10CL006YU256C8G - Cyclone 10 LP FPGA 6K LE, 256-UBGA | Intel
MPN: 10CL006YU256C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.5 | $39.50 |
| 10 | $36.8 | $368.00 |
| 100 | $32.4 | $3,240.00 |
| 500 | $28.1 | $14,050.00 |
| 1,000 | $24.6 | $24,600.00 |
Drop-in alternatives for 10CL006YU256C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CL025YU256C8G
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View Datasheet →10CL006YU256C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 6,272 |
| Embedded Memory Bits | 276,480 |
| Maximum User I/O | 176 |
| Embedded 18x18 Multipliers | 15 |
| General-Purpose PLLs | 2 |
| Global Clock Networks | 20 |
| Package | 256-ball UBGA (U256), 17 mm x 17 mm |
| Process Technology | 60 nm low-power CMOS |
| Speed Grade | C8 |
| Configuration Modes | AS, PS, FPP, JTAG |
| Operating Temperature | 0 C to +85 C (commercial) |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CL006YU256C8G 256-ball ubga (u256), 17 mm x 17 mm Pin Configuration Guide
Complete pinout information for 10CL006YU256C8G (256-ball ubga (u256), 17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL006YU256C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL006YU256C8G is suitable for 6 applications: Industrial Motor Control and HMI Boards, Video Bridging and Sensor Aggregation, Low-Density Telecom Protocol Bridging, Embedded Programmable Glue Logic, Automotive Infotainment and Body Electronics, IoT Edge Sensor Aggregation Gateway.
Industrial Motor Control and HMI Boards
The 10CL006YU256C8G's 6,272 logic elements and 15 embedded 18x18 multipliers make it a strong fit for industrial motor control and HMI boards. The FPGA can host a Nios II soft-core running the user-interface stack while dedicated hardware accelerators implement field-oriented control (FOC) loops at the multi-MHz PWM switching rates typical of 3-phase inverters. With 176 user I/O, the device directly interfaces to quadrature encoders, Hall sensors, BLDC/PMSM gate drivers, and the parallel RGB or LVDS link to a TFT HMI display without external bus expanders. The 256-UBGA package's 17 mm x 17 mm footprint and 1.0 mm pitch support reflow-compatible SMT assembly on standard 4-layer industrial FR-4 boards. Compared with a discrete MCU + CPLD design, integrating motor control and HMI in one Cyclone 10 LP device reduces BOM cost, simplifies PCB layout, and lets designers re-spin functionality in firmware via bitstream updates.
Recommended
Video Bridging and Sensor Aggregation
The 10CL006YU256C8G is well suited for low-cost video bridging and image-sensor aggregation in surveillance and machine-vision equipment. Its 176 user I/O can absorb two parallel CMOS sensor interfaces (8-12 bit each) and reformat them to a single MIPI-CSI2 or LVDS output stream via soft IP cores in Quartus Prime. The 276,480 bits of embedded SRAM act as a line buffer for resolution scaling and color-space conversion, and the 15 embedded 18x18 multipliers handle real-time scaling kernels. Operating from a 1.2 V core with selectable 1.8 V or 2.5 V VCCIO banks, the device directly interfaces to common CMOS image sensors (OV7670, MT9V032, AR0134) without level shifters. For a 4-channel SD-card surveillance DVR, a single 10CL006YU256C8G can aggregate four D1 streams into one compressed H.264 output, eliminating a discrete bridge ASIC.
Recommended
Low-Density Telecom Protocol Bridging
The 10CL006YU256C8G serves as a low-density telecom protocol bridge between line-card ASICs, FPGAs, and backplane SERDES links. Its 2 general-purpose PLLs derive independent clocks for E1/T1, I2S, and SPI-based serial backhaul interfaces, while 20 global clock networks keep skew tight across the 176 user I/O driving the bus. With embedded multipliers and SRAM blocks, the device can host custom HDLC, GFP, or 64B/66B encoding without external logic. The 256-UBGA package fits beneath a heatsink in dense line-card designs, and the C8 commercial speed grade is sufficient for indoor Central Office environments (0 C to +85 C). For protocol-bridging tasks that previously required a $50 mid-range FPGA, the 10CL006YU256C8G delivers equivalent functionality at roughly half the unit cost, while remaining bitstream-compatible with Quartus Prime IP libraries.
Recommended
Embedded Programmable Glue Logic
The 10CL006YU256C8G is ideal as programmable glue logic between a microprocessor (NXP i.MX, Intel Atom, or AMD Ryzen Embedded) and a heterogeneous mix of peripherals. Its 176 user I/O deliver more GPIO and bus pins than any single MCU, while 6,272 logic elements are sufficient for custom I2C/SPI/I2S bridges, address decoders, watchdog timers, and bus arbiters. The 256-UBGA 1.0 mm pitch is reflow-compatible with standard SMT lines, and the C8 commercial speed grade meets the timing needs of most glue-logic paths. Compared with multiple discrete 74AVC/74LVC bus switches, a single 10CL006YU256C8G collapses 5-10 logic ICs into one device, simplifying schematic review and PCB routing. The Quartus Prime Lite Edition toolchain enables bitstream updates over JTAG or EPCQ flash in the field.
