10AX115R4F40I3LG - Arria 10 GX FPGA, 1.15M LE, 342 I/O, 1517-FCBGA | Intel
MPN: 10AX115R4F40I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3750 | $375,000.00 |
| 500 | $3500 | $1,750,000.00 |
| 1,000 | $3250 | $3,250,000.00 |
Drop-in alternatives for 10AX115R4F40I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115R4F40E3LG
✅ Drop-In✓ In Stock
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View Datasheet →10AX115R4F40I3SG
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View Datasheet →10AX115R3F40I2SG
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View Datasheet →10AX115R2F40I2LG
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View Datasheet →10AX090R4F40I3LG
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View Datasheet →10AX115R4F40I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| DSP Blocks | 1,518 (maximum per family) |
| Maximum User I/O | 342 |
| Transceivers | Up to 28.05 Gbps (GX family) |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Package | 1517-ball FCBGA (BBGA) |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDRII+, RLDRAM3) |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) |
| Configuration Modes | FPP, AS, PS, JTAG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX115R4F40I3LG 1517-ball fcbga (bbga) Pin Configuration Guide
Complete pinout information for 10AX115R4F40I3LG (1517-ball fcbga (bbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R4F40I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R4F40I3LG is suitable for 6 applications: High-Performance DSP / Radar Signal Processing, Software-Defined Radio Baseband, Medical Imaging Accelerator (Ultrasound / CT), ASIC Prototyping Platform, Test & Measurement Instrumentation, Broadcast Video Processing (4K/8K Studio Routers).
High-Performance DSP / Radar Signal Processing
The 10AX115R4F40I3LG's 1,518 DSP blocks, 28.05 Gbps-capable transceivers, and PCIe Gen3 hard IP make it a strong fit for phased-array radar and beamforming front-ends. Its 1.15M logic elements absorb complex FFT, pulse compression, and beam-steering algorithms in real time, while the -40 °C to +100 °C industrial grading supports outdoor and avionics enclosures. Pair the FPGA with dual-channel DDR4 (4 GB/s per channel) for sample buffering and a Renesas ISL80030 or Intel Enpirion power tree for core and transceiver rails.
Recommended
Software-Defined Radio Baseband
For 4G/5G small-cell and software-defined radio baseband, the 10AX115R4F40I3LG delivers CPRI/OBSAI connectivity through its 28 Gbps transceivers, plus DSP slices for channelisation, FFT/iFFT, and crest-factor reduction. The hard PCIe Gen3 IP interfaces directly to a host SoC or DSP co-processor, offloading physical-layer processing. The industrial temperature grade supports outdoor unit (ODU) deployment. A configuration device such as the EPCQ-L256 stores the bitstream with optional dual-image support for fail-safe firmware updates.
Recommended
Medical Imaging Accelerator (Ultrasound / CT)
The 10AX115R4F40I3LG supports multi-channel beamforming in ultrasound front-ends and CT reconstruction pipelines. Its 1,518 DSP blocks perform FIR filtering, Hilbert transforms, and envelope detection at sample rates up to 80 MSPS per channel. The PCIe Gen3 hard IP interfaces to a host PC for high-throughput image streaming at >1 GB/s. The 1517-ball FCBGA package's 0.8 mm ball pitch is compatible with standard JEDEC PCB stackups and 12-layer designs, easing layout for medical-OEM manufacturers.
Recommended
ASIC Prototyping Platform
The Arria 10 GX with 1.15M LE and 28 Gbps transceivers is widely adopted as an ASIC prototyping substrate, mapping large SoC RTL blocks for in-system verification. The F40 (1517-ball FCBGA) variant provides the highest user-I/O count in the family, supporting multi-bridge chip-to-chip connections. The hard memory controllers and PCIe Gen3 IP accelerate bring-up of typical SoC interfaces (DDR4, PCIe, USB 3.1, SATA). Combined with Intel's Quartus Prime Pro software and Bluespec SystemVerilog support, the 10AX115R4F40I3LG is a turnkey choice for pre-silicon validation.
