10CL016ZE144I8G - Cyclone 10 LP FPGA 16K LE 144-EQFP | Intel
MPN: 10CL016ZE144I8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.8 | $288.00 |
| 100 | $24.2 | $2,420.00 |
| 500 | $20.95 | $10,475.00 |
| 1,000 | $18.4 | $18,400.00 |
Drop-in alternatives for 10CL016ZE144I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CL016ZE144I8G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Family | Cyclone 10 LP (10CL016) |
| Logic Elements (LE) | 15,408 |
| Number of Logic Array Blocks | 942 |
| Number of LABs/CLBs | 942 LAB |
| Total Memory Bits | 516,096 bit |
| Embedded Memory (M9K blocks) | 56 blocks |
| 18x18 Multipliers | 56 |
| PLLs | 4 |
| User I/O Pins | 78 |
| I/O Banks | 8 |
| Package | 144-LQFP Exposed Pad (EQFP-144) |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Method | In-system flash (no external boot PROM required) |
| Process Node | 60 nm low-power CMOS |
| RoHS Status | Compliant |
10CL016ZE144I8G 144-lqfp exposed pad (eqfp-144) Pin Configuration Guide
Complete pinout information for 10CL016ZE144I8G (144-lqfp exposed pad (eqfp-144) package) with 78 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016ZE144I8G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 78 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016ZE144I8G is suitable for 7 applications: Industrial Motor and Motion Control, Factory Automation I/O Expansion, Video Surveillance and Image Aggregation, Automotive Driver-Assistance Sub-Systems, Video Format Bridging and Conversion, Low-Cost Digital Signal Processing, Industrial Networking Gateway.
Industrial Motor and Motion Control
The 10CL016ZE144I8G's 56 hardware 18x18 multipliers and 4 PLLs make it well suited to FOC (field-oriented control) loops driving three-phase industrial motors. The 78 user I/O handle encoder feedback (QEI), Hall sensors, gate-driver enable signals, and CAN/Modbus uplinks without external bus-expanders. Industrial -40C to +100C junction range survives sealed-enclosure operation, while low static power (~95 mW typical) suits always-on factory PLCs. The on-chip flash configuration eliminates the SPI boot PROM that older designs required, reducing BOM and improving mean-time-to-repair in field-deployed cabinets.
Recommended
Factory Automation I/O Expansion
In PLC and distributed I/O backplanes, the 10CL016ZE144I8G serves as a glue-logic bridge between an industrial Ethernet PHY and 24V-tolerant sensor/actuator channels. Its 8 I/O banks support mixed-voltage standards (1.2V to 3.3V) on a single die, eliminating external level-shifters when interfacing 1.8V memory, 2.5V PHYs, and 3.3V GPIOs. The 56 hardware multipliers accelerate industrial protocol bit-stuffing (PROFIBUS, CAN-FD) without loading the embedded soft-core CPU. Designers benefit from Quartus Prime IP libraries for EtherCAT, PROFINET, and Modbus TCP acceleration.
Recommended
Video Surveillance and Image Aggregation
Mid-resolution surveillance aggregators that combine two-to-four image-sensor streams use the 10CL016ZE144I8G to perform pixel-level pre-processing (de-mosaic, gamma, edge-enhance) before forwarding compressed streams over Ethernet. The 56 hardware multipliers accelerate Sobel and Laplacian filters, while 516 Kbit embedded memory buffers full-line image data without external SRAM. The 144-EQFP exposed-pad package keeps assembly cost low for high-volume SKUs where wire-bond BGA costs are not justified. LVDS I/O supports direct interfacing with parallel-output image sensors at up to 1080p30.
Recommended
Automotive Driver-Assistance Sub-Systems
Tier-2 ADAS designs that aggregate ultrasonic, radar, and surround-view sensor streams use the 10CL016ZE144I8G for sensor fusion pre-processing and CAN-FD gatewaying. The industrial -40C to +100C junction range survives automotive under-hood and cabin environments, though for full AEC-Q100 qualification designers should validate with the supplier's automotive-grade roadmap. The 56 hardware 18x18 multipliers accelerate FFTs on radar range-Doppler maps, while 4 PLLs generate the multiple clock domains needed by sensor interfaces. Note: this part is industrial-grade; AEC-Q100 qualification requires the supplier's automotive-screened variant.
Recommended
Video Format Bridging and Conversion
The 10CL016ZE144I8G is widely deployed as a format-bridging ASIC replacement that converts between MIPI-CSI, parallel RGB, LVDS, and HDMI-style interfaces in industrial displays and medical imaging carts. The 8 independent I/O banks let a single device handle 1.2V MIPI lanes and 3.3V legacy RGB simultaneously, eliminating external level-translators. With 56 hardware multipliers, the device also performs real-time color-space conversion (YUV422 to RGB888, gamma correction) at 1080p60 with margin. Quartus Prime IP libraries include CSI-2 RX/TX cores that shorten development time.
