Intel

10CL006ZU256I8G - Cyclone 10 LP FPGA 6K LE | Intel | UFBGA-256

MPN: 10CL006ZU256I8G ✓ Active
In Stock Ships in 1-3 business days
1.0 V / 1.2 V (VCCINT) Vdss 256-ball UFBGA (UBGA), 0.8 mm pitch Package 276,480 bits Memory
From $7.83 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $9.79 $9.79
10 $9.3 $93.00
100 $8.81 $881.00
500 $8.32 $4,160.00
1,000 $7.83 $7,830.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CL006ZU256I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10CL006YU256I8G

✅ Drop-In
📦 256-ball UFBGA (UBGA)
same U256 footprint, same 6,272 LE die, Y-marking vs Z - same speed/pinout

📋 Reference alternative (not in catalog)

10CL006YU256C8G

✅ Drop-In
Intel
📦 256-ball UFBGA (UBGA)
Cyclone 10 LP · 6,272 · 276,480 · 176 · 15 · 2 · 20 · 256-ball UBGA (U256), 17 mm x 17 mm

✓ In Stock

$24.6 / Unit

View Datasheet →

10CL006YU256C6G

✅ Drop-In
Intel
📦 256-ball UFBGA (UBGA)
Cyclone 10 LP · 6272 · 276480 · 176 · 256-LFBGA · Surface Mount · C6G · [DATA_NEEDED: Number of LABs]

✓ In Stock

$3 / Unit

View Datasheet →

10CL006YU256A7G

✅ Drop-In
Intel
📦 256-ball UFBGA (UBGA)
Cyclone 10 LP · 6,272 · 276,480 · 30 blocks (270 Kbits) · 176 · 2 · 256-UBGA (Ultra FineLine BGA) · -40C to +125C (Automotive / Industrial grade 'A7G' suffix)

✓ In Stock

$28.92 / Unit

View Datasheet →
ℹ️ 2 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

10CL006ZU256I8G Maximum Ratings & Electrical Characteristics

Series Cyclone 10 LP
Logic Elements (LE) 6,272
Embedded Memory Bits 276,480 bits
Embedded Memory Blocks 30 M9K blocks (270 Kbits)
18 x 18 Embedded Multipliers 15
General-Purpose PLLs 4
Maximum User I/O Pins 176
Package 256-ball UFBGA (UBGA), 0.8 mm pitch
Operating Temperature -40 C to +100 C (Industrial)
Supply Voltage - Core 1.0 V / 1.2 V (VCCINT)
Supply Voltage - I/O 1.2 V to 3.3 V (VCCIO, per bank)
Process Technology 60 nm low-power CMOS
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

10CL006ZU256I8G 256-ball ufbga (ubga), 0.8 mm pitch Pin Configuration Guide

Complete pinout information for 10CL006ZU256I8G (256-ball ufbga (ubga), 0.8 mm pitch package) with 176 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball ufbga (ubga), 0.8 mm pitch package pinout diagram for 10CL006ZU256I8G

No detailed pinout data available for 10CL006ZU256I8G.

Refer to the datasheet for full pin configuration.

Estimated pin count: 176 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CL006ZU256I8G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CL006ZU256I8G is suitable for 6 applications: Industrial Machine Vision Front-End, Factory Automation Controller, Video Bridging and Aggregation Panel, Motor Drive Signal Conditioning, I/O Expansion Bridge for Embedded SBCs, Low-Cost Industrial Networking Gateway.

🎥

Industrial Machine Vision Front-End

The 10CL006ZU256I8G is well-suited to industrial machine vision front-ends that aggregate multiple parallel image sensors. Its 6,272 LEs implement Bayer-to-RGB conversion and color correction, while the 30 M9K memory blocks (270 Kbits total) hold line buffers for resolution up to 1080p at 60 fps. The 15 dedicated 18 x 18 multipliers handle Sobel filtering and convolution kernels without consuming general logic. With 176 user I/O across 8 banks, the FPGA can interface parallel image sensors (CMOS Camera Link, LVDS), external DDR2 image buffers, and Gigabit Ethernet output PHYs. Industrial -40 C to +100 C operation ensures factory-floor reliability.

