10AX115R3F40E2LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
MPN: 10AX115R3F40E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1605 | $160,500.00 |
| 500 | $1510 | $755,000.00 |
| 1,000 | $1425 | $1,425,000.00 |
Drop-in alternatives for 10AX115R3F40E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R3F40E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4925 / Unit
View Datasheet →10AX115R2F40E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10300 / Unit
View Datasheet →10AX115R4F40E2LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115R2F40I2LG
✅ Drop-In✓ In Stock
$4310 / Unit
View Datasheet →10AX115R2F40I2SG
✅ Drop-In✓ In Stock
$7189.2 / Unit
View Datasheet →10AX115R2F40E2SG
✅ Drop-In✓ In Stock
$5410 / Unit
View Datasheet →10AX115R3F40E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Product Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| DSP Blocks | 1,518 (with integrated hard floating-point) |
| Maximum User I/O | 342 |
| Number of Pins / Balls | 1517 |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Transceiver Data Rate | 28.05 Gbps |
| Hard Memory Controller | Yes (DDR4/DDR3/QDR IV) |
| Hard PCIe Controller | Yes (PCIe Gen3 x8 hard IP) |
| Operating Temperature | -40 C to +100 C (extended) |
| Temperature Grade | Extended (E) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Programming Tool | Intel Quartus Prime Pro / Standard |
10AX115R3F40E2LG fc-fbga (flip-chip fine-pitch bga) Pin Configuration Guide
Complete pinout information for 10AX115R3F40E2LG (fc-fbga (flip-chip fine-pitch bga) package) with 1517 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R3F40E2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1517 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R3F40E2LG is suitable for 7 applications: 100G/40G Ethernet Line Card Packet Processing, Medical Imaging DSP Front-End (CT / MRI / Ultrasound), Radar Signal Processing (Phased Array / EW), Software Defined Radio Baseband, Test & Measurement Digitizer Back-End, ASIC Prototyping (Mid-to-Large Designs), Broadcast Video Processing (4K/UHD).
100G/40G Ethernet Line Card Packet Processing
The 10AX115R3F40E2LG is well-suited for 100G/40G Ethernet line cards because its GTx transceivers natively support 28.05 Gbps CAUI-4 lanes and its 1.15 MLE provides ample logic for packet classification, hierarchical QoS, and policing. Its 68.8 Mb embedded memory absorbs short bursts without DDR4 round-trips, dropping average latency under load. The hard PCIe Gen3 x8 IP accelerates the host-CPU DMA channel for north-bound traffic. Designers typically pair it with external 25G Ethernet PHY / MAC partners when line-side serDes are needed beyond 28 Gbps. Power dissipation at full transceiver load is high; an enclosure-mounted heatsink or cold plate is required for sustained 100G operation.
Recommended
Medical Imaging DSP Front-End (CT / MRI / Ultrasound)
The 10AX115R3F40E2LG fits medical-imaging front-end DSP where 1,518 hard floating-point DSP blocks enable real-time beamforming for ultrasound, real-time Fourier reconstruction for MRI, and back-projection for CT. Its 1.15 MLE drives per-channel signal conditioning at multi-MHz sampling without external GPUs. Multi-gigabit transceivers stream raw transducer data from the analog front-end directly into the FPGA fabric. Medical imaging systems benefit from the device's deterministic latency and IEC 61508/ISO 14962 compliance potential at the integration level. Use it with an external DDR4 SO-DIMM for image buffer storage and a dedicated host CPU for clinical UI rendering.
Recommended
Radar Signal Processing (Phased Array / EW)
For phased-array radar and electronic-warfare (EW) systems, the 10AX115R3F40E2LG provides the logic and transceiver bandwidth needed to digitize multiple AESA element streams and run space-time adaptive processing (STAP) at line rate. Its 1.15 MLE and 1518 DSP blocks sustain 100+ MHz per-element FFT throughput across a 64-element array. GTx transceivers handle the long-haul fiber links from remote antenna head-ends. Designers also leverage the device's hard floating-point DSP for clutter-suppression algorithms that exceed fixed-point dynamic range in dense-target environments.
Recommended
Software Defined Radio Baseband
The 10AX115R3F40E2LG serves as the baseband processing engine in SDR base stations supporting CPRI 9.8G/4.9G and Open Fronthaul. Its GTx transceivers backhaul digitized RF from remote radio heads (RRH) into the FPGA fabric, where 1.15 MLE and 1518 DSP blocks implement LTE/NR PHY layer functions including FFT/iFFT, channel coding, and MIMO spatial processing. Its hard PCIe Gen3 x8 IP enables direct attach to a baseband host CPU or SoC. The 68.8 Mb embedded memory buffers sub-frame processing without DDR round-trips, reducing air-interface latency below 1 ms.
