10AX115R2F40E1SG - Arria 10 GX FPGA, 1150K LE, 1517-FCBGA | Intel
MPN: 10AX115R2F40E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8750 | $8,750.00 |
| 10 | $8312.5 | $83,125.00 |
| 100 | $7625 | $762,500.00 |
| 250 | $7250 | $1,812,500.00 |
| 500 | $6875 | $3,437,500.00 |
Drop-in alternatives for 10AX115R2F40E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AX115R2F40E1SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| Number of I/O | 342 |
| DSP Blocks | 1,518 (variable-precision 20x19) |
| Transceivers | GX transceivers up to 14.2 Gbps |
| Hard Memory Controllers | Yes (DDR4, DDR3, LPDDR3, QDR IV) |
| Hard PCIe Block | PCIe Gen3 x8 |
| Process Technology | 20 nm TSMC tri-gate (FinFET) |
| Speed Grade | -2 |
| Temperature Grade | Extended (-E1) |
| Package | 1517-ball FCBGA (F40) 40x40 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Configuration | SRAM-based, supports partial reconfiguration |
10AX115R2F40E1SG 1517-ball fcbga (f40) 40x40 mm Pin Configuration Guide
Complete pinout information for 10AX115R2F40E1SG (1517-ball fcbga (f40) 40x40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R2F40E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R2F40E1SG is suitable for 6 applications: 4K/8K Video Processing Pipeline, 100G Ethernet MAC Aggregation / Data Center, Wireless Baseband / CPRI Front End, Military Radar / Software Defined Radio, Medical Imaging Accelerator (CT/MRI/Ultrasound), ASIC Prototyping and Emulation.
4K/8K Video Processing Pipeline
The 10AX115R2F40E1SG is well-suited for 4K and 8K video processing pipelines due to its 1,150,000 logic elements and 1,518 variable-precision DSP blocks, which deliver the parallel arithmetic throughput required for real-time color space conversion, scaling, and frame-rate conversion. The 14.2 Gbps GX transceivers support 12G-SDI and DisplayPort 1.4 aggregation, while the 68.86 Mbits of embedded memory buffer multiple frames of video at 4K60 resolution without external DDR access stall. Designers typically pair this FPGA with the 12G-SDI receiver IP from Intel and route the FPGA on a 12-layer PCB with continuous GND planes beneath the F40 1517-ball FCBGA to maintain signal integrity. The 10AX115R2F40E1SG dissipates approximately 20-30 W in this workload, requiring a heat-spreader and moderate airflow.
Recommended
100G Ethernet MAC Aggregation / Data Center
The 10AX115R2F40E1SG supports up to 14.2 Gbps per GX transceiver, allowing engineers to aggregate 4x 25G Ethernet lanes or implement 100G Ethernet MAC aggregation using multiple transceiver channels. The 342 user I/Os support QSFP28 module interfaces and high-speed memory sidebands for external DDR4-2400 buffers. Hardened PCIe Gen3 x8 IP enables direct host offload acceleration in data center fabric cards, with the FPGA bridging between PCIe and the 100G network. The 1,150K logic elements and 1,518 DSP blocks accelerate compression, encryption, or packet classification in hardware. Compared to a switching ASIC, the FPGA allows in-field reprogrammability for protocol updates without respin. Cooling requires a heatsink and 200-300 LFM airflow at full 100G line rate.
Recommended
Wireless Baseband / CPRI Front End
Wireless baseband units (BBUs) and remote radio heads (RRHs) use the 10AX115R2F40E1SG to terminate CPRI or eCPRI links from radio antennas and perform digital up/down conversion, crest-factor reduction, and digital predistortion. The 14.2 Gbps GX transceivers support multiple CPRI option 3, 5, and 7 line rates up to 9.8 Gbps with margin for 10.1 Gbps eCPRI. The 1,518 DSP blocks deliver the GMAC/s throughput needed for LTE and 5G NR channel aggregation, while 68.86 Mbits embedded memory buffers symbol-level processing. Designers often pair the FPGA with a timing reference such as a GPS-disciplined OCXO on the same board. The 1517-ball FCBGA F40 package supports dense BGA layout with controlled-impedance transceiver traces.
Recommended
Military Radar / Software Defined Radio
Military radar and SDR applications leverage the 10AX115R2F40E1SG's combination of high DSP throughput (1,518 blocks) and 14.2 Gbps transceivers for IF sampling, beamforming, and pulse compression. The device's 1,150K logic elements implement adaptive beamforming weights and real-time FFT pipelines for synthetic aperture radar (SAR) processing. The extended E1 temperature grade supports ground-mobile and shipboard deployments, while the industrial I1 variant (10AX115R2F40I1SG) covers airborne and extreme-environment applications. Embedded memory (68.86 Mbits) stores range-Doppler maps for SAR image formation. Designers integrate the FPGA with high-speed ADCs and DACs over JESD204B/C links for multi-GSPS data conversion.
Recommended
Medical Imaging Accelerator (CT/MRI/Ultrasound)
Medical imaging systems (CT, MRI, ultrasound, PET) use the 10AX115R2F40E1SG for real-time image reconstruction algorithms such as filtered back-projection, iterative reconstruction, and beamforming for ultrasound. The 1,518 DSP blocks deliver the TMACs of throughput required for sub-millisecond reconstruction latency, while the 68.86 Mbits embedded memory caches intermediate sinograms or k-space data. The 14.2 Gbps transceivers accept raw data from high-speed medical-grade ADCs and forward reconstructed images to display controllers over DisplayPort or HDMI. The device is suitable for IEC 60601-1 compliant systems when paired with appropriate isolation and power architecture. Real-time image processing at 30-60 fps is achievable with optimized Quartus Prime synthesis.
