10AX115U2F45E2LG - Arria 10 GX 1.15M LE FPGA | Intel F45 FCBGA-1932
MPN: 10AX115U2F45E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8450 | $8,450.00 |
| 10 | $8120 | $81,200.00 |
| 50 | $7890 | $394,500.00 |
| 100 | $7650 | $765,000.00 |
| 250 | $7380 | $1,845,000.00 |
Drop-in alternatives for 10AX115U2F45E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U3F45E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$8500 / Unit
View Datasheet →10AX115U2F45E2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115U2F45E3LG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115U2F45I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9589.87 / Unit
View Datasheet →10AX090U2F45E2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3647.5 / Unit
View Datasheet →10AX115U2F45E2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory | 52.99 Mbit |
| Number of User I/O | 480 |
| Package | 1932-BBGA, FCBGA (F45, 45 mm) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Transceiver Data Rate | up to 28.05 Gbps (per Arria 10 GX family) |
| Number of Terminals | 1932 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Extended (per -E suffix) |
| RoHS Status | Compliant |
10AX115U2F45E2LG square Pin Configuration Guide
Complete pinout information for 10AX115U2F45E2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45E2LG is suitable for 6 applications: 100G/400G Optical Transport Line Cards, 5G Baseband and Fronthaul DSP, 4K/8K Video Broadcast and Pro-AV Processing, Radar and Electronic Warfare Signal Processing, High-Performance PCIe Gen3 Accelerator Cards, Test and Measurement Instrumentation.
100G/400G Optical Transport Line Cards
The 10AX115U2F45E2LG is well matched to 100 Gbps and 400 Gbps optical line cards because of its 1.15M logic elements, 52.99 Mbit of embedded memory for packet buffer pools, and transceivers rated up to 28.05 Gbps - sufficient to drive QSFP28 and CFP2 modules. The F45 1932-ball FCBGA package exposes 480 user I/O for parallel side-band and backplane interfaces. The fabric is large enough to host a full OTN framer or Ethernet MAC plus packet classification and traffic management in a single device, eliminating multi-FPGAs splitting. Power dissipation is the main trade-off; the device must be paired with a heatsink plus 300+ LFM airflow in sealed chassis.
Recommended
5G Baseband and Fronthaul DSP
For 5G fronthaul (CPRI/eCPRI) and baseband processing cards, the 10AX115U2F45E2LG offers the variable-precision DSP blocks and dedicated hard IP needed for low-latency FFT and channel-estimation algorithms. The 1.15M logic elements and 427,200 ALMs comfortably host a multi-antenna 4x4 or 8x8 beamforming chain on a single device. The 28.05 Gbps transceivers support CPRI line rates up to option 9 (24.33 Gbps). The 480 user I/O accept multi-band ADC/DAC pairs plus JESD204B/C interface lanes. Industrial temperature variants (10AX115U2F45I2LG) are recommended for outdoor cell-site deployments where ambient temperatures exceed 70 C.
Recommended
4K/8K Video Broadcast and Pro-AV Processing
Broadcast video routers, frame synchronizers, and pro-AV processors use the 10AX115U2F45E2LG to handle multi-stream 4K and 8K video at 60 fps with very low latency. The 1.15M logic elements and 52.99 Mbit embedded memory enable multi-channel HDR/WCG processing pipelines and on-die frame buffers. The 480 user I/O accept parallel SDI, HDMI, and DisplayPort interfaces alongside the 12G-SDI serial I/O. Partial reconfiguration lets broadcasters swap codec firmware without powering down the entire router. Compared with a CPU or GPU solution, the FPGA delivers deterministic sub-frame latency that is essential for live production.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX115U2F45E2LG fits radar and electronic-warfare (EW) DSP applications where it performs high-throughput channelisation, pulse compression, and beamforming on phased-array antenna data. Its 1.15M logic elements, variable-precision DSP blocks, and 52.99 Mbit embedded memory can ingest multiple ADC lanes through JESD204B/C and complete the full processing chain without off-chip buffering. Transceivers up to 28.05 Gbps allow direct conversion of optical RF-over-fibre inputs. The extended temperature grade of this SKU handles airborne and ground-vehicle environments, while the F45 package provides the heat-spreading copper lid required for high transceiver utilisation.
