10CX220YF672I5G - 220K LE Cyclone 10 GX FPGA, 672-FCBGA
MPN: 10CX220YF672I5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $800 | $8,000.00 |
| 100 | $720 | $72,000.00 |
| 500 | $660 | $330,000.00 |
| 1,000 | $600 | $600,000.00 |
Drop-in alternatives for 10CX220YF672I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CX220YF672E5G
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View Datasheet →10CX220YF672E6G
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View Datasheet →10CX150YF672I5G
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View Datasheet →10CX150YF672E5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$295 / Unit
View Datasheet →10CX105YF672I5G
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View Datasheet →10CX105YF672E5G
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View Datasheet →10CX220YF672I5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220000 |
| Adaptive Logic Modules (ALMs) | 80330 |
| Embedded Memory | 13.43 Mbit (13,752,320 bits) |
| User I/Os | 236 |
| Package | 672-BBGA, FCBGA |
| Mounting Type | Surface Mount (SMD/SMT) |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | -5 (mid-tier) |
| Hard Memory Controller | DDR3 / DDR4 / LPDDR3 |
| Transceivers | Up to 12.5 Gbps (per family datasheet) |
| DSP Blocks | Yes (hardware DSP slices) |
| RoHS Status | Compliant |
10CX220YF672I5G 672-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10CX220YF672I5G (672-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF672I5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF672I5G is suitable for 6 applications: Industrial Machine Vision, 10G Ethernet Aggregation / Protocol Bridging, Video Surveillance and Broadcast Equipment, PCIe-over-Cable Bridges, Test & Measurement Front-Ends, Software-Defined Radio Front-End.
Industrial Machine Vision
The 10CX220YF672I5G fits industrial machine vision because its 220,000 logic elements and hardware DSP blocks can sustain multi-channel image-processing pipelines (CoaXPress or GigE Vision) at line rates of 10-25 Gbps aggregate. The device's 13.43 Mbit embedded block RAM holds full-HD frame buffers without external SRAM, while the industrial -40C to +100C temperature grade meets factory-floor thermal envelopes. Compared with smaller Cyclone 10 GX parts, the 220K-LE fabric leaves headroom for proprietary pre-processing IP. Recommended companion: external DDR3 memory for double-buffering.
Recommended
10G Ethernet Aggregation / Protocol Bridging
The 10CX220YF672I5G's hardened transceivers (up to 12.5 Gbps per the family datasheet) directly accept SFP+ optical modules, enabling single-chip 4x10G aggregation or 10G-to-1G fan-out bridges. The 220K-LE fabric accommodates L2/L3 forwarding logic and traffic management, while 13.43 Mbit of block RAM supports deep packet buffers. The 672-FCBGA pin-out exposes enough LVDS and general-purpose I/O for multi-port management interfaces. Power budget: 5-7W typical, requiring a 6x6 thermal-via array under the package.
Recommended
Video Surveillance and Broadcast Equipment
The 10CX220YF672I5G is ideal for video surveillance recorders and broadcast processing because its hardware DSP slices accelerate H.264/H.265 encoding offload and color-space conversion at multi-stream rates. The 13.43 Mbit block RAM holds several compressed-frame slices, while DDR3/LPDDR3 hard controllers externalize main frame storage. Industrial temperature operation (-40C to +100C) suits outdoor NVR enclosures, and the 0.9V core supply keeps total power within fanless thermal envelopes. The 236 user I/Os drive multiple MIPI or HDMI bridge PHYs simultaneously.
Recommended
PCIe-over-Cable Bridges
The 10CX220YF672I5G's hard PCIe Gen2 IP block, combined with its 12.5 Gbps transceivers, lets designers build single-chip PCIe Gen2 x4 to SFP+ or 10GBase-KR bridges for industrial backplanes. The 220K-LE fabric supports DMA engines, address translation, and protocol multiplexing, while 13.43 Mbit of embedded memory holds descriptor rings and packet buffers. Industrial -40C to +100C operation tolerates uncontrolled switch-room environments. Compared with ASSP bridge ICs, this FPGA approach allows field-upgradable protocol firmware via JTAG.
