10AX115R2F40I2SG - Arria 10 GX FPGA 1150K LE | Intel
MPN: 10AX115R2F40I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9636.05 | $9,636.05 |
| 10 | $8945.32 | $89,453.20 |
| 50 | $8248.1 | $412,405.00 |
| 100 | $7721.45 | $772,145.00 |
| 250 | $7189.2 | $1,797,300.00 |
Drop-in alternatives for 10AX115R2F40I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115R2F40I2LG
✅ Drop-In✓ In Stock
$4310 / Unit
View Datasheet →10AX115R1F40I1SG
✅ Drop-In✓ In Stock
$7232.71 / Unit
View Datasheet →10AX115R2F40E2SG
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$5410 / Unit
View Datasheet →10AX115R2F40E2LG
✅ Drop-In✓ In Stock
$10300 / Unit
View Datasheet →10AX115R2F40E1SG
✅ Drop-In✓ In Stock
$6875 / Unit
View Datasheet →10AX115R1F40I1SG
✅ Drop-In✓ In Stock
$7232.71 / Unit
View Datasheet →10AX115R2F40I2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 |
| Logic Array Blocks (LABs) | 35,650 |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) |
| Maximum User I/O | 342 |
| DSP Blocks | 1,518 variable-precision |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port |
| Temperature Grade | Industrial (-40C to +100C Tj) |
| Process Node | TSMC 20 nm |
| Package | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
10AX115R2F40I2SG 1517-ball fcbga (f40), 40 mm x 40 mm, 0.8 mm pitch Pin Configuration Guide
Complete pinout information for 10AX115R2F40I2SG (1517-ball fcbga (f40), 40 mm x 40 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R2F40I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R2F40I2SG is suitable for 7 applications: 100 Gbps Network Interface Card, High-Definition Video Broadcast Equipment, Radar Processing in Defense Systems, Medical Imaging Accelerator, Test and Measurement Instrumentation, Industrial Automation and Robotics, 5G Wireless Fronthaul/Backhaul Equipment.
100 Gbps Network Interface Card
The Intel 10AX115R2F40I2SG is well-suited for 100 Gbps NIC designs because it provides 24 transceiver channels at up to 17.4 Gbps each, exceeding the bandwidth needed for four 25 Gbps lanes or two 50 Gbps PAM4 links. With 1,150K logic elements and 1,518 DSP blocks, it can implement MAC-layer packet processing, RDMA offload engines, and traffic shaping in a single chip. The hard PCIe Gen3 x8 endpoint enables direct attachment to host CPUs at 8 GT/s without an external bridge. Designers typically place the FPGA on a full-height, half-length PCIe card with QSFP28 cage and high-frequency LPDDR4 for packet buffers. Unlike smaller FPGAs that would require a multi-chip solution, the 1150K LE fabric handles 100 Gbps wire-speed processing in one device.
Recommended
High-Definition Video Broadcast Equipment
For UHD video broadcast encoder/decoder equipment, the 10AX115R2F40I2SG delivers the DSP throughput required for real-time HEVC/H.265 4K60p encode at 8-bit or 10-bit color depth. The 1,518 variable-precision DSP blocks implement motion estimation, deblocking filters, and CABAC entropy coding at wire rate. The industrial temperature range ensures reliable 24/7 operation in broadcast racks and outdoor transmitter sites. The 342 user I/O accommodate multiple 12G-SDI video streams (which require ~12 Gbps each) alongside gigabit Ethernet control planes. Designers use the FPGA's hard memory controllers to attach DDR4 for frame buffer storage.
Recommended
Radar Processing in Defense Systems
The 10AX115R2F40I2SG suits phased-array radar signal processing in defense applications due to its combination of high-density logic (1,150K LE), massive DSP resources (1,518 blocks for FFT and pulse compression), and 24 high-speed transceivers for ADC data ingest. Each transceiver channel can connect to a 12-bit ADC sampling at 1.5 GSPS, capturing the full bandwidth of modern AESA radar front-ends. The industrial temperature range supports operation in ruggedized enclosures with extended environmental screening. Engineers implement beamforming, clutter filtering, and target detection algorithms entirely in the FPGA fabric.
Recommended
Medical Imaging Accelerator
For CT, MRI, and ultrasound imaging systems, the 10AX115R2F40I2SG enables real-time image reconstruction algorithms such as filtered back-projection (FBP) and iterative reconstruction. The 1,518 DSP blocks parallelize convolutions and FFT operations across detector channels, while the 68 Mb embedded memory holds rotation matrix coefficients and intermediate voxel data. The 24 transceivers accept raw data from multiple high-speed detector arrays. Industrial temperature grading ensures reliable operation in hospital equipment rooms and mobile imaging carts. The hard PCIe Gen3 interface allows direct attachment to workstation CPUs for diagnostic display.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and arbitrary waveform generators use the 10AX115R2F40I2SG as the central processing fabric. The FPGA aggregates data from multiple high-speed ADCs, implements digital triggering, runs protocol decodes, and drives high-resolution displays. With 1,150K LE and 1,518 DSP blocks, the device can perform real-time FFT analysis up to 1 GHz bandwidth and decode multi-lane PCIe 4.0 or USB 3.2 traffic. The 24 transceivers handle high-bandwidth probe inputs while the 342 user I/O support multiple trigger and front-panel interfaces. Industrial temperature enables portable test equipment used in field maintenance.