Recommended
ASIC Prototyping and Emulation
ASIC and ASSP design teams use the 10AX115R2F40E1SG as a high-density prototyping vehicle before taping out a custom ASIC. With 1,150K logic elements, the device can map large RTL blocks while preserving timing visibility and debug visibility through SignalTap II and SystemConsole. Multiple 10AX115R2F40E1SG FPGAs can be tiled on a logic-module board using 14.2 Gbps transceivers as chip-to-chip interconnect, emulating multi-die ASIC systems. The Quartus Prime software supports HardCopy ASIC migration paths when production volume warrants. Compared to ASIC emulation platforms such as Cadence Palladium, this FPGA-based flow offers lower upfront cost but lower clock speeds (~50-100 MHz) for full-chip validation.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R2F40E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R1F40E1SG | 10AX115R1F40I1SG | 10AX115N2F40E1SG | 10AX115N3F40E2LG | 10AX115N4F40E3LG | 10AX090R2F40E1SG |
|---|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (F40) 40x40 mm | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Embedded Memory | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 68.86 Mbits | 53.92 Mbits |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| Transceivers | GX up to 14.2 Gbps | GX up to 14.2 Gbps | GX up to 14.2 Gbps | None (logic only) | None (logic only) | None (logic only) | GX up to 14.2 Gbps |
| Speed Grade | -2 | -1 (slower Fmax) | -1 (slower Fmax) | -2 | -3 (faster Fmax) | -4 (fastest Fmax) | -2 |
| Temperature Grade | Extended (E1, 0C to +100C) | Extended (E1) | Industrial (I1, -40C to +100C) | Extended (E1) | Extended (E2) | Extended (E3) | Extended (E1) |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes (LG suffix) | Yes / Yes (LG suffix) | Yes / Yes |
Key Differentiators
- 1,150K LE in F40 1517-FCBGA - highest density in Arria 10 GX F40 tier (vs 10AX090R2F40E1SG)
- GX transceiver-equipped with 14.2 Gbps rate - enables 10G/40G Ethernet and PCIe Gen3 (vs 10AX115N2F40E1SG)
- Mid-tier -2 speed grade balances cost and Fmax performance (vs 10AX115R1F40E1SG)
Design Notes
The 10AX115R2F40E1SG requires a multi-rail power architecture with at least four rails: 0.85V core (VCC), 0.9V auxiliary (VCCA), 1.1V transceiver supply (VCCR_GXB/VCCP_GXB), and 1.8V/2.5V/3.3V I/O (VCCIO). Per Intel's Arria 10 device datasheet, total power consumption at full utilization can reach 25-40W, requiring a buck-converter array with at least 30A capability on the 0.85V core rail. Decouple each rail with 0.1uF, 1uF, and 22uF ceramic capacitors placed within 5 mm of the respective power pins. Use the Quartus Prime Early Power Estimator before final PCB layout to validate rail budgeting.
The 1517-ball FCBGA F40 package exposes a thermal lid on the top side for heat-spreader attachment. Per the Arria 10 datasheet, theta_JA for the F40 package with a heat-spreader is approximately 0.5 C/W. For typical 25-30W designs, a heat-spreader plus 200 LFM airflow is sufficient; for high-utilization 40W designs, a heat-sink with thermal interface material (TIM) is required. The Extended (E1) grade supports junction temperatures up to 100C. For industrial applications with -40C cold-start, use the I1 variant (10AX115R2F40I1SG) which is rated -40C to +100C.
The F40 1517-ball FCBGA requires a multi-layer PCB (typically 12+ layers) with controlled-impedance traces for the 14.2 Gbps GX transceivers. Use 100-ohm differential routing for transceiver pairs with length matching within 150 um. Continuous reference planes must exist on all layers beneath the BGA field; the BGA break-out should use micro-via-in-pad (VIPPO) technology to escape the 1.0 mm ball pitch. Power plane stitching capacitance should be placed adjacent to each power pin. The exposed thermal lid must be soldered to the PCB with a thermal pad pattern for heat dissipation. Source: Intel Arria 10 device handbook pin connection guidelines.
Do not confuse the GX (R) variant with the GT variant - GT parts have 28.05 Gbps transceivers and different silicon, so the pinout of a GT device in the F40 package is NOT drop-in compatible with this R-variant. Also note that 'R' indicates transceiver-equipped while 'N' indicates logic-only; using an N-variant for a design requiring transceivers is a common mistake. Ensure your Quartus Prime project selects the exact OPN 10AX115R2F40E1SG (not just 10AX115R2F40) to get the correct pinout and timing models. Lastly, watch for the -E1 versus -I1 temperature grade when designing for outdoor or industrial deployments.
Compliance Information
RoHS compliant and lead-free per distributor listing (YIC Electronics, Mouser). Not AEC-Q100 qualified - this is a commercial-grade FPGA. For industrial temperature, use the I1 variant 10AX115R2F40I1SG. REACH compliance is standard per Intel FPGA environmental policy.
