10AX115R2F40E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1517-FCBGA
MPN: 10AX115R2F40E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11850 | $118,500.00 |
| 100 | $11200 | $1,120,000.00 |
| 500 | $10750 | $5,375,000.00 |
| 1,000 | $10300 | $10,300,000.00 |
Drop-in alternatives for 10AX115R2F40E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R2F40E1SG
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$6875 / Unit
View Datasheet →10AX115R2F40E1LG
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10AX115R2F40I1SG
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$3490 / Unit
View Datasheet →10AX115R3F40E2LG
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$1425 / Unit
View Datasheet →10AX115R1F40E1SG
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View Datasheet →10AX090R2F40E2LG
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$2920 / Unit
View Datasheet →10AX090R3F40E2LG
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$5750 / Unit
View Datasheet →10AX115R2F40E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| User I/O Pins | 342 |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) |
| PCIe Hard IP | Gen3 x8 hard IP blocks |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers |
| PLLs | 24 fractional PLLs |
| Speed Grade | -2 |
| Temperature Grade | E2 (Extended) |
| Package | 1517-ball FCBGA (F40) |
| Process Technology | TSMC 20 nm |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AX115R2F40E2LG 1517-ball fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115R2F40E2LG (1517-ball fcbga (f40) package) with 342 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R2F40E2LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 342 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R2F40E2LG is suitable for 6 applications: 100G/40G Ethernet Line Card, OTN/SONET Framer-Mapper Equipment, Military Radar Signal Processing, ASIC Emulation and Prototyping, Medical Imaging Accelerator, High-Performance Computing Fabric Bridge.
100G/40G Ethernet Line Card
The 10AX115R2F40E2LG is purpose-built for 100G Ethernet line cards where its 24 transceivers up to 17.4 Gbps aggregate to 4x 25.78 Gbps CAUI-4 or 10x 10.31 Gbps CAUI-10 lanes. The hard IP supplies CAUI-4 PCS, AN/LT, and FEC blocks, while the 1,518 DSP blocks run RS(528,514) FEC and traffic-management logic on-chip. This FPGA meets CFP2/CFP4 module MSA requirements with deterministic latency under 1 microsecond, making it a strong choice for carrier-grade switches where guaranteed throughput is essential.
Recommended
OTN/SONET Framer-Mapper Equipment
OTN framer/mapper systems benefit from the 10AX115R2F40E2LG's 1.15M logic elements and 1,518 DSP blocks, which hold the OTU4/OTU2 mapping and Reed-Solomon FEC without external ASICs. Two hard DDR4 controllers at 2666 MT/s buffer cross-connect traffic, while 24 transceivers map directly into OTU4 (28 Gbps) or 4x OTU2 (10.7 Gbps) tributaries. The deterministic latency of Intel's hard IP exceeds ITU-T G.709 jitter requirements for OTN cross-connect fabrics in carrier networks.
Recommended
Military Radar Signal Processing
Radar arrays demand real-time FFT, pulse compression, and beamforming across hundreds of channels. The 10AX115R2F40E2LG delivers 1,518 18x19 multipliers and 68.9 Mbits of block RAM, supporting 4K-point FFTs and digital down-conversion (DDC) chains per device. Its -2 speed grade with E2 extended temperature survives defense environmental screening, and the 24 transceivers aggregate digital-RF data from front-end ADCs directly into the FPGA. Defense contractors standardize on this F40 footprint for SWaP-C-constrained radar signal processing systems.
Recommended
ASIC Emulation and Prototyping
ASIC emulation prototyping systems partition RTL designs across multiple FPGAs, and the 10AX115R2F40E2LG's 1.15M logic elements provide ~25M ASIC-gate capacity per device. The 24 multi-gigabit transceivers handle chip-to-chip TDM links between FPGAs on the prototyping board, sustaining multi-FPGA clock-domain crossings at 17.4 Gbps. Quartus Prime Pro's BluePrint timing closure flow combined with Synopsys HAPS DeepTrace debug accelerates RTL bring-up compared to ASIC tape-out cycles.
