10CX220YF672E6G - Cyclone 10 GX 220K LE FPGA | Intel
MPN: 10CX220YF672E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1140 | $11,400.00 |
| 100 | $1080 | $108,000.00 |
| 500 | $990 | $495,000.00 |
| 1,000 | $925 | $925,000.00 |
Drop-in alternatives for 10CX220YF672E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YF672I6G
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →10CX220YF672E5G
✅ Drop-In✓ In Stock
$342 / Unit
View Datasheet →10CX150YF672E6G
✅ Drop-In✓ In Stock
$124.9 / Unit
View Datasheet →10CX220YF672E6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory Bits | 13,752,320 |
| Hardware Multipliers (18x18) | 236 |
| Transceiver Data Rate (max) | 12.5 Gbps |
| PCIe Hard IP | PCI Express Gen2 x4 (hardened) |
| External Memory Interface | DDR3/DDR4/LPDDR3/QDR II+/QDR IV up to 72-bit, 1,866 Mbps |
| LVDS Data Rate | 1.4 Gbps |
| Process Technology | TSMC 20nm |
| Package | 672-ball FCBGA (F672) |
| Operating Temperature Grade | E (Extended, -40C to +100C) |
| Speed Grade | 6 |
| RoHS Status | Compliant |
| Configuration Scheme | AS, PS, JTAG |
10CX220YF672E6G 672-ball fcbga (f672) Pin Configuration Guide
Complete pinout information for 10CX220YF672E6G (672-ball fcbga (f672) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF672E6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF672E6G is suitable for 6 applications: Industrial Machine Vision & Video Processing, Broadcast & Professional Video Equipment, Wireless Backhaul Infrastructure, PCIe Accelerator Cards & High-Speed Prototyping, Test & Measurement Instrumentation, High-Speed Data Acquisition & Signal Processing.
Industrial Machine Vision & Video Processing
The 10CX220YF672E6G fits industrial machine vision because its 220K logic elements and 236 18x18 hardware multipliers deliver the parallel DSP throughput required for Bayer demosaic, color matrix conversion, and edge-detection pipelines running at full HD or 4K line rates. The hardened 12.5 Gbps transceivers connect directly to Camera Link HS, CoaXPress, or 10GigE Vision hosts without a soft MAC, reducing logic utilization and latency. Engineers typically place a frame buffer in the 13.7 Mbit embedded memory and use the PCIe Gen2 hard IP to deliver frames to a host CPU over a x4 edge connector.
Recommended
Broadcast & Professional Video Equipment
For broadcast routers, video format converters, and 12G-SDI gear, the 10CX220YF672E6G provides enough logic and DSP to handle real-time up/down/cross-conversion between SD, HD, 3G, and 12G-SDI streams. The 12.5 Gbps transceivers map directly to SDI physical interfaces (SMPTE 259/292/424/2082) and to AES67/Dante audio-over-IP backbones. The hardened PCIe Gen2 endpoint simplifies integration with host CPUs for control-plane software running on Linux.
Recommended
Wireless Backhaul Infrastructure
The 10CX220YF672E6G targets CPRI and OBSAI fronthaul and backhaul links in small-cell and pico-cell base stations. The integrated 12.5 Gbps transceivers support CPRI line rates up to option 7 (9.83 Gbps) with margin, and the 220K LEs carry PHY-layer scrambling, deframing, and fronthaul-switching functions. Industrial temperature grade and the F672 package's thermal headroom suit outdoor cabinet installations. The hardened PCIe Gen2 endpoint connects to baseband SoCs over a short board trace.
Recommended
PCIe Accelerator Cards & High-Speed Prototyping
For PCIe Gen2 x4 or x8 accelerator cards in edge servers, the 10CX220YF672E6G's hardened PCIe Gen2 endpoint removes the soft-logic PCIe IP overhead and frees 220K LEs for user accelerators such as FFT engines, custom DSP filters, or ML inference datapaths. The 13.7 Mbit embedded memory supports tile buffers and partial coefficient caches. The 1.4 Gbps LVDS interface enables multi-channel high-speed ADC/DAC daughter-card hookups over standard board-to-board connectors.
