10AX115R1F40I1SG - Arria 10 GX FPGA, 1.15M LE, FCBGA-1517 | Intel
MPN: 10AX115R1F40I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12041.19 | $12,041.19 |
| 10 | $10837.07 | $108,370.70 |
| 100 | $9634.95 | $963,495.00 |
| 500 | $8435.83 | $4,217,915.00 |
| 1,000 | $7232.71 | $7,232,710.00 |
Drop-in alternatives for 10AX115R1F40I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R1F40E1SG
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View Datasheet →10AX115R1F40I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Device Class | 10AX115 |
| Logic Elements | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Embedded Memory | 68,857,856 bits |
| Embedded 18x18 Multipliers | 1,518 |
| User I/O Count | 342 |
| High-Speed Transceivers | 24 channels, up to 14.4 Gbps |
| Hardened Memory Controllers | Yes (DDR3/DDR4 with ECC) |
| Hard PCIe Gen3 IP | Yes |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V (SmartVID) |
| Package | 1517-ball FCBGA (F40 package) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed/Power Grade | F40 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Modes | JTAG, Active Serial (AS), Fast Passive Parallel (FPP) |
10AX115R1F40I1SG 1517-ball fcbga (f40 package) Pin Configuration Guide
Complete pinout information for 10AX115R1F40I1SG (1517-ball fcbga (f40 package) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R1F40I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R1F40I1SG is suitable for 7 applications: 100G Ethernet Line-Card Design, PCIe Gen3 Endpoint Accelerator, 4K/8K Video Broadcast Processing, 5G Wireless Baseband Processing, Military Radar Signal Processing, Data-Center Hardware Accelerator, Test and Measurement Instrumentation.
100G Ethernet Line-Card Design
The 10AX115R1F40I1SG fits 100G Ethernet line cards because it integrates 24 transceivers at up to 14.4 Gbps, sufficient to aggregate 10 lanes of 10.3125 Gbps (CAUI-10) or 4 lanes of 25.78 Gbps via on-chip gearbox logic. The 1.15M LE capacity is enough to instantiate full 100G MAC, PCS, and packet processing pipelines with room for QoS shaping and telemetry. Hardened 100G Ethernet IP in Quartus Prime accelerates time-to-market. Operating at industrial temperature and SmartVID-managed 0.9 V core, the device delivers predictable power across deployment scenarios.
Recommended
PCIe Gen3 Endpoint Accelerator
The 10AX115R1F40I1SG is ideal for PCIe Gen3 x8 endpoint accelerator cards due to its hardened Gen3 PCIe IP block, eliminating soft-IP overhead and saving ~50K LEs. The 14.4 Gbps transceivers carry PCIe Gen3 line rate directly without external PHY, and 1,518 18x18 multipliers accelerate DSP workloads such as encryption, compression, or AI inference. With 68.86 Mbit embedded memory and DDR4 controller support, the device buffers large DMA payloads while maintaining deterministic latency. Quartus Prime PCIe reference designs shorten integration timelines.
Recommended
4K/8K Video Broadcast Processing
The 10AX115R1F40I1SG fits 4K/8K video broadcast pipelines because its 1,518 DSP blocks handle real-time 12G-SDI deserializers, HDR tone mapping, and multi-stream scaling simultaneously. The 24 transceivers accept quad-link 12G-SDI or SMPTE 2110 IP streams at 10 Gbps each, while 342 GPIOs interface to mezzanine cards, front-panel controls, and timing references. SmartVID reduces power during lower-resolution segments, extending rack thermal headroom in broadcast studios.
Recommended
5G Wireless Baseband Processing
The 10AX115R1F40I1SG fits 5G wireless baseband and CPRI fronthaul designs thanks to 14.4 Gbps transceivers that support CPRI Option 7 (9.83 Gbps) and Option 8 (24.33 Gbps via aggregation) with headroom. The 1.15M LE logic capacity hosts LDPC/turbo decoders, FFT/iFFT engines, and beamforming weight calculations for massive MIMO. Industrial temperature rating supports outdoor small-cell deployments, and SmartVID reduces idle power between scheduling slots.
Recommended
Military Radar Signal Processing
The 10AX115R1F40I1SG suits military radar front-end processing because its 24 transceivers at 14.4 Gbps aggregate ADC outputs from multi-channel phased-array antennas. The 1,518 DSP blocks run pulse compression, MTI filtering, and FFT-based Doppler processing at real-time rates, while industrial temperature rating meets MIL-STD-810 environmental profiles with appropriate PCB hardening. Hardware floating-point support accelerates beamforming weight computation.