Recommended
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging accelerators rely on high-throughput DSP for back-projection and beamforming. The 10AX115R2F40E2LG executes 1,518 18x19 multiplications per cycle, delivering 2.7 TMACS of DSP throughput for real-time image reconstruction at 30 fps. Its 68.9 Mbits of embedded memory holds image slices without external SRAM, and two DDR4 controllers push pixel data to display pipelines at 2666 MT/s. Medical OEMs value the deterministic latency and IEC 60601 EMC margins enabled by Intel's hard IP.
Recommended
High-Performance Computing Fabric Bridge
HPC fabrics use FPGAs as PCIe Gen3/Gen4 bridges between CPUs, GPUs, and storage. The 10AX115R2F40E2LG integrates two PCIe Gen3 x8 hard IP blocks, each capable of 8 GT/s to host CPUs or NVMe targets, while 24 transceivers connect to neighboring FPGAs in a 2D-mesh topology at 17.4 Gbps. The 1.15M logic elements host OpenCL kernels and Intel's Acceleration Stack for compute offload. Compared to discrete NICs, the F40 footprint consolidates bridging, compression, and encryption on a single device.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R2F40E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R2F40E1SG | 10AX115R2F40E1LG | 10AX115R2F40I1SG | 10AX115R3F40E2LG | 10AX115R1F40E1SG | 10AX090R2F40E2LG | 10AX090R3F40E2LG |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) | 1517-FCBGA (F40) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 | 900,000 |
| DSP Blocks (18x19) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | [DATA_NEEDED] | [DATA_NEEDED] |
| Transceivers | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 28.3 Gbps | 24 up to 17.4 Gbps | 24 up to 17.4 Gbps | 24 up to 28.3 Gbps |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -1 (faster) | -3 (fastest) | -1 (faster) | -2 | -3 |
| Temperature Grade | E2 (Extended) | E1 (Extended) | E1 (Extended) | I1 (Industrial) | E2 (Extended) | E1 (Extended) | E2 (Extended) | E2 (Extended) |
| Solder Balls | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | SnPb (SG) | Lead-free (LG) | Lead-free (LG) |
Key Differentiators
- Highest density at the -2 speed grade in the 1517-FCBGA F40 footprint (vs 10AX090R2F40E2LG)
- Faster speed grade available without changing PCB (vs 10AX115R2F40E1SG)
- Same-package step-up to 28.3 Gbps transceivers (vs 10AX115R3F40E2LG)
- Wider industrial temperature range than E1 variants (vs 10AX115R2F40E1LG)
Design Notes
The 1517-FCBGA F40 package requires a 16-layer PCB stack-up with hybrid dielectric. Use stacked-via microvia technology on the top two layers for breakout, then route transceiver channels on layer 3 (top reference plane L2). Place Ac coupling capacitors (0.1 uF 0201 or 0402) within 8 mm of each high-speed serial pin per the Arria 10 Transceiver PHY User Guide.
Estimated: At full transceiver utilization (24 lanes at 17.4 Gbps with internal PCS) plus 80% logic utilization and 75% DSP utilization, the 10AX115R2F40E2LG dissipates roughly 25 W. Use a heatsink with theta_CA below 1.5 C/W and ensure at least 1,000 LFM of forced-air cooling to keep junction temperature below 100C. Add three distributed thermal-sense pairs (TMP-Sense) under the package for monitoring.
The 10AX115R2F40E2LG requires a sequenced power tree: 0.9 V core, 1.1 V transceiver analog, 1.1 V transceiver digital, 1.8 V auxiliary, and 3.0 V I/O. Follow Intel's Power Management Guide to set the Power Management Bus (PMBus) controller for proper hot-socketing. Decouple each rail with 22 uF bulk capacitors and 0.1 uF + 1 nF + 10 nF high-frequency ceramics within 5 mm of each ball.
Transceiver channels require matched-length routing within 0.13 mm (5 mil) of the longest lane across 24 differential pairs. Use 85-ohm differential impedance (100-ohm single-ended) for chip-to-chip and 90-ohm differential for backplane channels per Intel's PCB Design Guidelines. Pre-emphasis and adaptive equalization settings should be tuned via the Quartus Transceiver Toolkit.
Compliance Information
LG suffix indicates lead-free (SAC405) solder balls, RoHS compliant. AEC-Q100 is not applicable for FPGAs. Industrial temperature variants (I1) and military temperature variants (M1) are also available in the same F40 footprint.