Recommended
Test & Measurement Instrumentation
The 10CX220YF672E6G is well suited to protocol-aware test instruments, logic analyzers, and protocol exercisers where multi-gigabit transceivers drive pattern generation and error injection at line rate. The 220K LEs hold protocol-aware state machines for PCIe, SATA, 10GbE, and CPRI, while the 236 DSP blocks accelerate signal-integrity metrics like eye-opening computation and jitter decomposition. LVDS banks connect to legacy parallel probe pods and front-panel GPIO without external transceivers.
Recommended
High-Speed Data Acquisition & Signal Processing
The 10CX220YF672E6G pairs high-speed ADC/DAC front-ends with on-FPGA DSP for radar, sonar, and electronic-warfare subsystems. The 12.5 Gbps transceivers carry JESD204B/C ADC data to the FPGA fabric, while the 236 DSP blocks implement digital down-conversion, pulse compression, and FFT-based spectral analysis. The hardened DDR4 controller sustains the data bandwidth from the 13.7 Mbit embedded memory and large external buffers into a host CPU over PCIe.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF672E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF672I6G | 10CX220YF672E5G | 10CX150YF672E6G |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) | 672-ball FCBGA (F672) |
| Logic Elements | 220,000 | 220,000 | 220,000 | 150,000 (-32%) |
| Embedded Memory (bits) | 13,752,320 | 13,752,320 | 13,752,320 | 8,097,280 (-41%) |
| 18x18 Multipliers | 236 | 236 | 236 | 156 (-34%) |
| Transceiver Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| Speed Grade | 6 | 6 | 5 (slower Fmax) | 6 |
| Temperature Grade | Extended (-40C to +100C) | Industrial (-40C to +100C, longer reliability) | Extended (-40C to +100C) | Extended (-40C to +100C) |
Key Differentiators
- Drop-in industrial-temperature alternative in the same F672 footprint (vs 10CX220YF672I6G)
- Smaller die in the same F672 package for cost-optimized designs (vs 10CX150YF672E6G)
- Speed grade 5 alternative for lower-power designs in the same F672 package (vs 10CX220YF672E5G)
Design Notes
Estimated: at full transceiver utilization (12.5 Gbps on all channels) plus sustained DSP block usage, the 10CX220YF672E6G can dissipate 8-12 W of core power. The F672 FCBGA has no exposed top heatsink pad; thermal relief comes from internal package balls. Mount a heatsink with thermal interface material on the top of the package, and route multiple thermal vias under the BGA footprint to inner copper planes. Without airflow, derate transceiver count or operating frequency by approximately 30%.
The 672-ball FCBGA requires a microvia (laser-drilled or plasma-etched) stack-up because the 1.0mm ball pitch is too fine for conventional through-hole vias on the BGA pads. Use a 1-2-1 or 1-3-1 build-up stack-up with 1oz copper on outer layers, and follow Intel's Cyclone 10 GX pin connection guidelines for decoupling capacitor placement: 0.1uF and 0.01uF X7R MLCCs adjacent to each VCC/VCCPT/VCCA power pin pair, plus bulk 47uF-100uF polymer capacitors per power rail.
Transceiver channels exceeding 10 Gbps require controlled-impedance stripline routing with continuous reference planes and tight length matching. For 12.5 Gbps transceivers, target 100-ohm differential impedance with no more than 50 mil of total length mismatch between P and N traces. Place AC-coupling capacitors within 200 mil of the FPGA ball, and avoid routing high-speed lanes across plane splits or signal vias. Use the Intel Cyclone 10 GX Transceiver Toolkit to validate signal integrity on a coupon board before committing to layout.
Do not assume the 'E' suffix in 10CX220YF672E6G only refers to temperature grade - it is also a speed grade qualifier. The trailing '6' is the speed grade (6); the E is the temperature grade. Some PCB libraries mistakenly treat the device as speed grade 6 in an Industrial package and miss the E (Extended) vs I (Industrial) distinction. Verify in the Intel ordering code guide before generating artwork. Also note that FPGAs require configuration memory - typically an EPCQ-L or active serial flash - which must be dimensioned for the Cyclone 10 GX bitstream size and any optional data sections.
Compliance Information
RoHS and REACH compliance per Intel FPGA product declaration. AEC-Q100 not applicable (industrial/consumer FPGA, not automotive-grade). Lead-free FCBGA ball composition per Intel MSL3/JEDEC J-STD-020 reflow compatibility.
