10M25DAF256I7P - MAX 10 FPGA 25K LE 256-FBGA | Intel / Altera
MPN: 10M25DAF256I7P ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $79.49 | $79.49 |
| 10 | $72 | $720.00 |
| 100 | $62.5 | $6,250.00 |
| 500 | $54.2 | $27,100.00 |
| 1,000 | $47.8 | $47,800.00 |
Drop-in alternatives for 10M25DAF256I7P — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF256I7G
✅ Drop-In✓ In Stock
$60.3 / Unit
View Datasheet →10M25DAF256C7G
✅ Drop-In✓ In Stock
$38.75 / Unit
View Datasheet →10M25DAF256C8G
✅ Drop-In✓ In Stock
$45.3 / Unit
View Datasheet →10M16DAF256C7G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M16DAF256I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16DAF484I7G
✅ Drop-In✓ In Stock
$60.4 / Unit
View Datasheet →10M25DAF256I7P Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25000 |
| Embedded Memory (M9K) | 1134 Kbits |
| Embedded Multipliers (18x18) | 50 |
| PLLs | 4 |
| Maximum User I/Os | 178 |
| On-die Flash Configuration | Dual-configuration supported |
| ADC | 12-bit, 1 MSPS, up to 16 analog inputs |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 256-pin FBGA (17 mm x 17 mm) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Memory | On-chip flash (volatile mode optional) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
10M25DAF256I7P 256-pin fbga (17 mm x 17 mm) Pin Configuration Guide
Complete pinout information for 10M25DAF256I7P (256-pin fbga (17 mm x 17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF256I7P.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF256I7P is suitable for 6 applications: Industrial Motor Control & Factory Automation, Video Bridging & Machine Vision Camera Interface, I/O Expansion & Protocol Bridging on Embedded SBCs, Low-Cost Test & Measurement Instruments, Automotive Body Electronics & Infotainment Subsystems, Industrial Sensor Aggregation & Edge IO.
Industrial Motor Control & Factory Automation
The 10M25DAF256I7P's 25K logic elements, 50 embedded 18x18 multipliers, and on-die 12-bit 1 MSPS ADC make it a strong fit for industrial motor control. In a 3-axis field-oriented control (FOC) drive the device samples phase currents via the integrated ADC, runs Park/Clarke transforms and PI loops in soft logic, and generates SVM PWM through user I/Os - consuming roughly 12K LEs and leaving headroom for EtherCAT or Modbus protocol stacks.
Recommended
Video Bridging & Machine Vision Camera Interface
With 1,134 Kbits of M9K memory and 178 user I/Os supporting LVDS at up to 800 Mbps, the 10M25DAF256I7P bridges parallel CMOS image sensors to MIPI CSI-2 or USB3 Vision transmitters. The 25K LEs handle color interpolation, gamma correction, and frame buffering at 1080p60 while the integrated ADC monitors PCB temperature, removing the need for an external sensor IC in compact camera modules.
Recommended
I/O Expansion & Protocol Bridging on Embedded SBCs
Designers use the 10M25DAF256I7P as a sidecar FPGA on Raspberry Pi, NXP i.MX, or TI Sitara baseboards to add GPIO, UART, SPI, I2C, and PWM channels. The instant-on dual-configuration flash lets the host CPU enumerate the FPGA within 10 ms of power-up, while 4 PLLs derive any required clock from a single 50 MHz crystal, simplifying board design and reducing external clock-tree parts.
Recommended
Low-Cost Test & Measurement Instruments
Portable oscilloscopes, data loggers, and protocol analyzers benefit from the MAX 10's combination of 50 DSP multipliers, dual-configuration flash, and integrated ADC. The 10M25DAF256I7P runs FFT-based spectrum analysis at 50 MHz real-time bandwidth while the second configuration slot stores factory calibration data, allowing field firmware upgrades without an external programmer and reducing handheld-instrument BOM cost by approximately $4.
Recommended
Automotive Body Electronics & Infotainment Subsystems
Non-safety automotive subsystems such as HVAC control, ambient lighting drivers, and rear-seat infotainment use the 10M25DAF256I7P for its instant-on behavior and LIN/CAN bus bridging. Industrial temperature grade (-40C to +100C) covers cabin environments, while dual-configuration flash supports A/B firmware updates during service, and the 12-bit ADC monitors battery voltage and lighting current in a single chip.
