10AX115R4F40E3LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
MPN: 10AX115R4F40E3LG β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6555.23 | $6,555.23 |
| 10 | $6227.47 | $62,274.70 |
| 100 | $5768.6 | $576,860.00 |
| 500 | $5112.95 | $2,556,475.00 |
| 1,000 | $4588.66 | $4,588,660.00 |
Drop-in alternatives for 10AX115R4F40E3LG β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10AX115R3F40E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AX115R4F40E3SG
β Drop-Inβ In Stock
$3925 / Unit
View Datasheet β10AX115R4F40I3LG
β Drop-Inβ In Stock
$3250 / Unit
View Datasheet β10AX115R2F40E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AX115R1F40E3LG
β Drop-Inπ Reference alternative (not in catalog)
10AX115R4F40E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 (68.86 Mbit) |
| User I/O Pins | 342 |
| Transceiver Data Rate (max) | 28.05 Gbps |
| Number of Transceivers | 24 |
| DSP Blocks | 1,518 variable-precision 18x19 multipliers |
| Hardened PCIe IP | Gen3 x8 |
| Process Technology | TSMC 20nm |
| Core Voltage | 0.9 V |
| Package | 1517-ball FCBGA (F40, flip-chip BGA) |
| Operating Temperature | 0C to +100C (E3 commercial) |
| RoHS Status | Compliant |
| Speed Grade | 4 (mid) |
10AX115R4F40E3LG 1517-ball fcbga (f40, flip-chip bga) Pin Configuration Guide
Complete pinout information for 10AX115R4F40E3LG (1517-ball fcbga (f40, flip-chip bga) package) with 342 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R4F40E3LG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 342 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R4F40E3LG is suitable for 7 applications: 100G/400G Ethernet Line Cards, Broadcast Studio and 4K/8K Video Processing, PCIe Gen3 Accelerator Cards, Military Radar and Electronic Warfare DSP, Medical Imaging Accelerators (CT, MRI, Ultrasound), 5G Fronthaul and Backhaul Equipment, ASIC Prototyping and Emulation.
100G/400G Ethernet Line Cards
The 10AX115R4F40E3LG is purpose-built for 100G and 400G Ethernet line cards thanks to its 24 transceivers at 28.05 Gbps and ~1.5 Tbps aggregate serial bandwidth. The hardened 100G MAC + PCS IP core, available as a Quartus reference design, accelerates time-to-market for OTN/PTN transport and data-center top-of-rack switches. The 1,518 variable-precision DSP blocks also handle FEC and packet classification at line rate without external co-processors.
Recommended
Broadcast Studio and 4K/8K Video Processing
The 1.15M logic elements, 1,518 DSP blocks and 68.86 Mbit of embedded memory make the 10AX115R4F40E3LG a strong fit for 4K/8K broadcast video processors, multi-channel SDI/HDMI aggregation and real-time video effects. The hardened PCIe Gen3 x8 IP enables high-bandwidth host links for ingest/playout servers, while the M20K memory blocks serve as line buffers for color-space conversion and scaling. Designers commonly pair this device with external 12G-SDI cable equalizers.
Recommended
PCIe Gen3 Accelerator Cards
The 10AX115R4F40E3LG integrates a hardened Gen3 x8 PCIe IP block that delivers up to 8 Gbps per lane (64 Gbps aggregate) without consuming FPGA logic resources. This frees the 1.15M LE fabric to implement custom accelerators such as compression, machine-learning inference, or database query engines. The device is widely used in hyperscale data centers for FPGA-as-a-service (FaaS) deployments where card hot-swap and partial reconfiguration are required.
Recommended
Military Radar and Electronic Warfare DSP
The Arria 10 GX family is widely used in military radar and electronic-warfare systems where its 28.05 Gbps transceivers feed wideband ADC/DAC front-ends and the 1,518 DSP blocks run pulse-compression, MTI, and beamforming algorithms. The 68.86 Mbit of embedded memory serves as range-Doppler map storage, reducing reliance on external SRAM. Ruggedized boards built around the 10AX115R4F40I3LG (industrial temp) are deployed in naval and airborne platforms.
