10CX220YF780E5G - Cyclone 10 GX 220K LE FPGA | Intel | F780
MPN: 10CX220YF780E5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $790 | $7,900.00 |
| 100 | $720 | $72,000.00 |
| 250 | $685 | $171,250.00 |
| 500 | $650 | $325,000.00 |
| 1,000 | $615 | $615,000.00 |
Drop-in alternatives for 10CX220YF780E5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YF780I5G
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →10CX220YF780E6G
✅ Drop-In✓ In Stock
$1720 / Unit
View Datasheet →10CX220YF780I6G
✅ Drop-In✓ In Stock
$121.83 / Unit
View Datasheet →10CX220YF780E7G
✅ Drop-In📋 Reference alternative (not in catalog)
10CX150YF780E5G
✅ Drop-In✓ In Stock
$160 / Unit
View Datasheet →10CX105YF780E5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$350 / Unit
View Datasheet →10CX220YF780E5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory Bits | 13,752,320 |
| 18x19 Multipliers | 156 |
| User I/O Pins | 284 |
| Transceiver Max Data Rate | 12.5 Gbps |
| Hard Memory Controllers | Yes (DDR3 / DDR4 / LPDDR3) |
| PCI Express Hard IP | PCIe Gen3 x4 |
| Process Technology | 20 nm |
| Package | 780-ball FCBGA (F780), 29 mm x 29 mm |
| Speed Grade | 5 (commercial, fast) |
| Temperature Grade | E (0C to +85C, commercial) |
| Configuration Method | Serial / Parallel flash, JTAG, AES-256 bitstream encryption |
| RoHS Status | Compliant |
10CX220YF780E5G 780-ball fcbga (f780), 29 mm x 29 mm Pin Configuration Guide
Complete pinout information for 10CX220YF780E5G (780-ball fcbga (f780), 29 mm x 29 mm package) with 284 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF780E5G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 284 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF780E5G is suitable for 6 applications: Industrial Machine Vision Frame Grabber, Broadcast Video Processing (SDI / HDMI Bridges), PCI Express Add-in Card / Industrial I/O Board, Motor Control and Industrial Drive, Low-Cost 10 Gigabit Ethernet Aggregation, Test & Measurement Instrumentation Front-End.
Industrial Machine Vision Frame Grabber
The 10CX220YF780E5G suits machine vision frame grabbers where 220K logic elements accommodate CoaXPress, GigE Vision, or Camera Link aggregation pipelines, and the 12.5 Gbps transceivers carry serialized sensor data with low deterministic latency. Its hardened PCIe Gen3 x4 IP enables direct plug-in to host PCs at line rates above 3 GB/s, while the embedded memory (13.75 Mbits) provides line buffers for image preprocessing. The 284 user I/O pins expose multiple parallel sensor interfaces, GPIO for trigger and strobe lines, and DDR3/DDR4 controller outputs for high-capacity frame storage, all within the same F780 package footprint.
Recommended
Broadcast Video Processing (SDI / HDMI Bridges)
For broadcast video routers and SDI-to-HDMI bridges, the 10CX220YF780E5G delivers up to 12.5 Gbps per lane to handle 12G-SDI and UHD HDMI 2.0 streams. Its 156 18x19 multipliers provide ample DSP capacity for color space conversion, scaling, and frame-rate conversion, while the hardened DDR4 controller maintains smooth buffering of 4K video. The commercial temperature grade (0C to 85C) and BGA package suit controlled-environment broadcast head-end equipment, and Quartus Prime IP cores simplify integration of SMPTE ST 2082 and HDMI transport layers.
Recommended
PCI Express Add-in Card / Industrial I/O Board
The 10CX220YF780E5G's integrated PCIe Gen3 x4 hard IP enables cost-effective PCIe add-in cards for data acquisition, FPGA co-processing, and protocol offload. Its 220K LEs handle user logic, DMA engines, and protocol stacks such as 10 Gigabit Ethernet or CAN-FD aggregation, while the 12.5 Gbps transceivers support external SFP+ or QSFP modules. The F780 package's 284 user I/O pins route directly to high-density mezzanine connectors, and partial reconfiguration allows in-field firmware updates without disrupting PCIe link state.
Recommended
Motor Control and Industrial Drive
Industrial servo drives and high-end motor controllers leverage the 10CX220YF780E5G's combination of fast transceivers for EtherCAT or SERCOS III fieldbuses, DSP blocks for field-oriented control (FOC) algorithms, and 284 I/O pins for encoder, resolver, and power-stage feedback. Hardened PCIe Gen3 simplifies integration with industrial PC controllers, while the commercial temperature range suits enclosed cabinet installations. Quartus Prime DSP Builder accelerates development of high-bandwidth current and torque loops running at sub-microsecond intervals.