Recommended
Automotive Infotainment and Body Electronics
The 10CL006YU256C8G commercial part can be deployed in non-safety automotive infotainment and body-electronics modules such as head-unit display controllers, HVAC control panels, and rear-seat entertainment hubs. Its 176 user I/O drive multiple RGB or LVDS displays, capacitive touch controllers, and CAN/LIN transceivers in parallel. The 6,272 logic elements host a Nios II soft-core for user-interface management while dedicated hardware blocks perform display refresh and backlight PWM dimming. For applications that require the wider -40 C to +125 C automotive temperature range, the pin-compatible 10CL006YU256A7G variant (automotive speed grade 7) drops into the same U256 footprint. Designers should verify AEC-Q100 qualification status with Intel before deploying in safety-critical ECUs.
Recommended
IoT Edge Sensor Aggregation Gateway
The 10CL006YU256C8G is an excellent fit for IoT edge gateways that aggregate multiple low-speed sensor buses (I2C, SPI, UART, 1-Wire, GPIO) into a single Ethernet or Wi-Fi uplink. Its 6,272 logic elements can host 8-12 soft I2C or SPI controllers in parallel, while 176 user I/O accommodate dozens of sensor inputs on a star topology. The 15 embedded 18x18 multipliers can implement low-rate DSP such as moving-average filtering or threshold detection before forwarding. The 1.2 V VCCINT core keeps quiescent power low, important for battery-backed or solar-powered remote deployments. With Quartus Prime, designers can update the gateway's sensor-protocol stack in the field via the same EPCQ flash used for configuration, enabling remote feature rollouts.
Recommended
Recommended Products Summary
Engineering reference data for 10CL006YU256C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL006YU256C6G | 10CL006YU256A7G | 10CL006YU256I8G | 10CL010YU256C8G | 10CL016YU256C8G | 10CL025YU256C8G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball UBGA (U256), 17x17 mm | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same | 256-ball UBGA (U256), 17x17 mm - same |
| Logic Elements | 6,272 | 6,272 (identical) | 6,272 (identical) | 6,272 (identical) | 10,320 (+65%) | 15,408 (+146%) | 24,576 (+292%) |
| Embedded Memory (bits) | 276,480 | 276,480 (identical) | 276,480 (identical) | 276,480 (identical) | 423,936 (+53%) | 516,096 (+87%) | 608,256 (+120%) |
| User I/O (max) | 176 | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) | 176 (identical) |
| Speed Grade | C8 (commercial) | C6 (slower, lower-margin) | A7 (automotive, -40C to +125C) | I8 (industrial, -40C to +100C) | C8 (commercial) | C8 (commercial) | C8 (commercial) |
| Embedded 18x18 Multipliers | 15 | 15 (identical) | 15 (identical) | 15 (identical) | 24 (+60%) | 56 (+273%) | 66 (+340%) |
| Configuration Flash Companion | EPCS4/EPCQ16 | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS4/EPCQ16 (same) | EPCS16/EPCQ32 (larger bitstream) | EPCS16/EPCQ32 (larger bitstream) |
Key Differentiators
- Pin-compatible with 6K to 25K LE Cyclone 10 LP family in same U256 footprint (vs 10CL025YU256C8G)
- Industrial and automotive speed-grade options in same U256 footprint (vs 10CL006YE144C8G (144-pin EQFP))
- Lowest static power in the Cyclone 10 LP family at this LE count (vs Cyclone IV E EP4CE6E22 (60 nm, older generation))
Design Notes
Estimated: the 10CL006YU256C8G draws roughly 200-400 mA from a 1.2 V VCCINT supply in a typical design at 25 C ambient. Use a low-noise LDO (e.g. TPS7A4701) or a high-efficiency DC-DC converter with output filtering to feed the core. All eight I/O banks require their own VCCIO rails; banks powered at different voltages (1.8 V vs 3.3 V) must be supplied from independent regulators or a properly sequenced power tree. Failure to keep VCCINT monotonic during power-up is a leading cause of configuration failures on Cyclone 10 LP devices.
The 256-ball UBGA package uses a 1.0 mm ball pitch. Per IPC-7351 and the Altera package user guide, the PCB land pattern should be non-solder-mask-defined (NSMD) with a 0.55 mm pad diameter and 0.65 mm solder-mask opening to ensure reliable joint formation. Use microvia-in-pad or 0.2 mm laser-drilled vias for escape routing; standard 0.3 mm mechanical drill vias typically cannot escape the dense inner balls without layer-count penalty. Apply a uniform 17 mm x 17 mm thermal copper pour under the package, stitched with 0.3 mm thermal vias on a 1.0 mm grid, to keep junction temperature below 85 C at typical load.
Do not apply non-zero signals to any I/O pin before VCCINT and VCCIO have reached their nominal values - this can trigger I/O latch-up and permanently damage the device. Ensure CONFIG_DONE goes high within the expected ms-level window after configuration; if it stays low, check that the configuration clock (DCLK) is stable and that nCONFIG and nSTATUS are correctly pulled up to VCCIO. Also avoid routing high-speed LVDS pairs over splits in the underlying power plane, which can introduce common-mode noise and degrade eye margin. Use Quartus Prime's Pin Planner to verify all bank VCCIO assignments before generating the bitstream.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page declaration. Standard C8 variant is not AEC-Q100 qualified - select 10CL006YU256A7G for automotive applications. Halogen-free and lead-free per Intel PSG material declaration.
