10M08DCV81I7G - MAX 10 FPGA, 8K LE, 81-WLCSP | Intel / Altera
MPN: 10M08DCV81I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $37.23 | $37.23 |
| 10 | $35.9 | $359.00 |
| 100 | $32.5 | $3,250.00 |
| 500 | $29.2 | $14,600.00 |
| 1,000 | $26.85 | $26,850.00 |
Drop-in alternatives for 10M08DCV81I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DCV81C7G
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View Datasheet →10M02DCV36C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10M08DCV81I7G Maximum Ratings & Electrical Characteristics
| Product Family | MAX 10 |
| Logic Elements (LE) | 8000 |
| Embedded User Flash | 387072 bit (378 Kbit) |
| Maximum User I/Os | 56 |
| Package Type | 81-ball WLCSP (UFBGA, wafer-level chip-scale package) |
| Configuration Memory | On-chip dual-configuration flash, instant-on |
| Operating Temperature | Industrial -40C to +100C (I7 grade) |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, RSDS |
| Memory Interfaces | DDR3, DDR3L, LPDDR2 (external PHY required) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Mounting Type | Surface Mount (WLCSP - requires underfill) |
| RoHS Status | Compliant |
| Design Software | Intel Quartus Prime (MAX 10 device support) |
10M08DCV81I7G 81-ball wlcsp (ufbga, wafer-level chip-scale package) Pin Configuration Guide
Complete pinout information for 10M08DCV81I7G (81-ball wlcsp (ufbga, wafer-level chip-scale package) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCV81I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DCV81I7G is suitable for 6 applications: I/O Expansion and Bridging Hub, Industrial Control and Motor Drive Glue Logic, Sensor Aggregation Hub, Portable Medical and Consumer Wearables, Low-Cost Video Format Conversion, Replacing CPLDs and Discrete ADCs.
I/O Expansion and Bridging Hub
The 10M08DCV81I7G's 56 maximum user I/Os and 8K logic elements make it well suited as a bridging hub between a host processor and multiple low-speed peripherals. Designers connect I2C, SPI, and UART buses to MAX 10 general-purpose I/Os and translate them to a wider parallel bus, offloading interrupt servicing from the host CPU. With 387 Kbit of embedded user flash, the bridge configuration bitstream can be updated in-system via JTAG. The 81-WLCSP footprint occupies minimal board area, enabling compact bridge modules for embedded computing platforms.
Recommended
Industrial Control and Motor Drive Glue Logic
In industrial motor drive applications, the 10M08DCV81I7G provides the deterministic glue logic that ties encoder feedback, gate driver enable signals, and fault monitoring. The MAX 10 device's -40C to +100C industrial temperature range and instant-on dual-configuration flash make it reliable in factory floor environments where power cycles and temperature swings are common. The integrated 12-bit SAR ADC samples current and voltage for protection loops, eliminating an external ADC. Designers pair this FPGA with a Cortex-M microcontroller to handle the higher-level control loop while MAX 10 manages real-time I/O timing.
Recommended
Sensor Aggregation Hub
Wearable and IoT devices typically aggregate data from multiple sensors over I2C or SPI, requiring flexible logic to time-multiplex buses and preprocess data streams. The 10M08DCV81I7G offers 8K logic elements, sufficient to implement sensor interfaces, FIFOs, and compression preprocessing for MEMS accelerometers, gyros, and biosensors. Its 81-WLCSP package enables sub-20 mm x 20 mm sensor modules, while the on-chip flash supports over-the-air firmware updates for evolving sensor configurations. Industrial temperature rating supports outdoor and harsh-environment deployments.
Recommended
Portable Medical and Consumer Wearables
Portable medical devices and consumer wearables demand small form factor, low power, and reliable cold-start behavior. The 10M08DCV81I7G meets these needs with its 81-WLCSP package (smallest MAX 10 variant), instant-on flash configuration, and industrial temperature range for wearable operating environments. Designers use the integrated 12-bit ADC to sample bioelectric signals and the FPGA fabric to implement digital filtering, threshold detection, and Bluetooth-SoC hand-off. The on-chip dual-configuration flash enables fail-safe firmware rollback for FDA-class medical firmware updates.
