10M16DCF256I7G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
MPN: 10M16DCF256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $30.85 | $3,085.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $24.95 | $24,950.00 |
Drop-in alternatives for 10M16DCF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DCF256C8G
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$25.6 / Unit
View Datasheet →10M16DCF256C7G
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View Datasheet →10M16DCF256A7G
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$37.2 / Unit
View Datasheet →10M08DCF256I7G
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$12.2 / Unit
View Datasheet →10M04DAF256C7G
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$9.45 / Unit
View Datasheet →10M16DCF256I7G Maximum Ratings & Electrical Characteristics
| Product Line | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Embedded Memory Bits | 562,176 bits |
| User I/O Count | 178 |
| User Flash Memory | 256 Kbits |
| Package | 256-ball FBGA (F256) |
| Mounting Type | Surface Mount |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (I7: -40C to +100C) |
| Embedded Multipliers (18x18) | 45 |
| PLL Count | 4 |
| On-chip ADC | 12-bit, 1 MSPS, up to 18 analog inputs |
| Hard Memory Controller | DDR3 SDRAM |
| Configuration Method | Internal flash, instant-on |
| RoHS Status | Compliant |
10M16DCF256I7G Pin Configuration
| Pin A1 | IO — General purpose user I/O (bank 1A) |
| Pin A2 | VCCIO1A — I/O supply for bank 1A |
| Pin A3 | GND — Ground |
| Pin B1 | IO — General purpose user I/O |
| Pin B2 | IO — General purpose user I/O |
| Pin B3 | VCCINT — Core supply 1.2 V |
| Pin C1 | CLK_IN — Differential clock input |
| Pin C2 | IO — General purpose user I/O |
| Pin C3 | GND — Ground |
| Pin D1 | IO — General purpose user I/O |
| Pin D2 | CONFIG — Configuration mode select |
| Pin D3 | JTAG_TCK — JTAG test clock |
| Pin E1 | IO — General purpose user I/O |
| Pin E2 | JTAG_TMS — JTAG test mode select |
| Pin E3 | JTAG_TDO — JTAG test data out |
| Pin F1 | IO — General purpose user I/O |
| Pin F2 | JTAG_TDI — JTAG test data in |
| Pin F3 | nCONFIG — Configuration control (active low) |
| Pin G1 | IO — General purpose user I/O |
| Pin G2 | nSTATUS — Configuration status (active low) |
| Pin G3 | DONE — Configuration done indicator |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCF256I7G is suitable for 6 applications: Industrial Motor Control and Factory Automation, IoT Edge Sensor Aggregation Nodes, Video Bridging and Display Controllers, Automotive Driver-Assistance and Telematics, Portable and Battery-Powered Embedded Systems, Communications Infrastructure and Protocol Bridging.
Industrial Motor Control and Factory Automation
The 10M16DCF256I7G fits industrial motor control and factory automation because its 16,000 logic elements, 45 embedded 18x18 multipliers, and 4 PLLs handle Field-Oriented Control (FOC) loops, PWM generation, encoder feedback, and EtherCAT / PROFINET state machines in a single chip. The integrated 12-bit 1 MSPS ADC with up to 18 analog inputs digitizes shunt currents, back-EMF, and temperature sensors without external analog front-end complexity. With industrial-grade -40C to +100C operation and on-chip flash for instant boot, the device survives factory-floor thermal stress and brown-out events while executing deterministic control loops at microsecond cadence. The 178 user I/Os support multi-axis controllers, opto-isolated GPIO, and parallel encoder interfaces.
Recommended
IoT Edge Sensor Aggregation Nodes
For IoT edge sensor aggregation, the 10M16DCF256I7G combines 562 Kbits of embedded SRAM with the on-chip 12-bit ADC to aggregate analog and digital sensors, perform local pre-processing, and bridge to Ethernet or wireless uplinks. The non-volatile flash configuration removes external boot PROMs, simplifying the BOM for sealed outdoor enclosures. Low static power suits battery and solar-powered deployments, while the hardened DDR3 controller enables buffering of larger sensor bursts before transmission. Quartus Prime Lite supports the device at no cost, making it attractive for low-volume industrial IoT gateways and smart sensor hubs requiring deterministic response to local events.
Recommended
Video Bridging and Display Controllers
The 10M16DCF256I7G serves as a video bridge or display controller by converting between MIPI CSI-2, LVDS, CMOS parallel, and HDMI / DisplayPort streams. With 45 embedded multipliers and the DDR3 controller, the device can perform color-space conversion, scaling, frame-rate conversion, and limited on-the-fly compression in real time. The 178 user I/Os accommodate multi-lane LVDS links and parallel RGB buses, while the on-chip ADC can sample ambient-light sensors for adaptive brightness. Compared to ASSPs, MAX 10 offers firmware-upgradable video pipelines, letting the same hardware serve multiple product variants via configuration image swap.
Recommended
Automotive Driver-Assistance and Telematics
For ADAS sensor pre-processing and telematics, the 10M16DCF256I7G's industrial temperature range and 16,000 logic elements aggregate multiple camera and radar sensor streams, perform object detection pre-filtering, and bridge to automotive Ethernet or CAN-FD networks. Designers building AEC-Q100 systems typically migrate to the automotive-grade 10M16DAF484I7G or 10M16DAU324I7P variants (same silicon in different packages). On-chip flash provides instant-boot behavior essential for camera mirror replacement and surround-view systems that must be image-ready within milliseconds of ignition.