🏭

Factory Automation Controller

Programmable logic controllers in factory automation benefit from the 10CL006ZU256I8G's deterministic parallel processing. The device executes multiple PID control loops in hardware, freeing the host PLC from per-microsecond timing work. Its 4 general-purpose PLLs generate independent clocks for Ethernet (50 MHz), high-speed ADC sampling (100 MHz), and PWM modulator sync (1 MHz). The 256-ball UFBGA package with 176 I/O accepts inputs from multi-axis encoders, 24 V isolated digital inputs, and analog front-ends while driving relay drivers and stepper motor controllers. Quartus Prime Lite provides free synthesis for this part, reducing BOM cost.

📺

Video Bridging and Aggregation Panel

The 10CL006ZU256I8G works as a video bridge in digital signage, video walls, and multi-display kiosks. Its 176 user I/O accept multiple HDMI/DVI/VGA input streams converted via external HDMI receivers and re-driven to LVDS panels. The 6,272 LEs handle chroma upscaling, frame-rate conversion, and alpha blending. M9K memory blocks serve as scan-line buffers to decouple input and output timings. The 60 nm low-power process keeps the package cool at typical 70% LE utilization without a heatsink, which simplifies the slim kiosk enclosure mechanical design.

Motor Drive Signal Conditioning

In motor drive and servo systems, the 10CL006ZU256I8G handles position-feedback decoding and gate-driver signal generation. The 4 PLLs and 15 multipliers drive encoder quadrature decoding (up to 50 MHz), space-vector PWM at 20 kHz carrier, and SVPWM over-modulation algorithms. With 8 I/O banks, the FPGA bridges 3.3 V Hall sensors, 5 V encoders, and 3.3 V gate drivers without level shifters. Its industrial temperature rating and robust signal integrity via LVDS pairs make it a reliable control-law coprocessor alongside a host MCU or DSP in field-oriented control (FOC) topologies.

🧩

I/O Expansion Bridge for Embedded SBCs

The 10CL006ZU256I8G acts as an I/O expansion bridge for ARM-based single-board computers that lack sufficient GPIO or specialized interfaces. Through its 176 user I/O, it adds parallel GPIO, PWM, UART, SPI, I2C, CAN, and even custom interfaces that are software-defined in the FPGA fabric. The host SBC writes control registers via SPI and reads GPIO state via a second SPI link. This offloads real-time pin toggling from the host CPU and provides deterministic latency. The 6K LE budget is sufficient for a Soft-CPU (e.g., Nios V/m) plus 10+ peripherals in custom embedded systems.

🌐

Low-Cost Industrial Networking Gateway

The 10CL006ZU256I8G enables low-cost industrial networking gateways that bridge Modbus RTU, PROFINET, EtherCAT, and OPC UA. The 176 user I/O handle multiple isolated RS-485 ports, while the 6,272 LEs run the EtherCAT slave controller (ESC) IP, PROFINET IRT stack, or custom real-time Ethernet. Its industrial temperature range allows deployment in cabinet-mounted DIN-rail gateways without active cooling. The combination of Quartus Prime Lite free synthesis, abundant I/O, and small footprint supports sub-USD 200 BOM cost at 1K volume - ideal for retrofit IOT bridges.

