10AX115R1F40E1SG - Arria 10 GX 1150K LE FPGA | Intel | F40 BGA
MPN: 10AX115R1F40E1SG ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for 10AX115R1F40E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R2F40E1SG
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View Datasheet →10AX115R1F40I1SG
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View Datasheet →10AX115R2F40I2SG
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View Datasheet →10AX115R3F40I3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115R1F40E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) |
| DSP Blocks | 342 |
| DSP Format | Variable-precision (fixed/floating-point) |
| Transceiver Max Data Rate | 14.4 Gbps |
| Hard PCIe Cores | PCIe Gen3 x8 |
| Hard Memory Controllers | 2 |
| Maximum User I/O | 768 |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Speed Grade | R1 (commercial) |
| Temperature Grade | E1 (enhanced) |
| Package | 1517-BBGA / FCBGA (F40), 40 x 40 mm |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX115R1F40E1SG 1517-bbga / fcbga (f40), 40 x 40 mm Pin Configuration Guide
Complete pinout information for 10AX115R1F40E1SG (1517-bbga / fcbga (f40), 40 x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R1F40E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R1F40E1SG is suitable for 6 applications: 100G Ethernet Line Cards / OTN Optical Transport, Broadcast Video Processing (4K/UHD), Radar and Electronic Warfare Preprocessing, FPGA-based PCIe Accelerator Cards, Medical Imaging Pipelines, High-Speed Test & Measurement Instrumentation.
100G Ethernet Line Cards / OTN Optical Transport
The 10AX115R1F40E1SG is well-suited for 100G Ethernet line cards and OTN/WDM optical transport equipment, where its 1,150K logic elements provide the throughput needed for packet processing, MAC, FEC (RS-FEC), and OTN framing, while 24 transceivers at up to 14.4 Gbps (or higher with gearboxing) enable 4x25G, 4x28G, or 10x10G breakout configurations. Placed on a 100G CFP/CFP2/CFP4 or QSFP28 line card, the FPGA handles wire-speed lookups, traffic management, and MACSec acceleration. Compared to ASSP-based network processors, the Arria 10 GX offers flexible protocol support and faster time-to-market but requires more power. The 0.9V core and 20nm process keep typical power in the 35-45W range for full-featured designs.
Recommended
Broadcast Video Processing (4K/UHD)
The 10AX115R1F40E1SG is widely used in 4K/UHD broadcast video processing systems such as SDI routers, frame synchronizers, up/down/cross converters, and HDR/wide-color-gamut pipelines, where its 1,150K LEs and 342 variable-precision DSP blocks provide the compute for multi-stream 12G-SDI handling and color-space conversion. Placed on a broadcast processing card, the FPGA aggregates up to 16 streams of 12G-SDI (12 Gbps each) and performs real-time deinterlacing, scaling, and HDR tone-mapping with sub-frame latency. The hard PCIe Gen3 x8 IP enables direct DMA to a host server for storage or further processing. The Arria 10 GX's SDI IP supports ST 424, ST 2081, ST 2082, and ST 2110, making it the workhorse of modern broadcast infrastructure.
Recommended
Radar and Electronic Warfare Preprocessing
The 10AX115R1F40E1SG serves as a real-time digital signal preprocessing engine in radar and electronic warfare systems, where its 342 variable-precision DSP blocks (operating at up to 750 MHz) deliver up to 1.6 TMACS of fixed/floating-point throughput for pulse compression, MTI filtering, CFAR detection, and digital beamforming. Placed between the RF front-end ADCs and the host CPU/GPU, the FPGA reduces the data rate by 100-1000x before forwarding detections. The 20nm process and military temperature support make the 10AX115R1F40I1SG variant suitable for SWaP-constrained airborne applications. Compared to ASIC implementations, Arria 10 GX offers reconfigurability for evolving threat libraries while maintaining the real-time performance required by defense systems.
Recommended
FPGA-based PCIe Accelerator Cards
The 10AX115R1F40E1SG is ideal for FPGA-based PCIe Gen3 x8 accelerator cards in data centers and high-performance computing, where the hard PCIe Gen3 IP core delivers up to 8 GB/s host-to-FPGA bandwidth, and the 1,150K logic elements enable full-pipeline compression (Snappy, ZSTD), encryption (AES-256-GCM), machine-learning inference (CNN/RNN), or database acceleration. Placed as a standard half-height, half-length PCIe card, the Arria 10 GX offloads compute-intensive kernels from the host CPU while the hard memory controllers and DDR4 interfaces handle large working sets. Compared to GPU accelerators, FPGA implementations deliver 10-30x better performance-per-watt for streaming workloads, with sub-microsecond latency and deterministic jitter.
Recommended
Medical Imaging Pipelines
The 10AX115R1F40E1SG is well-matched to medical imaging systems such as CT, MRI, ultrasound, and digital X-ray, where its real-time image reconstruction (back-projection, filtered back-projection, iterative reconstruction) and image enhancement algorithms demand high DSP throughput. With 342 variable-precision DSP blocks and 68.86 Mbit of embedded memory, the FPGA can perform 1024x1024 reconstructions at 30 fps with sub-100ms latency. Placed between the sensor digitizers and the host workstation, the Arria 10 GX reconstructs images in real time while streaming raw data to the host for archival. The industrial temperature grade (10AX115R1F40I1SG) supports imaging carts and portable ultrasound units in clinical environments.