Recommended
Portable and Battery-Powered Embedded Systems
The 10M16DCF256I7G suits portable and battery-powered designs because its 55 nm process and on-chip voltage regulators minimize quiescent current, while instant-on flash configuration eliminates the inrush current of SRAM FPGAs during boot. With 256 Kbits of user flash, the device can also store calibration data, firmware logs, and configuration parameters without an external EEPROM. Typical portable applications include handheld test instruments, portable medical monitors, and ruggedized field-rugged data loggers. The 256-ball FBGA occupies less than 17x17 mm, leaving room for compact battery-powered enclosures.
Recommended
Communications Infrastructure and Protocol Bridging
For communications infrastructure, the 10M16DCF256I7G bridges legacy serial interfaces (UART, SPI, I2C, I2S) to modern packet networks, performs protocol conversion, and provides hardware-accelerated state machines for traffic shaping. The DDR3 controller allows line-rate packet buffering, while the 45 multipliers enable forward-error-correction and encryption primitives. Industrial-grade silicon fits outdoor roadside cabinets and factory-floor aggregation switches. Compared to ASSP bridge ICs, the MAX 10 lets designers add proprietary features and update protocols via reconfiguration without changing hardware.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCF256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DCF256C8G | 10M16DCF256C7G | 10M16DCF256A7G | 10M08DCF256I7G | 10M04DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 4,000 (-75%) |
| Embedded Memory (bits) | 562,176 | 562,176 | 562,176 | 562,176 | 378,880 (-33%) | 189,440 (-66%) |
| User I/O Count | 178 | 178 | 178 | 178 | 178 | [DATA_NEEDED] |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive -40C to +125C | Industrial -40C to +100C | Commercial 0C to +85C |
| Speed Grade | 7 | 8 (faster) | 7 (same) | 7 (same) | 7 | 7 |
| Embedded Multipliers (18x18) | 45 | 45 | 45 | 45 | 24 (-47%) | 16 (-64%) |
| On-chip ADC | 12-bit 1 MSPS, 18 inputs | 12-bit 1 MSPS, 18 inputs | 12-bit 1 MSPS, 18 inputs | 12-bit 1 MSPS, 18 inputs | 12-bit 1 MSPS, 18 inputs | 12-bit 1 MSPS, fewer inputs |
| Configuration | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on | Internal flash, instant-on |
Key Differentiators
- Industrial temperature grade with instant-on flash configuration (vs 10M16DCF256C8G (commercial-grade variant))
- Same-die pin-to-pin compatibility across the F256 package family (vs 10M16DAF484I7G (F484 package variant))
- Doubles the logic capacity in the same FBGA-256 footprint (vs 10M08DCF256I7G (10M08 variant in same package))
Design Notes
Use a microvia stack-up for the 256-ball FBGA. The 1.0 mm ball pitch requires via-in-pad or microvia fan-out to escape the inner rows. Maintain a continuous ground plane on layer 2 directly beneath the package to provide low-impedance return paths for high-speed signals. Follow Intel's MAX 10 PCB Design Guidelines for trace widths, length-matching, and decoupling recommendations - typical scheme is one 100 nF X7R per power pin plus bulk 10 uF / 47 uF tantalum at regulator outputs.
DDR3 interfaces on the MAX 10 require matched-length routing on the address/command/clock groups (target skew under 25 ps for the 10M16 speed grade 7). Place Series Stub Completed (SSC) topology where stubs are short, and use fly-by routing for clocks. VTT termination at the midpoint of the address/command bus is mandatory - Intel's validated reference schematics provide reference VTT resistor networks. Run signal-integrity simulation in Quartus Prime's PCB tool before tape-out to catch reflections and ISI on the DQ/DQS strobe lanes.
Estimated: at typical industrial operating conditions (VCCINT 1.2 V, 16K LE utilization ~70%, junction +85C), static core current is approximately 60-120 mA. Switching I/O current scales with toggle rate - worst-case 178 I/Os at 50 MHz LVCMOS 3.3 V can add 200-400 mA transient load. Use a buck regulator with at least 1 A capacity on VCCINT and a separate LDO for VCCIO to suppress switching-noise coupling into the analog rails. Decouple each VCCIO bank close to its ball pins to prevent IR-drop on heavily-switching banks.
Common pitfalls: (1) selecting the wrong Quartus Prime version - older releases may not include MAX 10 device support; always check the device support list. (2) Driving JTAG_TCK slower than 10 MHz on a long TCK trace causes configuration failures - use a USB-Blaster II with a buffered download cable. (3) Forgetting to assign the CONFIG pin mode - leaving it floating can cause intermittent boot failures. (4) Using the dual-boot image feature without verifying both images load reliably - corrupt secondary image bricks remote systems in the field.
Compliance Information
Industrial temperature grade only - not AEC-Q100 qualified. For AEC-Q100 automotive, use 10M16DAF484I7G or 10M16DAU324I7P. RoHS and REACH compliance per Intel product page.