Recommended Products Summary

MT48LC16M16A2 External SDRAM for frame buffering Used in: Industrial Machine Vision Front-End DP83848 Industrial Ethernet PHY for image transmission Used in: Industrial Machine Vision Front-End EPCQ16 AS configuration flash for bitstream storage Used in: Industrial Machine Vision Front-End EPCS16 Legacy serial configuration flash Used in: Factory Automation Controller MAX3485 RS-485 transceiver for industrial fieldbus Used in: Factory Automation Controller ADS131A04 24-bit sigma-delta ADC for sensor readout Used in: Factory Automation Controller ADV7511 HDMI transmitter Used in: Video Bridging and Aggregation Panel TFP401 DVI/HDMI receiver Used in: Video Bridging and Aggregation Panel MT47H64M16 DDR2 frame buffer memory Used in: Video Bridging and Aggregation Panel DRV8301 Three-phase gate driver Used in: Motor Drive Signal Conditioning ADS1204 Sigma-delta modulator for current sensing Used in: Motor Drive Signal Conditioning EPCQ32 Configuration flash for larger bitstream Used in: Motor Drive Signal Conditioning MCP2515 CAN controller over SPI Used in: I/O Expansion Bridge for Embedded SBCs W25Q128 External QSPI flash for firmware backup Used in: I/O Expansion Bridge for Embedded SBCs TXS0108E 8-bit level shifter for mixed-voltage I/O Used in: I/O Expansion Bridge for Embedded SBCs LAN9252 EtherCAT slave controller Used in: Low-Cost Industrial Networking Gateway ISL3179 Isolated RS-485 transceiver Used in: Low-Cost Industrial Networking Gateway KSZ9031 Gigabit Ethernet PHY Used in: Low-Cost Industrial Networking Gateway
What is the logic element count of the 10CL006ZU256I8G?
The 10CL006ZU256I8G contains 6,272 logic elements (LEs), making it the entry-point device in the Cyclone 10 LP family. According to the Intel Cyclone 10 LP device overview, this 6K LE density targets cost-sensitive industrial control, video bridging, and I/O expansion designs where Cyclone IV 6K legacy silicon is being migrated forward to a current-generation, Quartus Prime-supported part.
How much embedded memory does the 10CL006ZU256I8G have?
The 10CL006ZU256I8G integrates 276,480 bits of embedded SRAM organized as 30 M9K blocks of 9 Kbits each. Per the Intel datasheet, M9K blocks support single-port, dual-port, shift-register, FIFO, and ROM modes up to 315 MHz. This memory capacity is sufficient for line buffers in machine vision, video frame rate conversion, and high-speed data acquisition front-ends.
How many user I/O pins does the 10CL006ZU256I8G provide?
The 10CL006ZU256I8G provides up to 176 general-purpose user I/O pins distributed across 8 I/O banks in the 256-ball UBGA package. Each bank supports a mix of LVTTL, LVCMOS, LVDS, SSTL, and HSTL I/O standards with independent VCCIO rails, allowing direct interfacing to 1.2 V to 3.3 V peripherals without external level shifters.
Is the 10CL006ZU256I8G in stock at major distributors?
As of 2026-09-05, the 10CL006ZU256I8G is shown in stock at distributor Heisener with 5,920 pieces and at additional franchised distributors including DigiKey, Mouser, and Arrow. Lead time is listed as 'to be confirmed' with an estimated delivery window of Dec 8 - Dec 13 on Heisener. XAIPART offers quote-based ordering for industrial customers.
What is the current unit price of the 10CL006ZU256I8G?
The 10CL006ZU256I8G unit price is approximately USD 9.79 at qty 1 as of 2026-09-05, based on distributor listings. Volume pricing drops to roughly USD 8.81 at qty 100, USD 8.32 at qty 500, and USD 7.83 at qty 1000. For real-time price breaks across all authorized distributors, check Octopart or the XAIPART price engine on this product page.
Where can I download the 10CL006ZU256I8G datasheet PDF?
The official Intel (formerly Altera) Cyclone 10 LP device family datasheet is available on the Intel FPGA Documentation Hub at intel.com. The part-specific pin connection guidelines, thermal model, and IBIS models for the U256 package can be requested through your Intel FPGA sales channel. Authorized distributors DigiKey and Mouser also host a copy of the family datasheet on their product pages.
What is the pinout of the 10CL006ZU256I8G U256 package?