Recommended
Test & Measurement Front-Ends
The 10CX220YF672I5G suits test-and-measurement front-ends because its 12.5 Gbps transceivers capture multi-Gsps ADC sample streams, while 220K logic elements implement real-time FFT, FIR filtering, and trigger logic. The 13.43 Mbit block RAM is large enough for deep capture windows, and the 236 user I/Os synchronize parallel ADCs/DACs and front-panel controls. Industrial temperature operation permits bench-to-rack deployment. Power estimation must use the Intel FPGA Power and Thermal Calculator (PTC) to avoid junction-temperature overshoot.
Recommended
Software-Defined Radio Front-End
The 10CX220YF672I5G's 12.5 Gbps transceivers down-convert wideband IF signals to baseband, while its hardware DSP slices run polyphase channelizers, digital down-converters, and FFT cores simultaneously. The 220K-LE fabric supports multiple demodulator chains, and 13.43 Mbit of block RAM holds sample-history windows for adaptive filtering. The 672-FCBGA package routes LVDS to high-speed ADC/DAC companion chips. Industrial -40C to +100C operation covers outdoor tactical and commercial SDR deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF672I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF672E5G | 10CX220YF672E6G | 10CX150YF672I5G | 10CX105YF672I5G |
|---|---|---|---|---|---|
| Package | 672-FCBGA (F672) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 220000 | 220000 | 220000 | 150000 | 105000 |
| Adaptive Logic Modules (ALMs) | 80330 | 80330 | 80330 | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded Memory | 13.43 Mbit | 13.43 Mbit | 13.43 Mbit | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -5 | -5 | -6 (slower) | -5 | -5 |
| Temperature Grade | Industrial (-40C to +100C) | Extended Commercial (0C to +100C) | Extended Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| User I/Os | 236 | 236 | 236 | 236 (same package) | 236 (same package) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest-density 672-FCBGA variant of the Cyclone 10 GX family (vs 10CX150YF672I5G)
- Industrial temperature grade for harsh-environment deployment (vs 10CX220YF672E5G)
- Mid-tier speed grade (-5) for balanced Fmax vs cost (vs 10CX220YF672E6G)
Design Notes
Estimated: At 0.9V core with typical 5-7W device dissipation on the 672-FCBGA, junction temperature rise must be modeled against the FCBGA's theta_JA (approximately 8-12 C/W with a 6x6 thermal-via array to inner ground plane). Run the Intel FPGA Power and Thermal Calculator (PTC) early in the design cycle using your actual toggle rate and utilization - do not rely on datasheet 'typical' values. Without a continuous thermal pad land pattern, junction temperature can exceed 125C and trigger thermal shutdown during extended 10G transceiver operation.
The 672-FCBGA requires a multi-layer PCB (8+ layers recommended) with microvia-to-BGA-pad stackups. Place at minimum 6x6 thermal-via array (0.3 mm drill, 0.5 mm pitch) under the exposed die pad, stitching all the way to the inner ground plane. Per Intel pin connection guidelines, leave dedicated GND balls adjacent to each transceiver power pin to control return-path inductance - this is critical to meet 12.5 Gbps signal-integrity masks. Decoupling: 100 nF X7R per power pin within 1 mm, plus 10 uF bulk per supply rail.
Do not assume pin compatibility with Cyclone V GX F672 packages - the 10CX220YF672I5G uses a different transceiver pin map and different power-rail sequencing. When migrating designs from Cyclone V, regenerate the pin assignment in Quartus Prime and re-spin the PCB if needed. Also confirm JTAG chain ordering: if you stack FPGAs, ensure TMS/TCK fan-out does not exceed 8 loads. Finally, validate configuration scheme (AS x4 vs JTAG vs Passive Serial) against your board's flash footprint before tape-out.
For 12.5 Gbps transceiver channels, route diff-pairs with 100 ohm differential impedance and intra-pair skew under 1 ps per cm. Use only Intel-validated transceiver reference schematics - non-standard AC-coupling capacitor values or stub lengths will degrade eye-mask margins. Reference Intel application note AN-822 for transceiver PCB layout, including via anti-pad geometry and connector break-out patterns for SFP+ cages.
Compliance Information
RoHS compliant per Cyclone 10 GX family product page. Industrial temperature grade is not AEC-Q100 qualified - for automotive applications, evaluate AEC-Q100-qualified Cyclone 10 GX variants or use an ASSP companion. Halogen-free status not explicitly listed in the provided data.
