10M08DAF484I7P - MAX 10 FPGA 8K LE 484-BGA | Intel / Altera
MPN: 10M08DAF484I7P β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.5 | $36.50 |
| 10 | $32.85 | $328.50 |
| 100 | $28.95 | $2,895.00 |
| 250 | $26.4 | $6,600.00 |
| 1,000 | $22.1 | $22,100.00 |
Drop-in alternatives for 10M08DAF484I7P β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M08DAF484I7G
β Drop-Inβ In Stock
$25.8 / Unit
View Datasheet β10M08DAF484C8G
β Drop-Inβ In Stock
$27.65 / Unit
View Datasheet β10M08DAF484A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M08DAF484I5G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M08DAF484I7P Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory | 378 Kbits (46,080 M9K bits) |
| User I/O Count | 250 |
| Package | 484-ball FBGA (F484) |
| Pitch | 1.0 mm |
| Core Voltage | 1.0 V |
| Speed Grade | -7 |
| Operating Temperature | -40 C to +100 C (Industrial) |
| On-chip Configuration Flash | Yes, dual-boot |
| Embedded ADC | 12-bit, 1 Msps, 16 channels |
| DSP Blocks | Yes (24 x 18-bit multipliers) |
| PLLs | 4 |
| User Flash | 8 Kbits (non-volatile) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10M08DAF484I7P Pin Configuration
| Pin A1 | IO_A1 β User I/O (bank 1A) |
| Pin A2 | IO_A2 β User I/O (bank 1A) |
| Pin A3 | IO_A3 β User I/O (bank 1A) |
| Pin B1 | VCCIO1A β I/O bank 1A supply (1.2-3.3 V) |
| Pin B2 | GND β Ground |
| Pin C1 | IO_B1 β User I/O (bank 1B) |
| Pin C2 | CONFIG β Configuration mode select |
| Pin D1 | IO_B2 β User I/O (bank 1B) |
| Pin D2 | TCK β JTAG clock |
| Pin E1 | IO_B3 β User I/O (bank 1B) |
| Pin E2 | TMS β JTAG mode select |
| Pin F1 | IO_B4 β User I/O (bank 1B) |
| Pin F2 | TDI β JTAG data in |
| Pin G1 | GND β Ground |
| Pin G2 | TDO β JTAG data out |
| Pin H1 | VCCINT β Core supply (1.0 V) |
| Pin H2 | nCONFIG β Configuration reset (active low) |
| Pin J1 | VCCINT β Core supply (1.0 V) |
| Pin J2 | nSTATUS β Configuration status |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DAF484I7P is suitable for 7 applications: Industrial Motor and Motion Control, Factory Automation I/O Expansion, Sensor Fusion and Data Pre-Processing, Low-Cost Video Bridging and Display Conversion, Portable Medical Instrumentation, LED Lighting and Stage-Control Systems, Communications Protocol Bridging.
Industrial Motor and Motion Control
The 10M08DAF484I7P fits industrial motor control because its 8,000 logic elements and 24 DSP blocks deliver deterministic parallel processing of quadrature encoder feedback, PWM generation, and current-loop calculations at multi-MHz update rates. The 250 user I/Os in the F484 package allow direct connection to multiple H-bridge gate drivers and resolver/excitation signals without external muxing. The integrated 12-bit 1 Msps ADC samples phase currents and DC-bus voltage in parallel with PWM generation, eliminating the latency of off-chip ADC interfaces. Compared with a microcontroller plus external FPGA solution, the MAX 10 single-chip approach reduces BOM cost by 30-50% and improves control-loop jitter below 100 ns.
Recommended
Factory Automation I/O Expansion
In factory automation PLC and remote I/O racks, the 10M08DAF484I7P serves as a programmable I/O concentrator, mapping any input voltage standard (1.5 V through 3.3 V LVCMOS/LVTTL, plus LVDS) to a high-speed backplane such as SPI, parallel, or SERDES. Its industrial -40 C to +100 C temperature grade handles cabinet environments without derating. The 250 I/Os aggregate dozens of digital sensors, optocouplers, and 24 V field-side signals through level shifters, replacing discrete glue logic and reducing PCB area by 60%. Dual-boot on-chip flash enables field firmware upgrades and fail-safe rollback - critical for unmanned factory cells.
Recommended
Sensor Fusion and Data Pre-Processing
The 10M08DAF484I7P pre-processes multi-sensor data streams (IMU, LiDAR, image sensors) before forwarding to a host processor. Its 24 DSP blocks perform FIR/IIR filtering and FFT acceleration at sample rates that overwhelm microcontrollers. The integrated 16-channel 12-bit ADC directly digitizes analog sensor outputs (temperature, strain gauge, microphone) without external ADC ICs, while the on-die 8 Kbit user flash stores calibration constants and per-unit ID. Industrial temperature grade supports automotive and outdoor deployments where commercial-grade parts would fail. Quartus Prime Lite allows free development, eliminating IDE licensing costs.
Recommended
Low-Cost Video Bridging and Display Conversion
The 10M08DAF484I7P bridges parallel RGB or OpenLDI display interfaces to LVDS or MIPI-DSI by leveraging up to 1.6 Gbps LVDS capability and its 24 DSP blocks for color-space conversion. The 250 I/Os accommodate 18-bit RGB, control signals, and touch-panel interface in a single chip. Its deterministic timing avoids the latency and jitter of software-only conversions, suiting industrial HMI panels and kiosk displays. Commercial pricing under 23 USD at volume makes it competitive with dedicated bridge ASICs. Quartus Prime reference designs shorten time-to-market for common panel resolutions.