Recommended
High-Speed Test & Measurement Instrumentation
The 10AX115R1F40E1SG is frequently deployed in high-end oscilloscopes, protocol analyzers, and signal generators, where its 14.4 Gbps transceivers enable real-time serial bus analysis (PCIe, USB 3.1, SATA, SAS, 100G Ethernet), and its 1,150K LEs drive complex triggering, protocol decoding, and DSP-based post-processing. Placed on the acquisition board, the Arria 10 GX captures high-speed signals while the on-chip DSP performs real-time FFTs, eye-diagram analysis, and jitter decomposition. The hard PCIe Gen3 x8 IP enables streaming waveform data to a host PC for display. Compared to oscilloscope ASSPs, the FPGA's reconfigurable fabric supports evolving test standards without silicon redesign.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R1F40E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R2F40E1SG | 10AX115R3F40E2SG | 10AX115R1F40I1SG | 10AX115R2F40I2SG | 10AX115R3F40I3SG |
|---|---|---|---|---|---|---|
| Package | 1517-BBGA FCBGA (F40, 40x40 mm) | 1517-BBGA FCBGA (F40, 40x40 mm) - same | 1517-BBGA FCBGA (F40, 40x40 mm) - same | 1517-BBGA FCBGA (F40, 40x40 mm) - same | 1517-BBGA FCBGA (F40, 40x40 mm) - same | 1517-BBGA FCBGA (F40, 40x40 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family / Logic Elements | Arria 10 GX / 1,150,000 LE | Arria 10 GX / 1,150,000 LE | Arria 10 GX / 1,150,000 LE | Arria 10 GX / 1,150,000 LE | Arria 10 GX / 1,150,000 LE | Arria 10 GX / 1,150,000 LE |
| Speed Grade | R1 (commercial) | R2 (faster than R1) | R3 (fastest commercial) | R1 (industrial) | R2 (industrial) | R3 (industrial) |
| Temperature Grade | E1 (enhanced commercial) | E1 | E2 | I1 (industrial -40C to +100C) | I2 (industrial) | I3 (industrial) |
| Embedded Memory | 68,857,560 bits (68.86 Mbit) | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits |
| DSP Blocks | 342 | 342 | 342 | 342 | 342 | 342 |
| Hard PCIe Cores | PCIe Gen3 x8 | PCIe Gen3 x8 | PCIe Gen3 x8 | PCIe Gen3 x8 | PCIe Gen3 x8 | PCIe Gen3 x8 |
Key Differentiators
- Mid-range Arria 10 GX density with full F40 pinout (vs 10AX066H4F34I3SG (smaller Arria 10 device in F34 package))
- Commercial temperature grade with R1 baseline Fmax (vs 10AX115R1F40I1SG (R1 + industrial temperature))
- Pin-compatible with R2/R3 speed grade variants (vs 10AX115R2F40E1SG (R2 commercial))
- Hard PCIe Gen3 + hard memory controllers + DSP fabric (vs Smaller 10AX066 device)
Design Notes
The 1517-ball FCBGA F40 package demands a 12+ layer PCB stackup with buried capacitance for power integrity. Recommended stackup: 1oz copper outer layers with low-loss (Df < 0.005) high-Tg FR-4 or mid-loss Tg-150 PCB materials; via-in-pad with filled-and-capped micro-vias for the BGA break-out; 85 ohm differential and 50 ohm single-ended controlled impedance for transceiver and LVDS pairs. Reference the Intel Arria 10 GX F40 package PCB design guidelines for ball map and escape routing.
Transceiver channels up to 14.4 Gbps require matched-length routing with intra-pair skew < 150 mil (and ideally < 100 mil at 14.4 Gbps) and channel loss budget under 12 dB at 7 GHz. Reference Intel's IBIS-AMI models for the 10AX115 in the Quartus Prime installation; simulate the channel with Intel's Signal Integrity Toolkit before committing to PCB fabrication. Place AC-coupling capacitors within 200 mil of the receiver pins and maintain a continuous reference ground plane beneath all high-speed serial lanes.
Estimated: a fully featured 10AX115R1F40E1SG design with active transceivers, DSP, and BRAM typically draws 30-45W from the 0.9V core supply. Design a 6+ phase buck regulator with adaptive voltage positioning, sized for at least 50A continuous, and place input/output ceramic bulk capacitors (22uF X7R per phase plus 470uF polymer) within the BGA footprint. Use the SmartVID or fixed-0.9V core voltage scheme based on Quartus power analyzer estimates; include proper decoupling per the Intel Arria 10 GX power distribution guidelines.
Estimated: a 35W design at the F40 package will see junction temperature rise of approximately 35-40 C above ambient with 400 LFM forced air. Attach a 25x25 mm heatsink with thermal interface material (TIM) of conductivity 5-8 W/mK. For industrial (-40C to +100C) deployments (I1/I2/I3 variants), derate by 15% and validate with a thermal characterization chamber; the 10AX115R1F40I3SG variant has the highest worst-case junction temperature due to the faster R3 speed grade.
Do not assume the F40 ball-map is pin-compatible with smaller Arria 10 GX packages such as F27, F29, F34, or F45 - the ball pitch and I/O count differ. Always verify the exact OPN (Ordering Part Number) for the package code, speed grade, and temperature grade before PCB fab, and confirm with the Quartus Prime pin planner. Also avoid mixing commercial (E) and industrial (I) temperature grades within a single design, as their thermal profiles and screening differ.
Compliance Information
RoHS compliant per distributor listings (DigiKey, Mouser, AmpHeo). The E1 temperature grade is commercial; AEC-Q100 is not applicable for FPGAs in this family. For industrial temperature variants, choose 10AX115R1F40I1SG or 10AX115R3F40I3SG.