Recommended
Low-Cost Video Format Conversion
The 10M08DCV81I7G's logic capacity is sufficient for low-resolution video format conversion tasks such as MIPI-to-parallel CSI bridging, color-space conversion, or frame-rate interpolation up to 720p. Its LVDS I/O support enables direct interfacing with MIPI D-PHY receivers, eliminating an external bridge chip. Designers use the FPGA fabric to implement line buffers in distributed RAM and the embedded user flash to store LUT-based gamma correction tables. Industrial temperature grade supports automotive rear-view camera modules.
Recommended
Replacing CPLDs and Discrete ADCs
Designs that previously combined a CPLD for glue logic with a discrete 12-bit ADC can be consolidated onto a single 10M08DCV81I7G, reducing BOM count and board area. The MAX 10 device provides 8K logic elements (vs typical CPLD 512 macrocells) plus an integrated 12-bit SAR ADC. According to Intel's MAX 10 product documentation, this consolidation typically reduces PCB area by 30-50% and component cost by 15-25% in mid-volume designs. The on-chip configuration flash eliminates the CPLD's external JTAG programming step.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCV81I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DCV81C7G | 10M02DCV36C8G | 10M02DCV36C7G |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 81-ball WLCSP | 81-ball WLCSP - same | 36-ball WLCSP - DIFFERENT | 36-ball WLCSP - DIFFERENT |
| Logic Elements | 8000 | 8000 | 2000 | 2000 |
| Embedded User Flash | 387072 bit | 387072 bit | 119088 bit | 119088 bit |
| Maximum User I/Os | 56 | 56 | 27 | 27 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Configuration Memory | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash |
| Integrated ADC | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) | Yes (12-bit SAR) |
| Approximate Unit Price (USD, as of 2026-09-05) | $37.23 | $35.90 (est.) | $20-25 (est.) | $20-25 (est.) |
Key Differentiators
- Smallest MAX 10 package with on-chip flash (vs 10M08DCF256C8G (256-FBGA))
- Higher logic density in same small footprint (vs 10M02DCV36C8G (36-WLCSP))
- Industrial temperature grade in smallest package (vs 10M08DCV81C7G (commercial temp, same package))
Design Notes
WLCSP assembly requires PCB pad finishing (typically ENIG or OSP), precise stencil aperture design (laser-cut stainless steel recommended), and underfill dispense to mitigate thermal cycling stress. Reflow profile must peak below 260C with limited time-above-liquidus (TAL) to prevent warpage. PCB pad pitch for the 81-ball WLCSP is 0.4 mm; verify your PCB manufacturer's fine-pitch capability before committing layout.
MAX 10 dual-supply variants (D prefix) require separate VCC core and VCCIO supplies, typically 3.3V or 2.5V core plus per-bank VCCIO. Per the MAX 10 datasheet, the core supply current scales with logic utilization and toggle rate; budget 50-150 mA core current at typical utilization. Use a low-noise LDO such as the TPS7A4701 for the core supply if ADC accuracy is required, and add 100 nF + 10 uF decoupling on every supply pin within 5 mm.
Route high-speed differential pairs (LVDS/MIPI) with controlled 100-ohm differential impedance and length-matching within 150 mils. Keep ADC analog input traces short and isolated from switching signals; surround the ADC traces with a ground guard ring tied to the analog ground plane. According to Intel layout guidelines, place configuration-related pins (JTAG, MSEL, nCONFIG) away from clock and high-speed signals to avoid noise injection during programming.
Do not assume the WLCSP package is footprint-compatible with FBGA variants - they are different PCB layouts. Verify MSEL[3:0] strapping resistors match the desired configuration mode (AS, PS, JTAG) before PCB fabrication; mis-strapping can lock the device. Confirm that all I/O bank VCCIO supplies are present before driving signals into the bank, or the I/O pins may back-power the FPGA through ESD diodes.
For DDR3 memory interfaces, follow Intel's external memory interface (EMIF) pinout and PCB guidelines exactly; use SI simulation to validate timing closure before fabrication. According to the MAX 10 handbook, SSTL and POD I/O standards require on-die termination (OCT) calibration via the RUP/RDN pins. Do not omit the OCT calibration resistors or memory interface timing will degrade at temperature extremes.
Compliance Information
RoHS compliant per Altera product page. AEC-Q100 not qualified for this variant; check 10M08 automotive-grade OPNs for automotive applications. Industrial temperature grade I7 covers -40C to +100C operation.