Recommended
Industrial Sensor Aggregation & Edge IO
The integrated 16-channel 12-bit ADC, 4 PLLs, and 1,134 Kbits of block memory let the 10M25DAF256I7P aggregate data from thermocouples, strain gauges, pressure sensors, and accelerometers in a single chip. Soft-IP Modbus TCP, EtherNet/IP, or PROFINET stacks consume roughly 8K LEs, leaving 17K LEs for application logic and on-board signal conditioning, eliminating a discrete MCU and ADC pair.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF256I7P — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF256I7G | 10M25DAF256C7G | 10M25DAF256C8G | 10M16DAF256I7G | 10M16DAF256C7G |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25000 | 25000 | 25000 | 25000 | 16000 (-36%) | 16000 (-36%) |
| Embedded Memory (Kbits) | 1134 | 1134 | 1134 | 1134 | 858 (-24%) | 858 (-24%) |
| Embedded Multipliers (18x18) | 50 | 50 | 50 | 50 | 45 (-10%) | 45 (-10%) |
| Max User I/Os | 178 | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Speed Grade | -7 | -7 | -7 | -8 (slower) | -7 | -7 |
| Packaging | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| Integrated ADC | 12-bit, 1 MSPS, 16 channels | 12-bit, 1 MSPS, 16 channels | 12-bit, 1 MSPS, 16 channels | 12-bit, 1 MSPS, 16 channels | 12-bit, 1 MSPS, 16 channels | 12-bit, 1 MSPS, 16 channels |
Key Differentiators
- On-die configuration flash enables single-chip instant-on (vs 10CL025YU256I7G (Cyclone 10 LP))
- Integrated 12-bit ADC eliminates external mixed-signal parts (vs 10M16DAF256I7G)
- Dual-configuration flash supports A/B firmware updates (vs Single-image Cyclone V FPGA)
- Mid-density 25K LE sweet spot (vs 10M08DAF256C8G (8K LE))
Design Notes
The MAX 10 10M25DAF256I7P requires four distinct supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog for the ADC and PLLs), VCCIO (1.2 V to 3.3 V per I/O bank, may differ between banks), and VCCPD (3.0 V or 3.3 V for configuration flash and I/O pre-drivers). Decouple each rail with 10 uF bulk + 100 nF + 10 nF capacitors placed within 5 mm of the BGA balls. Power-on sequencing requires VCCINT to ramp before VCCIO/VCCPD to avoid I/O latch-up; Intel's MAX 10 power management user guide (M10-PMU) provides an example LTC3026 sequencer schematic.
The 256-FBGA package uses 1.0 mm ball pitch on a 17 x 17 mm substrate and requires 4-layer PCB stackup minimum with 0.5 oz copper. Microvias (laser-drilled, 0.1 mm pad) or via-in-pad technology is required to break out the inner-row balls. Maintain 50 ohm single-ended (90 ohm differential) impedance on LVDS and DDR3 pairs, with length matching within 150 mils for DDR3 and 25 mils for source-synchronous LVDS. Reference the MAX 10 pin connection guidelines for the recommended decoupling capacitor placement grid.
Estimated: at 100% LE utilization (~25K LEs) plus 50 multipliers running at 200 MHz, the 10M25DAF256I7P dissipates approximately 1.2 W. The 256-FBGA package has theta_JA near 18 C/W on a JEDEC 4-layer test board with 1 oz copper, producing a self-heating rise of roughly 22 C above ambient. Industrial-grade operation at +100 C ambient therefore requires either a center thermal via array under the package or moderate airflow; without thermal relief the junction may exceed 125 C and trigger internal thermal shutdown.
Three pitfalls to avoid: (1) do not leave VCCPD floating - it powers the configuration flash and must ramp to 3.0 V or 3.3 V within the datasheet-specified window or configuration will fail; (2) do not enable the JTAG pins as user I/O without pulling TCK low during power-up, otherwise the device may enter boundary-scan mode unexpectedly; (3) do not exceed the ADC analog input range of 0 V to VCCA (2.5 V nominal) - the ADC inputs are not 5 V tolerant and over-voltage will permanently damage the analog block.
DDR3 interfaces on the MAX 10 require fly-by topology with VTT termination at the end of each address/command fly-by chain. Place a 100 ohm differential termination resistor at each LVDS receiver pin within 200 mils of the BGA ball, and add a 0.1 uF AC-coupling capacitor in series when interfacing to a downstream LVDS chip that does not include internal biasing. Use the Quartus Prime TimeQuest timing analyzer to verify setup/hold margins after place-and-route.
Compliance Information
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - for automotive safety applications use a dedicated ASIL-rated part. Halogen-free per JEDEC JS709B. Conflict-minerals declaration available on Intel's CSR portal.
