10AX090U2F45E2LG - Arria 10 GX 900K LE FPGA | Intel | 1932-FCBGA
MPN: 10AX090U2F45E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4607.5 | $46,075.00 |
| 100 | $4122.5 | $412,250.00 |
| 500 | $3835.75 | $1,917,875.00 |
| 1,000 | $3647.5 | $3,647,500.00 |
Drop-in alternatives for 10AX090U2F45E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U2F45E1SG
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View Datasheet →10AX090U2F45E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AX090U1F45E1SG
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View Datasheet →10AX090U1F45I1SG
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View Datasheet →10AX090U3F45E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AX090U2F45I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10AX090U2F45E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/O Pins | 480 |
| Package | 1932-ball FCBGA |
| Process Technology | 20nm |
| Core Voltage | 0.9 V |
| Speed Grade | -2 |
| Temperature Range | 0C to 100C (E2 - extended) |
| Transceiver Data Rate | Up to 14.1 Gbps |
| PCI Express Hard IP | Gen3 (hardened) |
| Memory Controllers | Gen2 hard memory controllers |
| Configuration Method | Active serial, passive parallel, JTAG |
| RoHS Status | Compliant |
| MSL Level | 4 (per JEDEC J-STD-020) |
10AX090U2F45E2LG 1932-ball fcbga Pin Configuration Guide
Complete pinout information for 10AX090U2F45E2LG (1932-ball fcbga package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U2F45E2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45E2LG is suitable for 6 applications: 4K Video Processing and Broadcast, Wireless Baseband and Remote Radio Head (RRH), Defense Radar and Signal Intelligence, Medical Imaging Accelerator, High-Throughput Data Acquisition, ASIC Prototyping.
4K Video Processing and Broadcast
The 10AX090U2F45E2LG is well suited for 4K video processing and broadcast applications. Its 900,000 logic elements deliver sufficient capacity for video scaling, deinterlacing, color space conversion, and HEVC preprocessing pipelines operating at 60 fps. The 14.1 Gbps transceivers support 12G-SDI and DisplayPort 1.4 interfaces commonly used in broadcast studio equipment. Hard memory controllers handle DDR4 frame buffers without consuming fabric resources, freeing the FPGA fabric for picture-quality algorithms. The -2 speed grade provides the timing margin required to close timing on 4K-wide datapaths at full frame rate.
Recommended
Wireless Baseband and Remote Radio Head (RRH)
The 10AX090U2F45E2LG serves wireless baseband and remote radio head designs with its 14.1 Gbps transceivers and high DSP block count. The device supports CPRI and OBSAI fronthaul links up to 12.5 Gbps per lane, enabling multi-sector 4G/5G RRH implementations. Hardened PCI Express Gen3 controllers connect to baseband processors, while the 900K logic elements implement channelization, FFT, and crest-factor reduction in a single chip. The 20nm process delivers the lowest power at the required performance, which is critical for outdoor RRH deployments with thermal constraints.
Recommended
Defense Radar and Signal Intelligence
The 10AX090U2F45E2LG is widely deployed in defense radar and signal intelligence systems. The 900K logic elements and 96 transceiver channels support multi-antenna phased-array radar with simultaneous receive paths. Embedded DSP blocks accelerate FFT and pulse compression at the high sample rates required for modern radar modes. The package's high pin count accommodates the multiple JESD204B ADC/DAC interfaces common in these designs. The -2 speed grade enables timing closure on 250 MHz+ datapaths that define modern EW and SAR systems.
Recommended
Medical Imaging Accelerator
The 10AX090U2F45E2LG accelerates medical imaging workloads including CT, MRI, and ultrasound reconstruction. The 900K logic elements implement back-projection, iterative reconstruction, and AI-assisted denoising in hardware, offloading compute from host processors. PCI Express Gen3 hard IP enables direct attachment to imaging server PCIe slots. The 59 Mbits of embedded memory provides low-latency scratchpad storage for reconstruction kernels, while DDR3/DDR4 controllers manage the multi-gigabyte image datasets typical of CT volumes. Low-power 20nm silicon is essential for clinic-side deployment.