Recommended
Test & Measurement Instrumentation
High-end oscilloscopes, BERTs, and protocol analyzers use the 10AX115R4F40I3LG for real-time serial pattern generation and decoding. The 28 Gbps transceivers support PCIe Gen3, USB 3.1 Gen2, SATA, and 10/25/100 GbE protocol analysis. The 1,518 DSP blocks accelerate eye-diagram rendering and jitter decomposition. Industrial temperature grading suits factory-floor and lab environments. A reference design typically pairs the FPGA with a multi-gigabit ADC, an EPCQ configuration flash, and an Intel Enpirion EM2xx series power management IC.
Recommended
Broadcast Video Processing (4K/8K Studio Routers)
Broadcast video routers and 8K frame synchronisers use the 10AX115R4F40I3LG for SDI de-embedding, audio muxing, and frame-store processing. The 342 user I/O allow dense multi-channel SDI (up to 36 simultaneous 12G-SDI links), while the 68 Mb embedded memory serves as line/frame buffers. Industrial temperature grading supports broadcast-van and outdoor-events deployment. Pair with M-LVDS or fiber transceivers, plus an EPCQ-L for configuration with golden-image redundancy.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R4F40I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R4F40E3LG | 10AX115R4F40I3SG | 10AX115R3F40I2SG | 10AX115R2F40I2LG | 10AX090R4F40I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | 3 | 3 | 3 | 2 | 2 | 3 |
| Temperature Grade | Industrial (-40 to +100 °C) | Enhanced | Industrial | Industrial | Industrial | Industrial |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,248,000 |
| DSP Blocks | 1,518 (max family) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
| Process / Family | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX | 20 nm Arria 10 GX |
Key Differentiators
- 1.15M logic elements - highest in Arria 10 GX family (vs 10AX090R4F40I3LG)
- Speed grade 3 - higher worst-case Fmax than speed-grade 2 (vs 10AX115R3F40I2SG)
- Industrial temperature grade in standard lead-free package (vs 10AX115R4F40E3LG)
Design Notes
Estimated: at full utilisation (1.15M LE switching at 200 MHz toggle rate and full transceiver activity) the 10AX115R4F40I3LG can dissipate 25-35 W. The 1517-ball FCBGA requires a thermal management solution: pair the device with a 30x30 mm heatsink and 200 LFM airflow, or design a heat-spreader per Intel's Arria 10 thermal design guide. Use the integrated on-die temperature diode and external MAX31760 fan controller for closed-loop thermal regulation.
Intel's PowerTree for the 10AX115R4F40I3LG mandates separate rails for VCC (0.9 V core), VCCPT (0.85 V periphery/PLL), VCCBAT (battery/backup), VCCA_PLL (2.5 V analog PLL), VCCIO (1.2-3.3 V I/O bank), VCCR/VCCP/VCCPT_GXB (1.0-1.2 V transceiver), and VCCH_GXB (1.5 V transceiver helper). Use a multi-rail PMIC such as the Intel Enpirion EM2xx or Renesas ISL8225M to meet the strict power-on sequencing (VCC before VCCPT before VCCIO) specified in the datasheet.
The 1517-ball FCBGA uses a 0.8 mm ball pitch. Route signals on a 12-layer or 14-layer PCB stackup with microvia-in-pad for the breakout. Use Intel's pin connection guidelines (.pcf file) to determine which pins are no-connects and which differential pairs require length matching within 5 mil. Power-rail decoupling requires 0402/0201 capacitors placed as close to each ball as possible, plus 220 µF bulk capacitors at each rail entry point.
Do not assume all 342 user I/O are simultaneously available - the actual usable count depends on which transceiver and memory pins you enable. Do not enable both the AS and FPP configuration modes simultaneously without consulting the configuration handbook. Always read back the configuration bitstream via the CRC check feature and verify the design ID before user-mode execution to catch configuration memory corruption in field updates.
Compliance Information
RoHS and REACH compliance per Intel Arria 10 product environmental information. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). Lead-free (Pb-free) FCBGA package, halogen-free per JEDEC JS709B.
