10CL006YU256A7G - Cyclone 10 LP FPGA, 6K LE, 256-UBGA | Intel
MPN: 10CL006YU256A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.2 | $48.20 |
| 10 | $43.84 | $438.40 |
| 100 | $38.56 | $3,856.00 |
| 500 | $33.75 | $16,875.00 |
| 1,000 | $28.92 | $28,920.00 |
Drop-in alternatives for 10CL006YU256A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL006YU256C6G
✅ Drop-In✓ In Stock
$3 / Unit
View Datasheet →10CL006YU256I7G
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →10CL006YU256C8G
✅ Drop-In✓ In Stock
$24.6 / Unit
View Datasheet →10CL006YU256I8G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL010YU256C6G
✅ Drop-In✓ In Stock
$9.6 / Unit
View Datasheet →LFE5U-12F-8BG256C
✅ Drop-In📋 Reference alternative (not in catalog)
10CL006YU256A7G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Embedded Memory (M9K blocks) | 30 blocks (270 Kbits) |
| Maximum User I/Os | 176 |
| PLLs | 2 |
| Package | 256-UBGA (Ultra FineLine BGA) |
| Operating Temperature | -40C to +125C (Automotive / Industrial grade 'A7G' suffix) |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | TSMC 60 nm low-power |
| Supply Voltage - Core | 1.2 V (typical) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (multi-voltage I/O banks) |
| Configuration Memory | SRAM-based (volatile, requires configuration device or JTAG) |
| MSL Level | 3 (per JEDEC J-STD-020, BGA handling) |
| RoHS Status | Compliant |
10CL006YU256A7G 256-ubga (ultra fineline bga) Pin Configuration Guide
Complete pinout information for 10CL006YU256A7G (256-ubga (ultra fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL006YU256A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL006YU256A7G is suitable for 6 applications: Industrial Motor Control and Drive, Video Bridging and Display Processing, I/O Expansion and Protocol Translation, Low-Cost Prototyping and Educational Platforms, Automotive In-Vehicle Networks and Sensor Aggregation, Portable and Handheld Embedded Devices.
Industrial Motor Control and Drive
The 10CL006YU256A7G's 6,272 logic elements and 2 PLLs comfortably drive field-oriented control (FOC) loops for small to mid-size BLDC and PMSM motors, while the -40C to +125C temperature grade survives factory-floor environments. Placed between Hall-effect / encoder sensors (3.3V LVCMOS) and the gate driver (5V tolerant I/O bank), the FPGA samples rotor position, computes the Park/Clarke transforms, and generates PWM with sub-microsecond dead-time control. The 176 user I/Os allow direct connection to quadrature encoders, SPI current sensors, and CAN transceivers without external muxing.
Recommended
Video Bridging and Display Processing
The 10CL006YU256A7G acts as a low-cost video bridge between MIPI CSI-2 / parallel CMOS sensors and RGB / LVDS display panels in cost-sensitive embedded vision products. The 6K LE fabric fits pixel pipelines, gamma correction, and on-screen display (OSD) overlays, while the 176 user I/Os handle 24-bit parallel RGB plus control signals. The FPGA's LVDS I/O bank enables direct connection to flat-panel displays without external serializers, reducing BOM cost in industrial HMIs and portable medical tablets.
Recommended
I/O Expansion and Protocol Translation
As an I/O expansion hub, the 10CL006YU256A7G bridges between SPI / I2C / UART microcontrollers and high-pin-count parallel peripherals (FPGA-driven character LCDs, keypads, GPIO expanders). The 6,272 LEs implement multi-master bus arbiters, FIFOs, and timing-critical glue logic that a microcontroller cannot service in software. The 256-UBGA package supports the 176 I/O count needed for 32-bit parallel buses plus enough spare I/O for SPI flash, status LEDs, and JTAG programming.
Recommended
Low-Cost Prototyping and Educational Platforms
Quartus Prime Lite Edition (no license fee) combined with the 10CL006YU256A7G's modest density makes this part ideal for university FPGA labs, maker projects, and proof-of-concept prototypes. Students can implement RISC-V soft cores, custom instruction set simulators, and DSP pipelines without paying for toolchain licenses. The 256-UBGA package exposes enough I/O for typical university peripherals (seven-segment displays, VGA, PS/2 keyboard) while remaining low-cost enough for student kit distribution.
