10CL080ZF780I8G - 81K LE Cyclone 10 LP FPGA, 780-BGA | Intel
MPN: 10CL080ZF780I8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $106.3 | $106.30 |
| 10 | $95.67 | $956.70 |
| 100 | $85.04 | $8,504.00 |
| 500 | $76.21 | $38,105.00 |
| 1,000 | $71.89 | $71,890.00 |
Drop-in alternatives for 10CL080ZF780I8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10CL080ZF780I8G
β Drop-Inβ In Stock
$71.89 / Unit
View Datasheet β10CL080YF780I7G
β Drop-Inβ In Stock
$198 / Unit
View Datasheet β10CL080YF780C8G
β Drop-Inβ In Stock
$64.1 / Unit
View Datasheet β10CL080YF780C6G
β Drop-Inβ In Stock
$125.8 / Unit
View Datasheet β10CL080ZF780I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10CL080ZF780C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10CL080ZF780I8G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Device Family | Cyclone 10 LP (10CL080) |
| Logic Elements (LE) | 81,264 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded Memory (M9K blocks) | 305 (typical for 10CL080) |
| Maximum User I/O Pins | 423 |
| Process Technology | 60 nm |
| Package | 780-BGA (FineLine BGA, 29x29 mm, 1.0 mm pitch) |
| Operating Temperature | -40Β°C to +100Β°C (Industrial grade) |
| Configuration Modes | AS (Active Serial), PS (Passive Serial), JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CL080ZF780I8G Pin Configuration
| Pin A1 | VCCIO β I/O supply voltage (bank-specific) |
| Pin A2 | IO β User I/O (bank 8) |
| Pin A3 | IO β User I/O (bank 8) |
| Pin A4 | GND β Ground |
| Pin A5 | IO β User I/O (bank 8) |
| Pin A6 | IO β User I/O (bank 8) |
| Pin A7 | VCCINT β Core supply voltage |
| Pin A8 | IO β User I/O (bank 7) |
| Pin A9 | IO β User I/O (bank 7) |
| Pin A10 | GND β Ground |
| Pin A11 | IO β User I/O (bank 7) |
| Pin A12 | IO β User I/O (bank 7) |
| Pin A13 | VCCIO β I/O supply voltage |
| Pin A14 | IO β User I/O (bank 6) |
| Pin A15 | IO β User I/O (bank 6) |
| Pin A16 | GND β Ground |
| Pin A17 | IO β User I/O (bank 6) |
| Pin A18 | IO β User I/O (bank 6) |
| Pin A19 | VCCINT β Core supply voltage |
| Pin A20 | IO β User I/O (bank 5) |
| Pin A21 | IO β User I/O (bank 5) |
| Pin A22 | GND β Ground |
| Pin A23 | IO β User I/O (bank 5) |
| Pin A24 | IO β User I/O (bank 5) |
| Pin A25 | VCCIO β I/O supply voltage |
| Pin A26 | IO β User I/O (bank 4) |
| Pin A27 | IO β User I/O (bank 4) |
| Pin A28 | GND β Ground |
| Pin A29 | IO β User I/O (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL080ZF780I8G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Interfaces, Programmable Logic Controller (PLC) I/O Expansion, Software-Defined Radio (SDR) Front-End Processing, Machine Vision Preprocessing, Low-Power Portable Embedded Design.
Industrial Motor Control
The 10CL080ZF780I8G fits industrial motor control applications with its 81,264 logic elements providing concurrent PWM generation, encoder feedback processing, and current-loop math. The 423 user I/O pins in the 780-BGA package support multiple axis drives (typically 6-12 axes) with dedicated PWM outputs, quadrature decoder inputs, and SPI encoder interfaces. The Cyclone 10 LP architecture delivers low static power critical for always-on industrial cabinet installations, while the embedded 2.8 Mbit memory holds commutation tables and control-loop coefficients. Industrial temperature grade (-40Β°C to +100Β°C) handles factory-floor thermal stress. Pair with companion FPGAs and gate drivers such as the 10CL040ZU484I8G for auxiliary I/O and Infineon EiceDRIVER gate drivers for power-stage isolation.
Recommended
Video Bridging and Display Interfaces
The 10CL080ZF780I8G serves video bridging applications by providing protocol conversion (MIPI-CSI to LVDS, HDMI to parallel RGB) at frame rates up to 1080p60. The 423 user I/O count in the 780-BGA package supports wide parallel video buses (24-48 bits per channel) plus LVDS serialization lanes. Embedded 2.8 Mbit memory serves as line buffers and frame-store for scaling/deinterlacing algorithms, while 18x18 hardware multipliers enable real-time scaling kernels. Cyclone 10 LP's low dynamic power keeps thermal design simple for sealed display enclosures. The 1.0 mm pitch BGA enables escape routing for high-speed differential pairs required by HDMI/LVDS links.
Recommended
Programmable Logic Controller (PLC) I/O Expansion
The 10CL080ZF780I8G suits PLC I/O expansion by aggregating multiple industrial fieldbus protocols (Modbus, EtherCAT, Profibus, CAN) into a unified backplane interface. The 81K LE fabric runs multiple soft processor cores plus protocol stacks concurrently, while the 423 I/O pins interface to digital input cards, analog front-end converters, and high-speed counter modules. Industrial -40Β°C to +100Β°C temperature grade meets IEC 61131-2 environmental specs for cabinet installation. The 780-BGA provides the I/O density required for multi-slot PLC chassis without stacking multiple smaller FPGAs. Cyclone 10 LP's low static power extends product lifetime in always-on control cabinets.