Recommended
Industrial Automation and Robotics
The 10AX115R2F40I2SG drives motion control and machine vision systems in industrial automation by combining real-time deterministic control with high-bandwidth image processing. The 1,150K logic elements implement EtherCAT master, PROFINET, or EtherNet/IP industrial protocols while the 1,518 DSP blocks accelerate image preprocessing and convolutional neural network inference for defect classification. Industrial -40C to +100C temperature rating supports operation in factory floors without air conditioning. The 24 transceivers interface with multi-megapixel Camera Link or CoaXPress cameras for high-speed inspection lines.
Recommended
5G Wireless Fronthaul/Backhaul Equipment
In 5G base station and small cell infrastructure, the 10AX115R2F40I2SG implements the Common Public Radio Interface (CPRI) and enhanced CPRI (eCPRI) protocols over its 24 transceivers, aggregating multiple radio units onto a single backhaul fiber. The 1,150K logic elements handle IQ data compression, beamforming weight calculation, and MAC-layer scheduling. Industrial temperature grade supports deployment in outdoor small cell cabinets exposed to extreme weather. The hard PCIe Gen3 x8 interface connects to baseband processing cards and DSP co-processors.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R2F40I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R2F40I2LG | 10AX115R1F40I1SG | 10AX115R2F40E2SG | 10AX115R2F40E2LG | 10AX115R2F40E1SG | 10AX115R1F40I1SG |
|---|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Transceiver Grade | R2 (up to 17.4 Gbps) | R2 | R1 (lower data rate) | R2 | R2 | R2 | R1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Extended (-40C to +125C) | Extended | Extended | Industrial |
| Lead Finish | Pb-free (SG) | Pb-bearing (LG) | Pb-free (SG) | Pb-free (SG) | Pb-bearing (LG) | Pb-free (SG) | Pb-free (SG) |
| Max Transceiver Data Rate | 17.4 Gbps | 17.4 Gbps | 12.5 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 12.5 Gbps |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
Key Differentiators
- Higher transceiver data rate (17.4 Gbps) than R1-grade alternatives (vs 10AX115R1F40I1SG)
- Industrial temperature grade for harsh environment operation (vs 10AX115R2F40E2SG)
- Pb-free lead finish meets modern environmental compliance (vs 10AX115R2F40I2LG)
- Optimal cost-performance balance within Arria 10 1150K family (vs 10AX115R2F40E1SG)
Design Notes
Estimated: The 1517-FCBGA F40 package at 0.8 mm ball pitch requires a minimum 6-layer PCB stackup with microvia (HDI) technology. Signal layers must escape at least 4 rows of balls per direction from the BGA. Outer-layer trace width should be 0.1 mm with 0.15 mm spacing to maintain 100 ohm differential impedance for transceiver lanes. Per the Intel Arria 10 datasheet, transceiver reference clock traces require 100 ohm differential routing with 0.5 mm spacing.
Estimated: At full utilization (1,150K LE at 100% toggle, 24 transceivers active), the Arria 10 GX consumes approximately 25-35 W. With a junction-to-ambient thermal resistance (theta_JA) of approximately 5 C/W (when mounted on a standard JEDEC test board), junction temperature would rise 125-175C above ambient - well above the 100C industrial limit. A heatsink with 4 C/W resistance plus 200 LFM forced airflow is mandatory. The F40 package supports a heat-spreader mounting scheme with thermal interface material (TIM) between the lid and heatsink.
The Arria 10 GX uses SmartVID power delivery requiring six voltage rails: 0.9 V core, 0.95 V transceiver, 1.0 V, 1.2 V, 1.5 V, and 1.8 V auxiliary. Per the Intel Arria 10 datasheet, the integrated digital voltage regulators on the device simplify board design but require stable bulk decoupling within 100 mil of each power pin. Designers should plan for a 12 V input with intermediate switching regulators (e.g., from MEAN WELL or Vicor) followed by point-of-load LDOs for each rail.
Differential transceiver traces must be length-matched within 150 mil (3.8 mm) and routed as 100 ohm differential pairs. AC-coupling capacitors of 100 nF should be placed within 100 mil of the FPGA transceiver pins with the other end directly going to the adjacent component (e.g., SFP+ cage or QSFP28 connector). Reference planes should be continuous under all high-speed traces; no ground splits crossing these traces. Skew matching across the 24 transceiver lanes is critical for multi-lane protocols like PCIe Gen3 and 100G Ethernet.
Do not mistake the 'I' (industrial) and 'E' (extended) temperature suffixes in the MPN. Industrial grade is -40C to +100C Tj; extended grade is -40C to +125C Tj with different speed grading (E1 fastest, E2 mid, E3 slowest). Verify your design's required temperature range before ordering. Also note that SG = Pb-free lead finish and LG = Pb-bearing (legacy applications). Quartus Prime Pro Edition is REQUIRED - Standard Edition does not support Arria 10 devices.
Compliance Information
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC per se. The 'I' suffix indicates industrial temperature grade which differs from AEC-Q100 automotive qualification. Halogen-free status not explicitly confirmed in provided data.