Recommended
Low-Cost Digital Signal Processing
Cost-sensitive DSP front-ends (audio sample-rate conversion, basic motor-control FFT, vibration analysis for predictive maintenance) use the 10CL016ZE144I8G as a low-power alternative to dedicated DSP processors. The 56 hardware 18x18 multipliers sustain 112 9x9 multiplies per cycle at the device Fmax, sufficient for 256-tap FIR filters or 1024-point FFTs at audio sample rates. Static power of ~95 mW typical is far below competing DSPs, and the integrated flash configuration removes the boot-PROM cost. Designers can prototype in Quartus Prime with the DSP Builder flow, then promote to production silicon.
Recommended
Industrial Networking Gateway
Edge gateways that translate between Modbus, PROFINET, EtherCAT, and MQTT-over-Ethernet use the 10CL016ZE144I8G to offload protocol stacks from the host CPU. The 4 PLLs generate the independent clocks needed for Ethernet MAC, serial PHY, and ADC sampling domains. With 78 user I/O and 8 banks, a single device can host dual Ethernet MACs, an RS-485 bus, and an isolated CAN interface without bus-expanders. On-chip flash configuration ensures the gateway boots unattended after power-cycle, critical for unattended remote installations. Industrial -40C to +100C junction range survives outdoor cabinet temperatures.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016ZE144I8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YE144I7G | 10CL016YE144C8G | 10CL010ZE144I8G | 10CL010YE144I7G | 10CL006ZE144I8G | 10CL006YE144I7G |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 15,408 | 15,408 | 15,408 | 10,320 | 10,320 | 6,272 | 6,272 |
| Embedded Memory | 516 Kbit | 516 Kbit | 516 Kbit | 423 Kbit | 423 Kbit | 270 Kbit | 270 Kbit |
| 18x18 Multipliers | 56 | 56 | 56 | 46 | 46 | 30 | 30 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 2 | 2 |
| User I/O | 78 | 78 | 78 | 78 | 78 | 78 | 78 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I8 (industrial -1 speed bin) | I7 (industrial -2 speed bin) | C8 (commercial -1 speed bin) | I8 | I7 | I8 | I7 |
| Configuration | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Approx. Unit Price (qty-100) | 24.20 USD | 21.80 USD | 20.50 USD | 19.30 USD | 17.40 USD | 14.20 USD | 12.80 USD |
Key Differentiators
- Highest LE density in the 144-EQFP Cyclone 10 LP family (vs 10CL010ZE144I8G)
- Faster industrial speed grade than I7G alternatives (vs 10CL016YE144I7G)
- Industrial -40C to +100C junction range vs commercial alternatives (vs 10CL016YE144C8G)
- More memory and multipliers than 10CL006 family (vs 10CL006ZE144I8G)
- On-chip flash configuration vs SRAM-based FPGA competitors (vs Lattice iCE40 (cross-family, conceptual))
Design Notes
Per the Cyclone 10 LP handbook, decouple every VCCINT and VCCIO pin pair with a 100 nF X7R ceramic cap placed within 3 mm of the package pin, plus a single 10 uF bulk cap per power rail. The exposed pad must be soldered to a continuous ground pour with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to keep theta-JA below 25 C/W on a 4-layer PCB. Estimate: at 100% utilization with 4 PLLs active, dynamic current draw on VCCINT is approximately 250 mA, which combined with ~95 mW static gives a typical total power budget around 700 mW to 1 W depending on toggle rate.
Route all 8 I/O banks' VCCIO pins as separate power islands on inner layers with ferrite-bead isolation if mixed voltages are required. Place the JTAG header (TCK, TMS, TDI, TDO) within 50 mm of the FPGA to keep signal integrity, and add 10 kohm pull-ups on TMS, TDI, and TRST_n. Route all clock inputs on inner layers with grounded coplanar shielding to minimize coupling into adjacent I/O. Use a 4-layer stackup with continuous VCC and GND planes, avoiding signal splits under the BGA/QFP exposed pad.
Do not leave the exposed pad un-soldered - it serves as both the primary thermal path and the ground bond, and missing solder will trigger thermal-shutdown or ground-bounce failures during stress tests. Confirm that the Quartus Prime power-estimator output matches the bench measurement before locking the BOM, since unaccounted clock-tree utilization can double VCCINT current. Finally, ensure the configuration mode (AS, PS, JTAG) is selected correctly via MSEL pins - miswiring MSEL[2:0] prevents bitstream loading and is the most common factory bring-up failure on Cyclone 10 LP designs.
For LVDS pairs (TX/RX), match intra-pair trace length to within 0.13 mm (5 mil) and inter-pair skew to within 0.5 mm (20 mil) to maintain the 100 ohm differential impedance target. Series-coupling capacitors are not needed on the FPGA side but must be placed near the receiver on the partner device. SSTL-18 class-II memory interfaces require VREF routing on an adjacent signal layer with 0.5 mm clearance; do not route VREF under switching I/O. Maintain 3x trace-width spacing on parallel single-ended buses to limit crosstalk below 5%.
Compliance Information
RoHS and REACH compliant per Altera/Intel product declaration. Industrial temperature grade only - no AEC-Q100 automotive qualification; for automotive applications consult Intel's automotive-grade Cyclone 10 LP roadmap.