Recommended
Automotive In-Vehicle Networks and Sensor Aggregation
The 'A7G' automotive temperature grade and 176 I/O count make the 10CL006YU256A7G suited for in-vehicle body controllers that aggregate LIN/CAN sensor traffic and drive discrete actuators. The 6K LE fabric fits the CAN-FD controller, message routing, and diagnostic state machines required for ISO 11898 compliance, while the 256-UBGA package handles the dozens of wake-up inputs needed for body ECU applications. Pair with external CAN transceivers for ISO 11898-2 physical layer.
Recommended
Portable and Handheld Embedded Devices
Cyclone 10 LP's industry-leading low static power makes the 10CL006YU256A7G ideal for battery-powered instruments, handheld test equipment, and portable data loggers. The 60 nm low-power process with on-chip voltage regulation draws milliwatts during active operation and microamps in sleep, extending battery life versus competing FPGAs. The 256-UBGA package keeps board footprint under 14x14 mm even with 176 I/Os, fitting handheld enclosures where board real estate is at a premium.
Recommended
Recommended Products Summary
Engineering reference data for 10CL006YU256A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL006YU256C6G | 10CL006YU256I7G | 10CL006YU256C8G | 10CL010YU256C6G | LFE5U-12F-8BG256C |
|---|---|---|---|---|---|---|
| Package | 256-UBGA | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-UBGA - same | 256-CABGA - same footprint |
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Logic Elements / LUTs | 6,272 LE | 6,272 LE (same) | 6,272 LE (same) | 6,272 LE (same) | 10,320 LE (+64%) | 12,000 LUTs (+91% equivalent) |
| User I/Os | 176 | 176 (same) | 176 (same) | 176 (same) | 176 (same) | 197 (+12%) |
| Embedded Memory | 270 Kbits (30 M9K) | 270 Kbits (same) | 270 Kbits (same) | 270 Kbits (same) | 414 Kbits (+53%) | 320 Kbits EBR (+19%) |
| PLLs | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
| Operating Temperature Grade | -40C to +125C (Automotive / A7G) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Extended) |
| Approximate Unit Price (qty-1) | $48.20 | $42 - $48 (similar) | $46 - $52 (similar) | $52 - $58 (slightly higher) | $62 - $72 (+35%) | $38 - $45 (cross-brand reference) |
Key Differentiators
- Lowest density entry point in Cyclone 10 LP family (vs 10CL010YU256C6G)
- Automotive / industrial temperature grade option in same footprint (vs 10CL006YU256C6G)
- Cross-brand Lattice alternative in same 256-ball footprint (vs LFE5U-12F-8BG256C)
Design Notes
Estimated: With VCCINT = 1.2 V drawing approximately 200 mA active and VCCIO banks at 3.3 V drawing 50 mA combined, total power budget is ~0.4 W for core and ~0.5 W for I/O. The 256-UBGA exposes multiple VCCINT/VCCIO ball pairs; route them with wide copper pours directly under the BGA. Use 0.1 uF + 10 uF ceramic decoupling on every VCC pin pair. Estimated input is 1.2 V x 0.2 A + 3.3 V x 0.15 A = 0.735 W total budget.
The 256-UBGA at 1.0 mm pitch requires 4-layer PCB minimum with via-in-pad or microvia technology for proper BGA breakout. Per JEDEC MSL-3 handling, the device must be baked at 125C for 24 hours before reflow if the humidity indicator card shows exposure beyond 168 hours floor life. Reflow profile must follow JEDEC J-STD-020 with peak temperature 245C maximum.
Do not confuse 10CL006YU256A7G (this part) with 10CL006YE144A7G (144-pin EQFP package); both share the A7G temperature suffix but the package codes YU256 vs YE144 differ. The 10CL006 is the lowest density in the family; if Quartus reports fitter errors exceeding 90% utilization, step up to 10CL010 or 10CL016 in the same 256-UBGA footprint. Ensure MSEL[3:0] pins are tied to the correct configuration mode (AS = fast standard, JTAG = boundary scan).
Use LVDS only on banks 2, 4, 5, 7 (the true LVDS-capable I/O banks per Cyclone 10 LP pin tables); banks 1, 3, 6, 8 only support LVCMOS/LVTTL. Series-termination resistors (33 ohm) are recommended on high-speed LVCMOS outputs above 50 MHz to control ringing. Configure unused I/O pins as inputs with weak pull-up via Quartus pin assignment, never leave them floating on a production board.
Compliance Information
RoHS compliant and lead-free per Intel product page. A7G suffix indicates industrial/automotive temperature grade -40C to +125C but is not formal AEC-Q100 qualification (Cyclone 10 LP automotive use requires additional qualification per Intel).