Recommended
Data-Center Hardware Accelerator
The 10AX115R1F40I1SG is a strong fit for data-center hardware accelerator cards because its 1.15M LE capacity maps large AI inference graphs, encryption pipelines, or storage offload engines. With PCIe Gen3 x8 hard IP and 24 transceivers, a single card delivers ~50 Gbps host-to-FPGA bandwidth. 68.86 Mbit embedded memory plus DDR4 controller support multi-megabyte weight buffers, while Quartus Prime OpenCL/HLS flows let software teams port algorithms without RTL expertise.
Recommended
Test and Measurement Instrumentation
The 10AX115R1F40I1SG suits high-end T&M instrumentation because its logic density and DSP count handle real-time FFT, vector signal analysis, and protocol decoding for oscilloscopes and BERT testers. The 14.4 Gbps transceivers accept high-speed ADC/DAC data streams, while 342 GPIOs interface to display controllers, front-panel buttons, and trigger logic. Industrial temperature support extends bench-to-field use, and Quartus Prime signal integrity toolkits simplify timing closure at high Fmax.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R1F40I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R1F40E1SG | 10AX115N1F40I1SG | 10AX115N2F40I1SG | 10AX115R2F40I1SG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Device Class / Logic Elements | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE | 10AX115 / 1,150,000 LE |
| Speed Grade | R1 (highest Fmax) | R1 (same as this product) | N1 (lower Fmax, lower power) | N2 (lower Fmax) | R2 (slightly lower Fmax, lower power) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Count / Rate | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps | 24 ch / 14.4 Gbps |
| User I/O | 342 | 342 | 342 | 342 | 342 |
| Hard PCIe Gen3 IP | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest Fmax speed grade in the 10AX115 F40 FCBGA family (vs 10AX115N1F40I1SG (N1 grade))
- Industrial temperature range for harsh-environment deployments (vs 10AX115R1F40E1SG (E1 commercial grade))
- Same F40 FCBGA footprint across speed grades for power-only redesign (vs 10AX115N3F40I2SG (N3 grade, I2 temp))
Design Notes
The 1517-ball FCBGA package demands a high-density PCB stack-up with microvias (laser-drilled) for breakout. Use a 1-2-1 or 1-3-1 stack-up with at least 4-6 routing layers beneath the BGA. Escape routing for the 1.0 mm ball pitch requires HDI (High-Density Interconnect) processes; standard through-via PCBs cannot escape the inner balls. Plan for impedance-controlled 85-ohm differential pairs for transceiver channels and 50-ohm single-ended for GPIO.
Estimated: At full utilization (24 transceivers active, ~70% logic toggle rate, 1.15M LE), power dissipation can reach 25-35 W. The 1517-ball FCBGA has a junction-to-ambient thermal resistance theta_JA of approximately 8-12 C/W with a 4-layer JEDEC test board. To maintain industrial-grade junction temperature below 100C, attach a heatsink with thermal interface material and ensure airflow of at least 200 LFM across the device. Use Quartus Prime Early Power Estimator (EPE) for design-specific budgeting.
Transceiver channels at 14.4 Gbps require strict signal-integrity practices: matched-length differential pairs within 5 mil tolerance, AC-coupled interconnects (per the datasheet), reference plane continuity for every via transition, and isolation from noisy digital return paths. Use the Arria 10 GX Transceiver Toolkit in Quartus Prime to validate channel margins after PCB fab. Place decoupling connectors within 100 mil of every power pin, with a mix of bulk, mid-frequency, and high-frequency MLCCs.
Common pitfalls: (1) omitting SmartVID controller support - the device expects an external SmartVID regulator for dynamic voltage scaling; (2) ignoring MSEL pin strapping - wrong MSEL values cause configuration failure; (3) underestimating configuration time - 1.15M LE bitstreams approach 35-40 Mbit, requiring fast AS or FPP modes for sub-second boot; (4) forgetting JTAG chain integrity - check TCK pull-ups and TMS/TDI sequencing per IEEE 1149.1; (5) not validating transceiver reference clock jitter - use a low-jitter clock source meeting the datasheet mask.
Power-rail sequencing must follow the Arria 10 GX power-up guide: VCC, VCCP, VCCPT, VCCERAM, VCCBAT ramp in the documented order with monotonic edges. SmartVID rails (VCC, VCCPT) communicate with the external regulator over an I2C/SVID bus - pull-ups on the SVC/SVD pins must be sized per I2C standard. Decoupling must include 0603-size MLCCs immediately adjacent to every power pin plus bulk polymer/tantalum capacitors at board edges for transient current demand during transceiver PLLs locking.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified (not an automotive-grade part). Halogen-free status not stated in verified web data - marked unknown.
