. The industrial temperature range supports operating-room and mobile-clinic deployment without thermal derating.
Recommended
Broadcast Video Processing
The 10AX090U2F45E2SG supports 4K/UHD video processing including scaling, deinterlacing, color-space conversion, and HDR tone mapping in broadcast infrastructure. Its transceiver count handles 12G-SDI ingest at 11.88 Gbps per link, and the M20K memory blocks implement line buffers and motion-estimation windows. The 480 user I/O interfaces to HDMI 2.0, SDI, and DisplayPort 1.4 conversion ASICs.
Recommended
High-Performance Computing (HPC) Coprocessor
HPC clusters use the 10AX090U2F45E2SG as a co-processor for FPGA-accelerated genomics, financial Monte Carlo, and machine-learning inference. PCI Express Gen3 x8 hard IP enables host coupling at 8 GB/s, and the DSP fabric implements custom-precision floating-point operators. The 900K logic elements allow whole genomes or risk models to be staged on-chip, eliminating DRAM round-trips.
Recommended
ASIC Prototyping
Pre-silicon ASIC validation teams use the 10AX090U2F45E2SG to prototype designs approaching 900K ASIC gates on a reprogrammable platform, catching logic bugs before mask-set commitment. The F45 1932-ball FC-FBGA footprint, abundant transceivers, and Quartus Prime prototyping flow shorten bring-up cycles. Multiple Arria 10 boards can be ganged for multi-FPGA ASIC prototypes exceeding 5M gates.
Recommended
Test & Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators integrate the 10AX090U2F45E2SG for real-time signal acquisition, triggering, and DSP. The transceiver count handles 25+ Gbps protocol decoding for PCIe 4.0 and USB 3.1 Gen2 analysis. Industrial temperature screening supports bench-to-rack test equipment operating in uncontrolled environments, while Quartus Prime enables rapid protocol firmware updates.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U2F45E1LG | 10AX090U1F45E1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | -E2 | -E2 | -E1 (faster) | -E1 (faster) | -E1 (faster) | -I1 (industrial) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Unit Price (qty 1, USD) | 7610.30 | Similar to SG (LG is lead-free finish only) | [DATA_NEEDED] (typically slightly higher than E2) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Identical silicon to 10AX090U2F45E1SG with E2 speed bin selection (vs 10AX090U2F45E1SG)
- Same package as 10AX090U2F45E2LG with SG terminal finish (vs 10AX090U2F45E2LG)
- Industrial-grade screening over U1F45 commercial variant (vs 10AX090U1F45E1SG)
- Mid-range Arria 10 density tier with balanced DSP and transceiver mix (vs 10AX115 (higher density tier))
Design Notes
The 1932-ball FC-FBGA package with 1.0mm ball pitch requires an 8-12 layer PCB stack-up with stacked microvias (laser-drilled) for inner ball connections. Use low-loss (Df < 0.005) high-Tg FR-4 or mid-loss Nelco N4000-13EP for the core. Maintain a 50Ω single-ended and 100Ω differential controlled impedance for transceiver channels. Place 0402 or 0201 decoupling capacitors on every VCC ball within 1mm trace length.
Estimate: the 10AX090U2F45E2SG core rail draws approximately 3-8A at 0.9V under typical utilization. Total device power can exceed 25W when transceivers are fully active. Use a multi-phase buck regulator (e.g., 4-phase ISL8225M) feeding the core rail, and route analog/digital supplies separately. Enable Intel's SmartVoltage ID and power-management features in Quartus to reduce dynamic power by 30-50% on lightly-loaded regions.
Estimated: at 25W total power dissipation and 31.4 C/W theta_JA for the F45 FC-FBGA, the junction rises 785C above ambient - exceeding silicon limits. A heatsink with thermal resistance under 1 C/W, plus 200 LFM forced airflow, is required for production deployment. The exposed-die FC-FBGA attaches directly to a heat spreader via thermal interface material (TIM). Use Intel's Arria 10 thermal estimator spreadsheet for board-level simulation before tape-out.
Route GXB (transceiver) channels first with length matching to within 0.127mm (5 mils) for lanes within a quad, and reference over a continuous ground plane. Use stitched ground vias every 2mm along the channel to suppress common-mode resonance. Separate analog PLL supplies from digital supplies with their own ferrite-bead-filtered rails. Avoid routing any signal traces under BGA balls on internal layers.
Common pitfalls include: (1) using Quartus II instead of Quartus Prime Pro - the older software cannot synthesize Arria 10 silicon; (2) omitting the .qsf pin assignments file before compilation; (3) underestimating configuration time for 20nm SRAM configuration bitstream > 100 Mbit; (4) failing to instantiate the Altera PHYLite or External Memory Interface IP for DDR4 - free IP is required for legal PHY; (5) ignoring SDC timing constraints for inter-clock-domain paths leads to silent functional failures.
Compliance Information
RoHS and REACH compliant per Intel Arria 10 product family declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified IC; AEC-Q100 qualification must be done at the system level for the OEM. Lead-free ball finish standard on SG/LG suffixes.
