10CL010ZU256I8G - Cyclone 10 LP FPGA 10K LE 256-UBGA | Intel
MPN: 10CL010ZU256I8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $24.9 | $12,450.00 |
| 1,000 | $22.1 | $22,100.00 |
Drop-in alternatives for 10CL010ZU256I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL010YU256I8G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL010YU256I7G
✅ Drop-In✓ In Stock
$27.18 / Unit
View Datasheet →10CL006ZU256I8G
✅ Drop-In✓ In Stock
$7.83 / Unit
View Datasheet →10CL010ZU256I8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory Bits | 423,936 |
| Maximum User I/Os | 176 |
| DSP Blocks (18x18 Multipliers) | 56 |
| PLLs | 4 |
| Global Clocks | 20 |
| Package | 256-ball UFBGA (UBGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 8 |
| Process Technology | Low-power 60 nm |
| Configuration | Serial/Parallel via EPCQ or compatible flash |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Supply Voltage (Core) | 1.0 V to 1.1 V (typical 1.05 V) |
| Supply Voltage (I/O) | 1.2 V to 3.3 V (bank-dependent) |
10CL010ZU256I8G 256-ball ufbga (ubga) Pin Configuration Guide
Complete pinout information for 10CL010ZU256I8G (256-ball ufbga (ubga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL010ZU256I8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL010ZU256I8G is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Processing and Display Bridging, ASIC Prototyping and Design Validation, I/O Expansion and Protocol Bridging, Portable and Battery-Powered Embedded Systems, IoT Edge Nodes and Smart Sensors.
Industrial Motor Control and Factory Automation
The 10CL010ZU256I8G is well-suited to industrial motor control and PLC-style factory automation designs because it delivers 10,320 logic elements with 56 hardware 18x18 multipliers, 176 user I/Os, and industrial-grade -40C to +100C operation in a 256-ball UFBGA package. Designers typically place the device between encoder inputs and the power-stage gate driver, using the multipliers for closed-loop vector control math and the embedded RAM for state-machine buffering. The low static power (around 25-50 mW typical in Cyclone 10 LP) simplifies thermal design in sealed enclosures, and the LVDS-capable I/O banks directly interface to industrial encoders without external translation.
Recommended
Video Processing and Display Bridging
For video format conversion and panel bridging, the 10CL010ZU256I8G offers 423 Kbits of embedded RAM (enough for one or two line buffers), 56 DSP blocks (sufficient for chroma interpolation and scaling), and true-LVDS I/O for direct panel connection. A typical design uses the FPGA to convert DVI/HDMI input into LVDS panel output, with the PLL generating pixel clocks from 25 MHz to 148.5 MHz. The 176 user I/Os cover full RGB888 plus control signals, and the low-power 60 nm process keeps the device cool without a heatsink in small-form-factor displays.
Recommended
ASIC Prototyping and Design Validation
Engineers prototyping mid-density ASIC designs often use the 10CL010ZU256I8G as a low-cost, low-power functional validation platform. With 10,320 LEs and 56 DSP blocks, the device comfortably fits RTL blocks up to roughly 30K equivalent ASIC gates plus bounded verification IP. Quartus Prime's incremental compile flow lets designers iterate on individual modules without full re-synthesis, and the industrial temperature grade supports lab bring-up in uncontrolled thermal environments. Migration to ASIC is straightforward because Cyclone 10 LP synthesis maps predictably to standard-cell libraries.
Recommended
I/O Expansion and Protocol Bridging
A common use for the 10CL010ZU256I8G is bridging legacy microcontrollers to modern high-speed buses - for example, expanding a host MCU's UART/I2C/SPI into a parallel bus, USB 2.0, or RGMII Ethernet interface. The 176 user I/Os accommodate both the slow-speed legacy side and the fast serial side, and the dedicated PLL provides the precise clocking needed for RGMII (125 MHz) or USB (48 MHz). Drop-in compatibility with the 10CL006ZU256I8G lets designers ship cost-reduced variants when bridging logic fits in 6K LEs.