Recommended
High-Throughput Data Acquisition
The 10AX090U2F45E2LG excels in high-throughput data acquisition systems used in scientific instrumentation and test equipment. The 14.1 Gbps transceivers interface to high-speed ADCs and DACs over JESD204B/C, aggregating multiple converter channels at sample rates exceeding 5 GSPS. The 900K logic elements implement real-time FFTs, channelization, and trigger logic on the streaming data. Embedded 59 Mbits of block memory buffers data between acquisition and processing stages, reducing external memory pressure. The -2 speed grade is essential for timing closure on the wide parallel datapaths.
Recommended
ASIC Prototyping
The 10AX090U2F45E2LG is frequently used as an ASIC prototyping platform. The 900K logic elements map the equivalent of 8-12 million ASIC gates, sufficient for mid-complexity SoC prototypes. Hardened PCI Express Gen3 and memory controllers allow validation of real-world I/O paths alongside the prototype logic. The 480 user I/Os and 14.1 Gbps transceivers replicate most ASIC interfaces at near-production speed. Quartus Prime supports ASIC-style partitioning and incremental compilation to shorten bring-up time, making the Arria 10 GX a productive prototyping vehicle.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U2F45E1SG | 10AX090U2F45E2SG | 10AX090U1F45E1SG | 10AX090U1F45I1SG | 10AX090U3F45E2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Speed Grade | -2 | -1 (slower) | -2 (same) | -1 (slower) | -1 (slower) | -3 (faster) |
| Temperature Range | 0C to 100C (E2) | 0C to 100C (E1) | 0C to 100C (E2) | 0C to 100C (E1) | -40C to 100C (I1 industrial) | 0C to 100C (E2) |
| Transceiver Rate (max) | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
| Process Technology | 20nm | 20nm | 20nm | 20nm | 20nm | 20nm |
| Unit Price (qty-1) | $4,850 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the LG finish option (vs 10AX090U2F45E1LG / 10AX090U2F45E1SG)
- Lead-free LG package finish suitable for global RoHS markets (vs Older non-LG finishes (where available))
- Drop-in compatible with broader 10AX090U2F45 family (vs 10AX090U1F45E1SG (U1 trim))
Design Notes
Estimated: At 100% logic utilization with typical 0.85 core voltage and 70% toggle rate, the 10AX090U2F45E2LG dissipates approximately 25-35W. The 1932-ball FCBGA package requires a thermal-via array under the lid with at least 0.4 C/W board thermal resistance to ambient. Use a heatsink with 0.5 C/W or attach to a cold plate in forced-air systems. Without active cooling the junction temperature will exceed 100C in most realistic workloads.
The 1932-ball FCBGA demands a high-density PCB stackup: at minimum 1+6+1 with microvias on the top and bottom layers, 0.2mm ball pitch requires 0.4mm laser-drilled microvias. Reference Intel's Arria 10 hardware design guidelines for stackup recommendations. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O. Length-match within 150 microns across transceiver lanes to meet 14.1 Gbps eye margins.
Sequence power rails in the order: 3.3V auxiliary, 1.8V/2.5V/3.0V I/O banks, then 0.9V core. The Intel Arria 10 Device Datasheet specifies the minimum ramp time and monotonicity requirements for each rail. Use a dedicated power management IC such as the LTC3615 or LTM4677 family with the Power Management feature in Quartus Prime. Decoupling capacitors must be placed within 100 mils of each power pin with 100 nF + 4.7 uF + 22 uF combinations.
Do not assume the 10AX090U2F45E2LG and 10AX090U2F45E2SG are interchangeable without verifying lead-free and RoHS requirements - the LG suffix denotes a specific lead-free finish. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins with the exact resistor values in the datasheet. Mixed transceiver protocol and PCI Express configurations require careful Quartus Prime pin assignment to avoid lane conflicts in the same bank.
Compliance Information
RoHS compliance per LG suffix in the part number. AEC-Q100 not applicable as this is an FPGA, not an automotive-grade discrete. Halogen-free status not stated in verified web data.