Recommended
High-Performance PCIe Gen3 Accelerator Cards
PCIe Gen3 accelerator cards for data-center and HPC workloads use the 10AX115U2F45E2LG because of its hardened PCIe Gen3 x8 IP block and abundant fabric for custom compute kernels. The 1.15M logic elements can host dozens of parallel processing engines, and the 52.99 Mbit embedded memory provides on-die scratchpad memory for latency-critical kernels. The 480 user I/O support DDR4 memory channels and high-speed serial expansion links. Compared with discrete GPU accelerators, the FPGA delivers deterministic latency and lower latency for real-time inference workloads, particularly when batching is not practical.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, BERT testers, and logic analyzers benefit from the 10AX115U2F45E2LG's 480 user I/O for parallel probe channels and 28.05 Gbps transceivers for serial protocol decoding. The 1.15M logic elements can host simultaneous state machines for multiple protocols (PCIe, USB, SATA, Ethernet). The 52.99 Mbit embedded memory stores deep trace buffers without external DRAM. The F45 package provides 1932 balls for the dense power and ground rails required for hot-swap-tolerant instrument front ends. Partial reconfiguration lets the same hardware re-spin to support new protocols over time.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U3F45E2LG | 10AX115U2F45E2SG | 10AX115U2F45E3LG | 10AX115U2F45I2LG | 10AX090U2F45E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-BBGA, FCBGA (F45, 45 mm) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | ~42 Mbit |
| Speed Grade | -2 | -3 (faster) | -2 | -3 (faster) | -2 | -2 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) | Extended (E) |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest logic density in the Arria 10 GX F45 footprint (vs 10AX090U2F45E2LG)
- Extended temperature grade at -2 speed is the balance-point SKU (vs 10AX115U2F45I2LG)
- F45 1932-ball FCBGA provides maximum fabric density per mm2 of PCB (vs 10AX115R2F40I2SG (F40 package))
Design Notes
The 1932-ball FCBGA F45 package at 1.0 mm ball pitch demands an 8+ layer PCB stackup with microvia build-up. Use the BGA breakout region with via-in-pad or dog-bone fan-out, and route critical transceiver lanes on the top layer with a continuous GND reference beneath. Match the transceiver pair lengths within 150 um and keep the 28 Gbps lanes away from noisy power rails.
Estimated: at full transceiver utilisation (~24 lanes at 28 Gbps) and typical fabric activity, the 10AX115U2F45E2LG dissipates 25-35 W. A heatsink with thermal interface material plus a minimum 200 LFM airflow is required to keep junction temperatures within the extended (-40 C to +100 C) operating range. Use the thermal lid of the F45 package - do not attempt to attach a heatsink directly to the BGA balls.
Follow the Intel Arria 10 GX power distribution network (PDN) design guidelines: place 1 nF, 100 nF, and 10 uF decoupling capacitors at every power pin via a short, wide trace; provide at least 4 power planes with stitching vias every 200 mils in the BGA region. Use the Intel PowerPlay early power estimator to model core, IO, and transceiver power before committing to PCB stackup.
Common pitfalls with the 10AX115U2F45E2LG include: (1) exceeding 28.05 Gbps transceiver rates - the device does not support the Stratix 10's 28.9 Gbps ceiling; (2) omitting the CFGBn configuration pin pull-up - results in intermittent boot; (3) mismatched reference-clock routing - causes high transceiver jitter; (4) ignoring partial-reconfiguration POR (power-on-reset) timing - causes the dual-image boot to hang.
Compliance Information
RoHS compliance per Intel Arria 10 GX product page. AEC-Q100 not applicable (FPGA is not an automotive-grade discrete). Halogen-free status not confirmed from verified data.