Recommended
Portable and Battery-Powered Embedded Systems
Low static power is the defining characteristic that makes the 10CL010ZU256I8G appropriate for handheld test equipment, portable medical peripherals, and battery-powered industrial sensors. Cyclone 10 LP typical static power is in the 25-50 mW range - an order of magnitude lower than mid-range FPGAs - so the device can run continuously from a small lithium cell. Designers commonly use the FPGA to consolidate discrete glue logic, perform sensor pre-processing with the 56 DSP blocks, and wake the host processor only on threshold crossings.
Recommended
IoT Edge Nodes and Smart Sensors
For IoT edge aggregation, the 10CL010ZU256I8G provides enough logic to perform sensor fusion across multiple I2C/SPI sensors, run a lightweight MAC or protocol stack, and drive a low-power wireless modem. The 176 user I/Os handle 4-8 sensor buses plus a parallel RGB or MIPI bridge to a small local display, while the DSP blocks accelerate FIR filtering of accelerometer or microphone data. The Cyclone 10 LP low-power profile matches the duty-cycled sleep pattern typical of battery-powered edge nodes, and Intel's long-term product longevity commitment supports 10+ year industrial deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CL010ZU256I8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL010YU256I8G | 10CL010YU256I7G | 10CL006ZU256I8G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 256-ball UFBGA (UBGA) | 256-ball UFBGA (UBGA) - same | 256-ball UFBGA (UBGA) - same | 256-ball UFBGA (UBGA) - same |
| Logic Elements | 10,320 | 10,320 (identical) | 10,320 (identical) | 6,272 (-39%) |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 270,336 bits |
| Maximum User I/Os | 176 | 176 | 176 | 176 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +125C) | Industrial (-40C to +100C) |
| DSP Blocks (18x18) | 56 | 56 | 56 | 36 |
| Unit Price (1 pc, as of 2026-09-05) | $38.50 | $38.50 (similar) | [DATA_NEEDED] | Lower (smaller die) |
Key Differentiators
- Pin-compatible across Cyclone 10 LP family density variants (vs 10CL006ZU256I8G)
- Industrial temperature grade with extended operating range (vs 10CL010YU256C8G)
- Lowest static power in Cyclone 10 LP family (vs Cyclone 10 GX (10CX series))
Design Notes
The 256-ball UFBGA requires 0.8 mm pitch fan-out with at least 4 routing layers. Use Intel's Cyclone 10 LP pin connection guidelines for proper power-pin and GND-ball placement. Place decoupling capacitors (0.1 uF + 10 uF) within 100 mils of each VCCIO/VCC ball, and stitch the GND plane with vias on every other GND ball for thermal dissipation. BGA escape routing must use 4 mil traces with 4 mil spaces for reliable fabrication.
Estimate: Cyclone 10 LP static current is typically 25-50 mW at 1.05 V core, plus per-bank VCCIO current proportional to switching I/O. For a 176-IO design switching LVCMOS 3.3 V at 50 MHz, total power is typically 200-500 mW. Use a switching regulator with a 1.0 V LDO post-regulation stage for the core supply to optimize efficiency and noise. Decoupling bulk capacitance (47 uF) is required near the device to handle simultaneous switching output (SSO) transients.
Do not leave unused I/O banks floating; tie unused I/Os to a defined logic level via Quartus Pin Planner to prevent configuration failure. The CONF_DONE, nSTATUS, and nCONFIG pins must be pulled up to VCCIO of the configuration bank per Intel's guidelines. Configuration failures often trace to missing pull-ups on MSEL[3..0] selection pins - these must be hard-wired to match the chosen configuration mode (AS, PS, JTAG, or FPP).
Compliance Information
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - choose automotive-qualified Cyclone 10 LP variants for automotive deployments.