The 10CL006ZU256I8G uses a 256-ball UFBGA package (also marketed as UBGA) with a 0.8 mm ball pitch and 16 x 16 ball grid. Pin assignments are listed in the Cyclone 10 LP device pin tables (U256 column) and include dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]), JTAG (TCK, TMS, TDI, TDO), clock inputs, PLL supplies, and 176 user I/O balls spread across 8 banks.
10CL006ZU256I8G vs 10CL006ZE144I8G - which should I choose?
The 10CL006ZU256I8G (U256 / 256-ball UBGA, 176 I/O) gives you 26 more user I/O and 0.8 mm ball pitch versus the 10CL006ZE144I8G (E144 / 144-pin EQFP, 88 I/O). Choose U256 when you need >88 I/O or a denser BGA layout; choose E144 when you need through-hole-friendly QFP assembly, hand-reworkability, or a smaller pin-count PCB. Both share the same 6,272 LE die and are drop-in compatible at the Quartus Prime fitter level.
What is the best drop-in replacement for the 10CL006ZU256I8G?
The best drop-in replacements for the 10CL006ZU256I8G in the same U256 footprint are other 10CL006ZU256I8G speed/grade variants such as 10CL006YU256I8G (faster speed grade -8) or 10CL006YU256C8G/C6G (commercial grade). These share identical U256 pinout and the same 6,272 LE die, differing only in speed grade and temperature range. They can be substituted on the same PCB without any layout changes.
Can a Cyclone IV 6K be replaced by the 10CL006ZU256I8G?
Yes - the 10CL006ZU256I8G is the recommended forward-migration path from the Cyclone IV E EP4CE6 family. Intel's Cyclone 10 LP migration guide documents pinout-equivalent U256 packages, compatible configuration schemes, and Quartus Prime 17.0+ design re-compilation steps. Note that the I/O bank voltages are backward compatible (1.2 V to 3.3 V) but the core voltage drops from 1.2 V to 1.0 V, requiring a regulator update.
Is the 10CL006ZU256I8G suitable for industrial machine vision applications?
Yes. The 10CL006ZU256I8G's 6,272 LEs, 30 M9K memory blocks (line buffers), 15 dedicated 18 x 18 multipliers (pixel processing), and 176 user I/O are well-matched to industrial machine vision front-ends that aggregate multiple parallel image sensors. Its industrial -40 C to +100 C junction rating and RoHS compliance make it acceptable for factory-floor and outdoor installations.
What configuration flash is recommended for the 10CL006ZU256I8G?
Intel recommends the EPCQ16 or EPCQ32 active-serial (AS) configuration flash for the 10CL006ZU256I8G, depending on compressed bitstream size. For small designs (under 4 Mbits), the EPCQ4 is sufficient. The AS x1 or AS x4 mode is selected by MSEL[3:0] = 4'b0101 (AS fast) or 4'b0001 (AS normal) per the Cyclone 10 LP configuration user guide.
What is the power consumption of the 10CL006ZU256I8G?
The 10CL006ZU256I8G typical static current is in the low tens of milliamps at room temperature, and dynamic current scales with toggle rate and logic utilization. Using the Intel Quartus Prime PowerPlay Early Power Estimator (EPE) spreadsheet with your design's toggle rate, LE utilization, and PLL usage is the recommended way to obtain a board-level power budget. Designers should also include a thermal analysis for >70% LE utilization.
Hey Google, what can replace the 10CL006ZU256I8G?
Direct drop-in alternatives in the same U256 footprint include 10CL006YU256I8G (faster -8 speed grade, same temperature range) and 10CL006YU256C8G (commercial 0 C to +85 C, same -8 speed grade). All variants share the identical 6,272 LE die and U256 pinout, so no PCB rework is required. For higher logic density in the same family, the 10CL010ZU256I8G (10K LE) is pin-compatible at the bank level but has a different pin map - always re-check the pinout before substitution.
What are the key specifications of the 10CL006ZU256I8G that engineers should know?
The 10CL006ZU256I8G key specifications are: 6,272 logic elements, 276,480 bits embedded SRAM in 30 M9K blocks, 15 dedicated 18 x 18 multipliers, 4 general-purpose PLLs, 176 maximum user I/O, 1.0 V/1.2 V core (VCCINT) with 1.2 V to 3.3 V VCCIO per bank, industrial -40 C to +100 C junction, 60 nm low-power CMOS process, and 256-ball UFBGA package with 0.8 mm pitch. Source: Intel Cyclone 10 LP device overview.

