10CX220YF780I6G - Cyclone 10 GX 220K LE FPGA, 780-FCBGA | Intel
MPN: 10CX220YF780I6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $136.99 | $136.99 |
| 10 | $130.48 | $1,304.80 |
| 100 | $124.26 | $12,426.00 |
| 500 | $122.5 | $61,250.00 |
| 1,000 | $121.83 | $121,830.00 |
Drop-in alternatives for 10CX220YF780I6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX220YF780I5G
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →10CX220YF780E6G
✅ Drop-In✓ In Stock
$1720 / Unit
View Datasheet →10CX220YF780E5G
✅ Drop-In✓ In Stock
$615 / Unit
View Datasheet →10CX150YF780I6G
✅ Drop-In✓ In Stock
$325 / Unit
View Datasheet →10CX105YF780I6G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →10CX220YF780I6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements (LE) | 220,000 |
| Embedded Memory (bits) | 13,752,320 |
| User I/O Pins | 284 |
| Package | 780-FBGA (FCBGA), 29x29 mm |
| DSP Blocks | 156 |
| Process Technology | 20 nm |
| Operating Temperature | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Hardened PCIe | Yes - PCIe Gen2 x4 |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10CX220YF780I6G 780-fbga (fcbga), 29x29 mm Pin Configuration Guide
Complete pinout information for 10CX220YF780I6G (780-fbga (fcbga), 29x29 mm package) with 284 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX220YF780I6G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 284 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX220YF780I6G is suitable for 6 applications: Broadcast Video Processing & Display, Industrial Machine Vision & Frame Grabbers, Low-Cost PCIe Accelerator Card, Wireless Fronthaul (CPRI / OBSAI), Motor Control & Industrial Encoder Interfaces, IoT Edge Analytics Gateway.
Broadcast Video Processing & Display
The 10CX220YF780I6G's 220K logic elements and 156 DSP blocks enable multi-channel video pipeline processing in broadcast and professional display equipment. With 284 user I/O and embedded M20K memory sufficient for multiple line buffers, the device can simultaneously handle 4K upscaling, color space conversion and frame-rate conversion without external memory contention. Hardened PCIe Gen2 x4 IP allows direct capture card integration into workstation hosts.
Recommended
Industrial Machine Vision & Frame Grabbers
Industrial camera aggregation benefits from the 10CX220YF780I6G's 284 user I/O for multi-sensor parallel interfaces and its hardened PCIe endpoint for host-side transfer. Industrial-grade operating range (-40C to +100C) and lead-free RoHS-compliant FCBGA package suit factory-floor deployment. The DSP block count supports real-time Bayer demosaicing, defect detection and edge preprocessing directly on the FPGA before forwarding compact payloads to the host CPU.
Recommended
Low-Cost PCIe Accelerator Card
The 10CX220YF780I6G integrates PCIe Gen2 x4 hard IP, eliminating the need for an external bridge chip on cost-optimized accelerator cards. With 220K logic elements and 13.75 Mbits of embedded memory, the device can implement moderate-throughput inference, compression or signal-processing pipelines. Its 12.5 Gbps transceivers connect to SFP+ cages for networked accelerator topologies.
Recommended
Wireless Fronthaul (CPRI / OBSAI)
The 10CX220YF780I6G's 12 transceivers at up to 12.5 Gbps support up to 6 CPRI links at 6.144 Gbps or equivalent OBSAI rates for small-cell and remote-radio-head (RRH) fronthaul. Cyclone 10 GX's hardened PCS and deterministic latency allow time-synchronized IQ sample transport, while 220K logic elements host PHY-layer processing, framing and synchronization. Industrial temperature grade suits outdoor base-station enclosures.
Recommended
Motor Control & Industrial Encoder Interfaces
Industrial servo and stepper motor control benefits from the 10CX220YF780I6G's combination of 284 user I/O (to interface encoders, Hall sensors and power-stage PWM channels) and 156 DSP blocks for Field-Oriented Control (FOC) math. Industrial-grade temperature range supports cabinet-mounted equipment, while the FCBGA package's high I/O density allows integration of multiple axes in a single device, reducing BOM and PCB area.