Recommended
Portable Medical Instrumentation
In portable patient-monitoring and point-of-care diagnostic equipment, the 10M08DAF484I7P provides the deterministic signal-processing backbone for ECG, SpO2, and pulse-oximetry front-ends. The integrated 16-channel 12-bit ADC simultaneously samples bioelectric signals, while DSP blocks execute digital filtering and beat detection without taxing the host CPU. The dual-boot flash supports IEC 62304-compliant firmware updates with rollback, and the -40 C to +100 C industrial temperature grade handles ambulance and outdoor-clinic environments. Low-cost MAX 10 BOM enables sub-200 USD handheld devices where traditional FPGAs would price out.
Recommended
LED Lighting and Stage-Control Systems
Professional LED lighting and stage controllers use the 10M08DAF484I7P to drive hundreds of PWM channels for color-mixing fixtures, dimmer racks, and moving-head lights. The 250 I/Os and 24 DSP blocks deliver per-channel 16-bit PWM at 20 kHz without flicker, while the 4 PLLs generate independent pixel-clock domains for DMX512, SPI, and parallel LED driver ICs. The non-volatile on-die flash instant-on at power-up avoids the boot delay of processor-based lighting consoles, important for safety lighting. Industrial temperature grade tolerates stage heat and outdoor installations.
Recommended
Communications Protocol Bridging
The 10M08DAF484I7P bridges between industrial protocols (EtherCAT, PROFINET, CAN, RS-485, SPI, I2C) and host processors or ASICs that lack specific interface pins. Its 250 I/Os support simultaneous multi-protocol fan-out without external mux ICs, while DSP blocks implement Manchester, 8b/10b, and CRC encoding/decoding in hardware. Industrial temperature grade and on-die flash configuration deliver reliable boot in unattended equipment. The F484 footprint provides routing room for multiple differential pairs needed by RS-485 and CAN transceivers, shortening PCB design cycles.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DAF484I7P β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF484I7G | 10M08DAF484C8G | 10M08DAF484A7G | 10M08DAF484I5G |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 |
| Embedded Memory (Kbits) | 378 | 378 | 378 | 378 | 378 |
| User I/O Count | 250 | 250 | 250 | 250 | 250 |
| Speed Grade | -7 (industrial) | -7 (industrial) | -8 (commercial) | -7 (industrial) | -5 (industrial, slower) |
| Temperature Range | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | -40 C to +125 C | -40 C to +100 C |
| Embedded ADC | 12-bit, 1 Msps, 16-ch | 12-bit, 1 Msps, 16-ch | 12-bit, 1 Msps, 16-ch | 12-bit, 1 Msps, 16-ch | 12-bit, 1 Msps, 16-ch |
| DSP Blocks | 24 (18-bit multipliers) | 24 (18-bit multipliers) | 24 (18-bit multipliers) | 24 (18-bit multipliers) | 24 (18-bit multipliers) |
| Approx. Unit Price @ 1k | 22.10 USD | 22.10 USD (tray -I7G equivalent) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Single-chip FPGA with integrated ADC and configuration flash (vs Generic FPGAs requiring external configuration PROM and external ADC)
- F484 484-ball FBGA delivering 250 I/Os (vs 10M08DAU324I7G with 324-ball BGA and 212 I/Os)
- Industrial -7 speed grade plus full industrial temperature range (vs 10M08DAF484C8G (commercial 0 to +85 C))
Design Notes
Estimated: The 484-ball FBGA at 1.0 mm pitch requires at least a 4-layer PCB with 0.5 oz copper for power and 1.0 oz copper on signal layers. Use a 0.4 mm via pad with 0.2 mm drill on internal layers for via-in-pad escapes. Mount 100 nF decoupling capacitors within 2 mm of each VCC/VCCIO pin pair, plus 10 uF bulk capacitance per power rail. Per-for-ball power/ground assignment follows the F484 pinout table in the MAX 10 device datasheet. Estimated input values used: 250 MHz toggle target, 4-layer stackup, 1.0 V core supply.
Estimated: At 100% logic utilization and 1.0 V core, the 10M08DAF484I7P typically dissipates 1.5-2.5 W in the F484 package, depending on toggle rate. The F484 FBGA theta-JA is approximately 18 C/W with adequate PCB thermal vias in a 6-layer board. Ensure at least 9 thermal vias (0.3 mm drill) under the central BGA ground balls for low thermal resistance. For continuous operation near +100 C ambient, derate toggle rate or apply forced airflow above 1 m/s.
Common pitfalls include: (1) failing to tie nCONFIG high through a 10 kohm resistor and 100 nF cap to ensure clean power-on reset; (2) configuring MSEL pins with incorrect pull-up/pull-down combinations, leaving the device in JTAG-only mode; (3) neglecting to instantiate the altsource_probe megafunction for the integrated 12-bit ADC - it must be explicitly instantiated or the ADC pins remain non-functional; (4) using the wrong Quartus Prime device family library causes place-and-route failures; ensure the project target is MAX 10 (10M08DAF484).
For LVDS operation, route each LVDS pair with 100 ohm differential impedance and length-match within 10 mils. Keep LVDS pairs at least 3W (3 x trace width) away from single-ended signals and clock lines. The MAX 10 LVDS receiver supports up to 1.6 Gbps per channel, but PCB trace loss becomes limiting above 1 Gbps - use Megtron 6 or equivalent low-loss dielectric for backplanes longer than 8 inches.
Compliance Information
RoHS and REACH compliance per Intel/Altera product page; lead-free BGA balls confirmed. Not AEC-Q100 qualified - MAX 10 family has no automotive Q100 variants; for automotive use, select Cyclone V or Cyclone 10 LP instead.