Engineering reference data for 10CL006ZU256I8G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CL006ZU256I8G when you need a Cyclone 10 LP 6K LE FPGA in the U256 BGA package with industrial -40 C to +100 C temperature grade and the -8 speed grade. Pick 10CL006YU256I8G if you need the same U256 footprint but a faster speed grade (the -8 vs -I8 distinction in Cyclone 10 LP nomenclature). Pick 10CL006YU256C8G or 10CL006YU256C6G for cost-sensitive commercial products. Pick 10CL006YU256A7G for AEC-Q100 automotive applications. All four share identical U256 ball pattern and can be substituted on the same PCB with no layout changes - making the Cyclone 10 LP U256 family an excellent single-platform solution for design teams that ship across multiple market segments.

Comparison with Alternatives

Parameter This Product 10CL006YU256I8G 10CL006YU256C8G 10CL006YU256C6G 10CL006YU256A7G
Brand Intel Intel Intel Intel Intel
Package 256-ball UFBGA (UBGA) 256-ball UFBGA (UBGA) 256-ball UFBGA (UBGA) 256-ball UFBGA (UBGA) 256-ball UFBGA (UBGA)
Logic Elements 6,272 6,272 6,272 6,272 6,272
Embedded Memory 276,480 bits (30 M9K) 276,480 bits 276,480 bits 276,480 bits 276,480 bits
18 x 18 Multipliers 15 15 15 15 15
Maximum User I/O 176 176 176 176 176
Operating Temperature -40 C to +100 C (Industrial) -40 C to +100 C (Industrial) 0 C to +85 C (Commercial) 0 C to +85 C (Commercial) -40 C to +125 C (Automotive)
Speed Grade -8 (slowest) -8 -8 -6 -7
PLLs 4 4 4 4 4
Unit Price (qty 1) $9.79 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Industrial -40 C to +100 C junction temperature rating (vs 10CL006YU256C8G)
  • Same U256 footprint across Cyclone 10 LP speed and temperature grades (vs 10CL006ZE144I8G (E144 EQFP))
  • 60 nm low-power process optimized for thermal-constrained designs (vs Cyclone IV EP4CE6E144 (60 nm process))

Design Notes

The 10CL006ZU256I8G requires three independent supply rails: VCCINT (1.0 V or 1.2 V core, up to ~300 mA static + dynamic), VCCA (1.2 V PLL analog, low noise), and VCCIO per bank (1.2 V to 3.3 V). Place a 100 nF X7R 0402 decoupling capacitor within 100 mil of every VCCINT/VCCA/VCCIO ball, plus 4.7 uF and 47 uF bulk ceramic/polymer on each regulator output. Sequence VCCINT before VCCIO if the design uses 1.0 V core; using a common 1.2 V rail for both simplifies sequencing but increases power by ~25%.

The 256-ball UFBGA with 0.8 mm pitch requires microvia (laser-drilled) HDI stackup - 4-layer 1+N+1 designs are possible, but 6-layer 2+N+2 is recommended for 100+ MHz DDR2 interfaces. Use 1 oz finished copper for power planes to limit voltage drop at peak switching. Maintain continuous ground reference under BGA breakouts and stitch the BGA ground ring to the inner ground plane with 8 to 16 vias for thermal and return-path integrity.

Route configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) away from switching I/O to avoid false configuration events during power-up. MSEL[3:0] must match the chosen configuration scheme (AS fast, AS normal, PS, JTAG) via 10 kohm pull-ups/pull-downs; check the Cyclone 10 LP configuration user guide for the latest MSEL table. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups on TCK/TMS/TDI for stable boundary-scan operation.

Differential pairs (LVDS, DDR clock) routed from the U256 balls must maintain 100 ohm differential impedance and length-match within 20 mils. Use the 50 ohm controlled-impedance guideline from the Intel Cyclone 10 LP device pin connection guidelines document. Series-damping resistors (22 ohm to 33 ohm) near the FPGA are recommended for sub-50 MHz edge rates to suppress reflections; use IBIS simulation to verify.

Do not assume the Cyclone IV E 6K footprint maps pin-for-pin to the Cyclone 10 LP U256 package - Intel's migration guide documents intentional pinout differences for differential pairs and configuration pins. Re-compile the Quartus Prime project against the new pin assignments and re-run the Pin Planner. Also verify that EPCQ (not legacy EPCS) configuration flash is selected, since 1.0 V core parts require AS fast mode with EPCQ for power-on reset timing.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free compliant per Intel product declaration. Industrial temperature grade is not AEC-Q100 qualified; choose automotive grade 10CL006YU256A7G for AEC-Q100 designs. REACH compliance per Intel product page. Halogen-free status not explicitly stated in verified web data - marked unknown.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10CL006ZU256I8G 10CL006YU256I8G 10CL006YU256C8G 10CL006YU256C6G 10CL006YU256A7G FPGA Field-Programmable Gate Array programmable logic device logic element Cyclone 10 LP M9K memory block PLL UFBGA UBGA ball grid array Quartus Prime RoHS industrial temperature grade AEC-Q100 configuration flash EPCQ AS configuration mode DDR2 controller
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