Recommended
Medical Imaging Accelerators (CT, MRI, Ultrasound)
CT, MRI and ultrasound systems use the 10AX115R4F40E3LG to accelerate image-reconstruction algorithms such as filtered back-projection and parallel MRI (SENSE/GRAPPA). The variable-precision DSP blocks deliver up to 1.5 TFLOPs of DSP throughput, while the on-chip M20K memory buffers 3D voxel data. PCIe Gen3 x8 connects the FPGA to the host CPU for streaming DICOM image reconstruction in real time, with FDA/IEC 60601 compliance handled at the system level.
Recommended
5G Fronthaul and Backhaul Equipment
5G fronthaul (CPRI/eCPRI) and backhaul routers rely on the 10AX115R4F40E3LG for high-density CPRI aggregation, with each 28.05 Gbps transceiver supporting 24x CPRI option 10 or multiple eCPRI 25G links. The hardened 100G MAC IP enables direct handoff to transport networks. Compared to ASICs, the FPGA path lets operators support multiple functional splits (Option 7-2, 8) with a single board design, reducing SKU proliferation.
Recommended
ASIC Prototyping and Emulation
The 10AX115R4F40E3LG is a popular target for ASIC and SoC prototyping platforms because its 1.15M LE fabric can host multi-million-gate ASIC designs with realistic timing. Multiple Arria 10 GX FPGAs can be cascaded via 28.05 Gbps transceivers to build capacity-scalable prototyping boards, with Quartus Prime Pro providing TDM-based multi-FPGA partitioning. The hardened PCIe Gen3 IP also serves as a high-bandwidth debug interface to the host workstation.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R4F40E3LG β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R3F40E3LG | 10AX115R4F40E3SG | 10AX115R4F40I3LG | 10AX115R2F40E3LG | 10AX115R1F40E3LG |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | 4 (mid) | 3 | 4 | 4 | 2 | 1 |
| Temperature Grade | E3 (commercial 0C to +100C) | E3 (commercial) | E3 (commercial, SG variant) | I3 (industrial -40C to +100C) | E3 (commercial) | E3 (commercial) |
| Transceiver Count | 24 | 24 | 24 | 24 | 24 | 24 |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit |
| Hardened PCIe IP | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 | Gen3 x8 |
| Approx. Unit Price (USD) | 6,555.23 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade (4) in the F40 footprint family (vs 10AX115R3F40E3LG)
- Commercial temperature (E3) optimization (vs 10AX115R4F40I3LG)
- Hardened Gen3 x8 PCIe IP (vs 10AX090R4F40E3LG)
Design Notes
The 1517-ball FCBGA F40 package requires an HDI PCB stack-up with micro-via-in-pad and matched-length routing for the 28.05 Gbps transceiver channels. Use a 14-16 layer stack-up with the transceiver balls routed to break-out vias on inner layers; reference the Altera Arria 10 GX pin connection guidelines for via pattern, antipad dimensions, and AC-coupled capacitor placement. Estimated: at 1.0mm pitch, breakout routing typically requires 4-6 routing layers to escape cleanly.
For 28.05 Gbps links, controlled-impedance differential routing (typically 85 ohm or 100 ohm) with length matching within 0.127mm (5 mil) is essential. Insert AC-coupling capacitors at the transmitter output or receiver input as defined in the Arria 10 GX transceiver user guide. Estimated: total channel insertion loss budget at 14 GHz is roughly 10 dB for backplane applications. Run 3D EM simulation (ANSYS HFSS or Cadence Clarity) before tape-out.
Power estimation: Arria 10 GX FPGAs with 24 transceivers and high logic utilization typically consume 30-50 W under full load. The FCBGA-1517 package requires a thermal management solution such as a heat spreader or direct-attach heatsink with thermal interface material. Estimate junction temperature using the Quartus Prime PowerPlay early power estimator and verify on hardware with on-die thermal diodes connected to the MAX10 EM100 temperature monitor.
Do not confuse the Arria 10 GX (R) family with the Arria 10 GT (N) family - they use different transceiver types and pin assignments despite sharing the F40 package outline. Always verify the OPN against the Quartus Prime device database before PCB layout. Also note that 0.9V core rails require a tolerance of +/-3% and may need dedicated PMIC sequencing for multi-rail power-up - consult the Arria 10 GX power management user guide for proper ramp ordering.
Compliance Information
RoHS compliance per Altera/Intel product page. AEC-Q100 not applicable - this is a high-end FPGA, not an automotive-qualified IC. Halogen-free status not explicitly stated in the verified web data; refer to the official Intel material declaration. REACH SVHC statements available from Intel upon request.
