10AX090U4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
MPN: 10AX090U4F45I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8782.45 | $8,782.45 |
| 5 | $8550 | $42,750.00 |
| 10 | $8320 | $83,200.00 |
| 25 | $7990 | $199,750.00 |
| 100 | $7450 | $745,000.00 |
Drop-in alternatives for 10AX090U4F45I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U4F45E3LG
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View Datasheet →10AX090U3F45I2LG
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View Datasheet →10AX090U2F45I2LG
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$7957.34 / Unit
View Datasheet →10AX090S4F45I3LG
✅ Drop-In✓ In Stock
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View Datasheet →10AX090N4F45I3LG
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View Datasheet →10AX090U4F45I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| User I/O Pins | 480 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FCBGA (F45) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -3 (mid-power) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Transceivers | Up to 28 Gbps (Arria 10 GX family capability) |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR3/DDR4 controllers |
| DSP Blocks | Hardened floating-point DSP fabric |
| Configuration | SRAM-based, supports via Quartus Prime |
10AX090U4F45I3LG 1932-ball fcbga (f45) Pin Configuration Guide
Complete pinout information for 10AX090U4F45I3LG (1932-ball fcbga (f45) package) with 480 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U4F45I3LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 480 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U4F45I3LG is suitable for 6 applications: 4K/8K Video Broadcast Processing, 100G Ethernet Line Card, Software-Defined Radio (SDR) Baseband, Radar Signal Processing, ASIC Prototyping, High-Performance DSP Co-Processing.
4K/8K Video Broadcast Processing
The 10AX090U4F45I3LG's 900,000 logic elements and hard DSP fabric deliver the parallel arithmetic throughput needed for 4K/8K video pipelines, including chroma upsampling, color-space conversion, HDR tone mapping, and wavelet compression. The -3 speed grade sustains 300 MHz DSP operation, while the 1932-ball FCBGA exposes the high-pin-count parallel video bus and multiple DisplayPort/SDI links. Hard PCIe Gen3 x8 IP enables direct attachment to host CPUs for ingest cards. Compared with software-only pipelines on x86, the FPGA approach offloads per-pixel operations for deterministic low-latency broadcast output.
Recommended
100G Ethernet Line Card
The 10AX090U4F45I3LG integrates hard 100G Ethernet MAC and hardened PCS IP, enabling a single-chip 100G line card for switch/router platforms. The 28 Gbps-capable transceivers (per Arria 10 GX family) drive CFP/CFP2/QSFP28 optics directly, while the 480 user I/O feed multiple front-panel ports and backplane lanes. The -3 speed grade closes 156.25 MHz timing for 100G Ethernet PCS and OTN framing, and the 59 Mbit of block RAM supports deep packet buffering. Pair with external DDR4 for line-rate table lookup and traffic management.
Recommended
Software-Defined Radio (SDR) Baseband
The 10AX090U4F45I3LG's hardened floating-point DSP blocks and high-speed transceivers make it a natural fit for SDR baseband, where it performs channelization, FFT-based spectrum analysis, and modem signal processing on wideband IF samples. The 20 nm process keeps core power manageable at 0.9 V despite the 900K LE count, while the industrial temperature rating supports outdoor/ruggedized radio enclosures. The 480 user I/O provide abundant LVDS pairs for ADC/DAC interfacing at GSPS rates.
Recommended
Radar Signal Processing
Phased-array radar systems rely on FPGAs like the 10AX090U4F45I3LG for pulse compression, beamforming, and Doppler processing in real time. The Arria 10 GX hardened floating-point DSP blocks execute complex FFTs and matrix operations at hundreds of MHz, while the 59 Mbit block RAM stages range-Doppler maps. The 1932-ball FCBGA provides mechanical rigidity for vibration-prone environments, and the -I3 industrial temp grade handles the -40C to +100C junction range required in airborne radar pods.
Recommended
ASIC Prototyping
The 10AX090U4F45I3LG is widely used as an ASIC prototyping vehicle because its 900K LE and hard memory controllers can map large ASIC RTL partitions with high fidelity. Multiple FPGAs can be tiled with high-speed transceivers bridging partitions, achieving multi-hundred-MHz ASIC-equivalent emulation. The 1932-ball FCBGA exposes enough GPIO to replicate most ASIC package pinouts, and Quartus Prime Pro supports industry-standard prototyping flows (HAPS, Protium).
Recommended
High-Performance DSP Co-Processing
The 10AX090U4F45I3LG's hardened floating-point DSP fabric acts as a coprocessor to host CPUs or GPUs, offloading compute kernels like FIR filters, FFTs, convolutions, and matrix multiplies. The hard PCIe Gen3 x8 IP provides 8 GB/s host coupling, while the 59 Mbit block RAM and external DDR4 controller stage large datasets. Industrial temp (-40C to +100C) and -3 speed grade suit medical imaging accelerators and high-frequency trading platforms where deterministic low-latency DSP matters.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U4F45I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U4F45E3LG | 10AX090U3F45I2LG | 10AX090U2F45I2LG | 10AX090S4F45I3LG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 SoC | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 (mid-power) | -3 | -2 | -2 | -3 | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial | Industrial | Industrial | Industrial |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| User I/O Pins | 480 | 480 | 480 | 480 | 480 | 480 |
Key Differentiators
- Mid-power -3 speed grade in industrial temp (vs 10AX090U3F45I2LG)
- Pure FPGA fabric without embedded HPS (vs 10AX090S4F45I3LG)
- Industrial temperature rating for harsh environments (vs 10AX090U4F45E3LG)
Design Notes
Estimated: at typical utilization (60-70% LE, 50% DSP, 25 Gbps transceivers active), the 10AX090U4F45I3LG dissipates 15-25 W from a 0.9 V core plus I/O. The 1932-ball FCBGA package requires a heatsink or heat-spreader lid plus 200-400 LFM airflow to keep junction below 100C in industrial temp. Apply thermal interface material (TIM) with conductivity >= 3 W/mK between the lid and heatsink.
The 1932-ball FCBGA at F45 pitch demands an HDI PCB stackup (any-layer microvia, laser-drilled vias) for breakout routing. Plan at least a 12-layer stackup with paired ground planes adjacent to signal layers to maintain signal integrity on 25 Gbps transceiver channels. Decouple with 0402/0201 ceramic caps (0.1 uF, 1 uF, 10 uF) placed as close as possible to each power pin per the Arria 10 pin connection guidelines.
Route 25/28 Gbps transceiver channels with controlled impedance (100 ohm differential) and keep stubs under 150 mil. Match pair lengths within 5 mil for 25 Gbps and 2 mil for 28 Gbps. Use AC-coupled capacitors (100 nF) at transmitter outputs per Arria 10 GX transceiver user guide. Provide a clean reference ground plane under transceiver channels; avoid crossing power plane splits.
Do not assume all Arria 10 GX OPNs are feature-equivalent: the U, S, and N suffixes denote unlocked GX, SoC with HPS, and feature-restricted variants respectively. Pin-compatibility is preserved in the F45 package, but Quartus device support files and fitter results differ. Always compile your design against the exact OPN in the Quartus device selection to avoid fitter errors and unused-pin warnings.
Compliance Information
RoHS/REACH compliance per Intel/Altera product page; AEC-Q100 is automotive-grade qualification and not applicable to high-density FPGAs in this class. Industrial temperature grade -I3 supports -40C to +100C junction operation.