Recommended
Test & Measurement Digitizer Back-End
The 10AX115R3F40E2LG supports high-end test & measurement digitizers by aggregating ADC samples from multiple JESD204B/C links into the FPGA fabric at multi-GSPS rates. Its 1.15 MLE runs real-time FFT, channelization, and trigger-decision logic at full sample rate without resorting to external GPU pre-processing. The 1,518 DSP blocks implement windowing, peak detection, and digital down-conversion in real time. Engineers typically pair this FPGA with dual 4 GSPS ADCs to build 8 GHz instantaneous-bandwidth oscilloscopes and signal analyzers.
Recommended
ASIC Prototyping (Mid-to-Large Designs)
The 10AX115R3F40E2LG is widely used for ASIC prototyping because its 1.15 MLE density matches mid-to-large ASIC gate counts (after taking into account the FPGA-overhead factor of 4-7x). Designers map ASIC RTL into the Arria 10 fabric via Quartus Prime Pro with multi-FPGA partitioning over PCIe or dedicated GTx backplanes. The 342 user I/O pins expose a rich prototyping pin map for connecting multiple FPGAs in a mesh. This role is supported by Intel's Quartus Pro Design and Pro Edition ASIC prototyping flow plus soft logic tools.
Recommended
Broadcast Video Processing (4K/UHD)
The 10AX115R3F40E2LG supports broadcast video processing for 4K/UHD workflows including 12G-SDI ingest, color-space conversion, and HDR/WCG mapping. Its 1518 DSP blocks accelerate scaling and deinterlacing kernels, while its 68.8 Mb embedded memory acts as multi-frame line buffers. GTx transceivers receive uncompressed 12G-SDI streams directly from the SDI deserializer. The combination of high logic density and external DDR4 bandwidth is well-suited for broadcast switchers and IP gateway cards used in live production trucks.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R3F40E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R3F40E2SG | 10AX115R2F40E2LG | 10AX115R4F40E2LG | 10AX115R2F40I2LG | 10AX115R2F40I2SG | 10AX115R2F40E2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -3 (this product) | -3 (same) | -2 (slower) | -4 (fastest) | -2 (slower) | -2 (slower) | -2 (slower) |
| Temperature Grade | Extended (E2) | Commercial (S2) | Extended (E2) | Extended (E2) | Industrial (I2) | Industrial (I2) | Extended (E2) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 | 342 |
| Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps |
Key Differentiators
- Speed grade -3 in the Arria 10 family for higher Fmax (vs 10AX115R2F40E2LG)
- Extended temperature grade for outdoor and industrial deployments (vs 10AX115R3F40E2SG)
- GTx transceiver tile integration eliminates external PHY (vs 10AX115N3F40E2LG)
Design Notes
The 1517-ball FC-FBGA package requires microvia stack-up (4-2-4 or 5-2-5 laser-drilled via-in-pad or staggered microvia construction). Standard 8/8-mil-pitch through-vias cannot escape a fine-pitch BGA - any other stack-up will create shorts or open circuits during reflow. Verified design reference: Intel Arria 10 GX FPGA Board Design Guidelines (AN-628-class app note family). Plan BGA escape on inner layers to maximize signal-integrity margins for GTx channels.
GTx transceiver channels running at 25 Gbps+ require length-matched differential pair routing with intra-pair skew under 1 ps and inter-pair skew budgeted against the FPGA's GTx receiver skew tolerance. Use a 100-ohm differential impedance (90 ohm optional) with 4-layer stack-up referenced to a solid ground plane. Crosstalk isolation between adjacent TX and RX pairs must be maintained via at least 3W spacing on the same layer. Refer to the Arria 10 GX Transceiver User Guide for full SI margins.
Estimated: At 100% transceiver utilization (all 28 Gbps channels active), the 10AX115R3F40E2LG dissipates approximately 25-35 W. With the FC-FBGA package theta_JA in the 8-12 C/W range (depending on PCB stack-up and airflow), junction temperature can exceed 100 C without a heatsink or forced-air cooling. Plan for a top-side heatsink with TIM2 thermal interface material and at least 200 LFM airflow for sustained 28 Gbps operation. Power-aware Quartus settings help reduce worst-case thermal load by 15-25%.
Do not assume all 1517 balls are user I/O - many are power, ground, and configuration. The F40 package pin count exceeds user I/O because of the dedicated power/ground and JTAG/MSEL/AS configuration balls. Read the F40 Pin Connection Guidelines PDF before PCB symbol capture. Do not forget the configuration mode pins (MSEL[3:0], nCONFIG, nSTATUS, CONF_DONE) - incorrect mode selection bricks the FPGA boot sequence. Always check the Intel Quartus Prime Pin Planner tool for ball bank assignments and voltage compatibility.
Compliance Information
RoHS and lead-free per Intel product page. AEC-Q100 not applicable (FPGAs are not automotive-grade discrete semiconductors). Conflict-minerals compliance per Intel Conflict Minerals Report.