Recommended
Low-Cost 10 Gigabit Ethernet Aggregation
For top-of-rack or industrial aggregation switches, the 10CX220YF780E5G's transceivers natively support 10GBASE-R (10 Gigabit Ethernet), and its 220K LEs plus 13.75 Mbits of embedded memory handle MAC, PCS, and basic L2 switching. The hardened DDR4 controller supports large packet buffers, while PCIe Gen3 x4 uplinks to a host CPU or switch fabric ASIC. Compared with full ASIC solutions, this FPGA-based approach accelerates time-to-market for custom aggregation features and protocol extensions.
Recommended
Test & Measurement Instrumentation Front-End
Test instruments such as protocol analyzers, BERT testers, and high-speed logic analyzers benefit from the 10CX220YF780E5G's reconfigurable logic and multi-gigabit transceivers. Engineers can implement custom serial protocol decoders (PCIe, USB 3.0, SATA) or parallel pattern generation using the FPGA's DSP and memory resources. The 284 user I/O pins expose dedicated probe interfaces, while the F780 BGA package with 1.0 mm pitch supports fine-pitch PCB layouts typical of high-bandwidth instrumentation front-ends.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF780E5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF780I5G | 10CX220YF780E6G | 10CX220YF780I6G | 10CX220YF780E7G | 10CX150YF780E5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (F780), 29 x 29 mm | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 (-32%) |
| Speed Grade | 5 (fastest) | 5 (fastest) | 6 (slower) | 6 (slower) | 7 (slowest) | 5 (fastest) |
| Temperature Grade | E (Commercial 0C to 85C) | I (Industrial -40C to 100C) | E (Commercial) | I (Industrial) | E (Commercial) | E (Commercial) |
| Embedded Memory Bits | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 9,500,000 approx (-31%) |
| Transceiver Max Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| PCI Express Hard IP | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 |
| User I/O Pins | 284 | 284 | 284 | 284 | 284 | 284 |
Key Differentiators
- Industrial temperature grade variant available in same package (vs 10CX220YF780I5G)
- Slowest speed grade option for power-constrained designs (vs 10CX220YF780E7G)
- Higher-density logic in same F780 package (vs 10CX150YF780E5G)
- Integrated 12.5 Gbps transceivers absent in Cyclone 10 LP family (vs 10CL120YF780I7G)
Design Notes
The 10CX220YF780E5G requires multiple power rails (core, transceiver PLLs, transceiver channels, I/O banks, auxiliary). Per Intel's Cyclone 10 GX power management user guide, designers must sequence the rails in the order specified to avoid latch-up. Typical core current at full utilization is approximately 3-5 A and a high-efficiency buck regulator with remote sensing is recommended. The transceiver supply (VCCR_GXB / VCCT_GXB) is sensitive to noise - place ferrite beads and bulk capacitors within 1 cm of the package balls.
In dense transceiver-rich designs, the 10CX220YF780E5G can dissipate 8-15 W. The F780 FCBGA package uses a heat-spreader lid; attach a heatsink with thermal interface material (TIM) or use a forced-air cooling solution. Estimated: at 12 W dissipation with theta_JA of approximately 12 C/W (with heatsink), junction-to-ambient rise is 144 C - verify against the device's maximum junction temperature (100C for commercial grade). Always perform thermal simulation with the actual PCB stack-up and airflow.
The F780 package has a 1.0 mm ball pitch and 29 mm x 29 mm body, requiring a multilayer PCB with microvia or stacked-via technology to fan out signal and power balls. All 780 balls are present even if some are unused - unused power balls must still be connected to their rails to maintain package coplanarity and current capacity. Matched-impedance routing (85 ohm differential for transceivers, 50 ohm single-ended for general I/O) must be verified with a 3D field solver.
Transceiver channels must be routed with controlled-impedance differential pairs, length matching within the budget specified in the Cyclone 10 GX transceiver user guide, and DC-blocking capacitors placed close to the package balls. AC-coupling capacitor selection must consider the transceiver's pre-emphasis and equalization capabilities. Use IBIS-AMI models from Intel for channel simulation, including crosstalk from adjacent aggressor traces.
A common pitfall is selecting the wrong speed grade: speed grade 5 is the fastest, while grade 7 is the slowest; mixing grades between prototypes and production may break timing closure. Another pitfall is ignoring configuration scheme selection - the device supports AS (active serial), PS (passive serial), JTAG, and fast passive parallel, each with different bitstream width and boot time implications. Always verify bitstream compatibility for revision changes with Quartus Prime.
Compliance Information
RoHS compliant and lead-free per Intel's Cyclone 10 GX material declarations. AEC-Q100 not applicable (industrial FPGAs are not automotive-qualified by default; Intel offers automotive-grade Cyclone 10 GX variants under separate part numbers). Verify halogen-free and REACH status against the latest Intel product declaration documents.