Recommended
IoT Edge Analytics Gateway
The 10CX220YF780I6G supports edge analytics, protocol bridging and local storage in industrial IoT gateways. Its 220K logic elements run lightweight ML inference, encryption and protocol stacks (Modbus, EtherCAT, OPC-UA) while transceivers handle gigabit Ethernet uplinks. The hardened PCIe Gen2 endpoint lets designers add Wi-Fi 6 or 5G modems via M.2 sockets, and industrial temperature grade suits factory and outdoor cabinet deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX220YF780I6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX220YF780I5G | 10CX220YF780E6G | 10CX220YF780E5G | 10CX150YF780I6G | 10CX105YF780I6G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (FCBGA), 29x29 mm | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same | 780-FBGA (FCBGA) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 | 105,000 |
| Embedded Memory (bits) | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 284 | 284 | 284 | 284 | 284 | 284 |
| DSP Blocks | 156 | 156 | 156 | 156 | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Key Differentiators
- Highest-density Cyclone 10 GX in the 780-FBGA footprint (vs 10CX150YF780I6G)
- Industrial temperature grade (-40C to +100C) (vs 10CX220YF780E6G)
- Latest process revision (I6G) for improved silicon yield and power (vs 10CX220YF780I5G)
Design Notes
The 10CX220YF780I6G requires separate power rails for the core (VCC), PLL (VCCA_PLL), transceiver blocks (VCCR_GXB / VCCT_GXB) and I/O banks (VCCIO). Power-rail ramp rates must follow Intel's Power-Up and Sequencing Guidelines for Cyclone 10 GX - typically monotonic ramp within 10 ms with strict sequencing of VCC before VCCIO. Failure to sequence correctly risks latch-up or in-rush currents that exceed package current limits.
Estimated: at full transceiver utilization (12 lanes at 12.5 Gbps) plus 70% logic utilization in a still-air environment, junction temperature can approach 95C. The 780-FBGA package exposes a thermal pad that must be soldered to a continuous ground plane with thermal vias (0.3 mm pitch, 0.2 mm drill) per Intel's Thermal Management Guidelines. For 10W+ designs, add a heatsink or forced-air cooling to maintain industrial-grade temperature margin.
Decoupling: place 0.1 uF MLCCs every 5-8 mm along VCCIO rails and 10 uF bulk caps within 50 mm of each supply pin. Transceiver rails need 0.01 uF + 0.1 uF + 4.7 uF per channel. Matched-length differential pairs for transceivers must be length-matched within 0.127 mm and skew-matched to the reference clock per Intel's Pin Connection Guidelines (PCG) for Cyclone 10 GX. Use a 4-8 layer stack-up with dedicated ground and power planes adjacent to the BGA break-out layer.
Do not confuse the F780 780-FBGA package with the F672 672-FBGA - they have different ball patterns, different I/O counts, and require entirely different PCB footprints. Reusing a 780-FBGA symbol on a 672-FBGA board will cause assembly failure. Also note that Cyclone 10 GX bitstreams are not compatible with Cyclone V or Cyclone IV - design reuse must include re-compilation with the Cyclone 10 GX device library in Intel Quartus Prime.
Transceiver channels require AC-coupling capacitors (typically 100 nF) on each serial link. Reference clock must be a low-jitter oscillator (typically <300 fs RMS for 10.3125 Gbps operation). Use IBIS-AMI models from Intel for channel simulation; run link-training with the Quartus Prime Transceiver Toolkit to validate eye margin before committing to PCB fabrication.
Compliance Information
RoHS and lead-free confirmed via I6G ordering code suffix per Intel/Altera ordering code reference. Not AEC-Q100 qualified (industrial-grade FPGAs typically not qualified to AEC-Q100; AEC-Q100 parts are separate automotive OPNs). MSL 3 per JEDEC J-STD-020.