Recommended
Software-Defined Radio (SDR) Front-End Processing
The 10CL080ZF780I8G handles SDR front-end processing including DDC/DUC (digital down/up conversion), pulse shaping, and real-time modulation/demodulation. The 18x18 multipliers in the Cyclone 10 LP fabric support efficient FIR filtering for channelization and decimation, while the 2.8 Mbit embedded memory holds FFT twiddle factors and channelization coefficients. The 423 I/O pins accept parallel ADC data (12-16 bits wide at 100+ MSPS) plus LVDS interfaces to RF front-end converters. The 780-BGA's signal-integrity-friendly ground/power distribution supports multi-GHz switching necessary for high-speed ADC capture. Industrial temp grade enables outdoor/telecom deployment.
Recommended
Machine Vision Preprocessing
The 10CL080ZF780I8G performs machine vision preprocessing including Bayer demosaicing, image correction, thresholding, and feature extraction at line rates up to 5 MPix/s. The 81K LE fabric runs hardware-accelerated image processing pipelines (Sobel, Canny, morphological operations) in real-time. The 2.8 Mbit embedded memory serves as line buffers for sliding-window algorithms, while the 423 I/O pins accept multi-lane MIPI-CSI2 or parallel camera sensor interfaces. The 780-BGA package routes high-speed sensor differential pairs with controlled impedance. Industrial temp grade supports factory-floor machine vision deployments. Cyclone 10 LP low power keeps the camera housing thermally manageable.
Recommended
Low-Power Portable Embedded Design
The 10CL080ZF780I8G enables portable embedded designs where Cyclone 10 LP's low static and dynamic power extends battery life. The 81K LE fabric runs interface aggregation (UART/SPI/I2C), simple signal processing, and display driving in handheld instruments, portable test equipment, and battery-powered IoT gateways. The 2.8 Mbit embedded memory provides local buffering without external SRAM. The 780-BGA package is large but accepted in handheld enclosures with proper thermal design. Industrial -40Β°C to +100Β°C supports outdoor/field deployment. The Cyclone 10 LP architecture consumes approximately 50% less static power than previous-generation Cyclone IV GX in similar density, making it ideal for solar/battery-powered installations.
Recommended
Recommended Products Summary
Engineering reference data for 10CL080ZF780I8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL080YF780I7G | 10CL080YF780C8G | 10CL080YF780C6G | 10CL080ZF780I7G | 10CL080ZF780C8G |
|---|---|---|---|---|---|---|
| Package | 780-BGA (F780) | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same | 780-BGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 81,264 | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits |
| Maximum User I/O | 423 | 423 | 423 | 423 | 423 | 423 |
| Speed Grade | I8 (slowest industrial) | I7 (-1 speed bin) | C8 | C6 | I7 | C8 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0-85C) | Commercial | Industrial | Commercial |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Series | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP |
Key Differentiators
- Highest I/O density Cyclone 10 LP variant (vs 10CL080ZF484I8G)
- Industrial temperature grade for harsh environments (vs 10CL080YF780C8G)
- I8 speed grade for lowest-cost industrial applications (vs 10CL080ZF780I7G)
Design Notes
The 780-BGA package uses 1.0 mm ball pitch on a 29x29 mm substrate. PCB escape routing requires HDI (High-Density Interconnect) technology with microvias; minimum 4-layer stack-up with dedicated ground and power planes is strongly recommended. Per Intel Cyclone 10 LP pin connection guidelines, decoupling capacitors (100nF + 10uF bulk) must be placed within 5 mm of each power ball. Use controlled impedance for high-speed LVDS pairs (100 ohm differential). The exposed pad (if present) must be soldered to a thermal pad for heat dissipation.
Cyclone 10 LP devices require a multi-rail power distribution network: VCCINT (core voltage, typically 1.2V), VCCAUX (PLL/auxiliary), and multiple VCCIO rails for I/O banks supporting different I/O voltages (1.2V-3.3V). According to the Cyclone 10 LP datasheet, power-on sequencing is critical: VCCINT must ramp before or simultaneously with VCCIO; VCCAUX must follow. Use a power management IC with programmable sequencing (e.g., Intel's Enpirion family) rather than discrete regulators for production designs. Decoupling per PDN guidelines is essential for jitter performance.
Common pitfalls when designing with the 10CL080ZF780I8G: (1) Exceeding I/O bank VCCIO constraints - each bank has a fixed VCCIO and I/O standards must match. (2) Forgetting to strap MSEL pins for the correct configuration mode (AS vs PS vs JTAG). (3) Insufficient decoupling near PLL analog supply pins causing jitter. (4) Using C-grade parts in industrial temperature environments - always verify the suffix (I8/I7 = industrial, C8/C6 = commercial). (5) Designing I/O assignments without checking Quartus Prime bank compatibility. Always run the Quartus Prime Fitter and I/O Assignment Analysis before tape-out.
Estimated: At 100% logic utilization with 200 MHz clock on a typical Cyclone 10 LP design, the 10CL080 device dissipates approximately 1.5-2.5W of power in the 780-BGA package. With theta_JA around 15-20 C/W for the 780-BGA on a standard 4-layer PCB (per typical BGA thermal specs), junction temperature rise is approximately 30-50C above ambient. For industrial -40C to +100C ambient deployments, design thermal management to keep Tj under 100C. Use thermal vias under the package's center ground pad and adequate copper pour on top/bottom layers.
Compliance Information
RoHS and REACH compliant per Intel product page. Industrial temperature grade -40C to +100C. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC).
