10M25DAF256I7G - MAX 10 FPGA 25K LE 256-FBGA Industrial | Intel
MPN: 10M25DAF256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $94.16 | $94.16 |
| 10 | $85.4 | $854.00 |
| 100 | $74.2 | $7,420.00 |
| 500 | $66.85 | $33,425.00 |
| 1,000 | $60.3 | $60,300.00 |
Drop-in alternatives for 10M25DAF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF256C7G
✅ Drop-In✓ In Stock
$38.75 / Unit
View Datasheet →10M25DAF256C8G
✅ Drop-In✓ In Stock
$45.3 / Unit
View Datasheet →10M25DAF256I6G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF256A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF256C6G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF256I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 691,200 bits (1,638 Kbit) |
| User I/Os | 178 |
| Package | 256-FBGA (FineLine BGA) |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V (with 2.5 V analog supply) |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Embedded Multipliers (18x18) | 45 |
| PLLs | 4 |
| User Flash | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | Yes, 12-bit SAR |
| Configuration Method | On-chip non-volatile flash (CFM) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Speed Grade | 7 |
| Supply Configuration | Dual-supply (DAF sub-family) |
10M25DAF256I7G 256-fbga (fineline bga) Pin Configuration Guide
Complete pinout information for 10M25DAF256I7G (256-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DAF256I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DAF256I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, LED Video Wall Scan Drivers, Portable Test and Measurement, Legacy Bus Bridging, Industrial Sensor Aggregation.
Industrial Motor Control
The 10M25DAF256I7G fits industrial motor control because its 25K LE fabric, 45 18x18 multipliers, and 4 PLLs can simultaneously drive PWM generation, encoder feedback decoding, and field-oriented control loops. The integrated 12-bit ADC samples current and voltage feedback without an external analog front-end, reducing BOM cost. Industrial -40 °C to +100 °C rating suits cabinet-mounted drives; 178 user I/Os support multi-axis machines. Compared with a microcontroller-plus-CPLD split, this FPGA unifies logic and reduces component count while maintaining deterministic timing for safety-critical motor commutation.
Recommended
Factory Automation I/O Expansion
Programmable logic controllers and distributed I/O nodes benefit from the 10M25DAF256I7G's 178 GPIO and on-chip configuration flash, which enables instant-on operation without external boot memory. The MAX 10 LVCMOS/LVDS I/O bank flexibility supports direct interfacing to 24 V field-bus signals via opto-isolators, and the integrated ADC monitors supply rails. Industrial temperature operation (-40 °C to +100 °C) is required for control cabinets; on-chip flash permits remote firmware updates via JTAG or serial link. This makes the device a strong choice for IO-Link masters and protocol bridges.
Recommended
LED Video Wall Scan Drivers
Large LED video walls require precise multi-channel PWM and high-speed serial pixel data distribution, both of which the 10M25DAF256I7G handles efficiently. Its 45 18x18 multipliers support gamma correction and color-space conversion in real time, while 178 user I/Os drive multiple parallel scan chains with deterministic skew. On-chip flash storage holds gamma tables and calibration coefficients, eliminating external EEPROM. Compared with discrete logic, the MAX 10 integrates scan timing, refresh logic, and pixel processing in one device for cleaner PCB layout.
Recommended
Portable Test and Measurement
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M25DAF256I7G's combination of LVDS-capable I/Os, embedded multipliers for FFT, and on-chip ADC for signal conditioning. The non-volatile configuration means instant power-on with no boot delay, critical for handheld user experience. With 25K LE the device can capture, buffer, and pre-process multiple channels simultaneously. Industrial temperature tolerance and low 55 nm core power help battery life. Compared with SRAM FPGAs the MAX 10 removes the boot PROM footprint and BOM cost.
Recommended
Legacy Bus Bridging
Bridging legacy parallel buses (PCI, ISA, EPP) to modern serial links (SPI, I2C, UART) is a classic FPGA use case where the 10M25DAF256I7G excels. Its 178 I/Os accommodate wide parallel buses plus multiple serial channels, and the 4 PLLs derive all required clock domains. On-chip flash stores bridge configuration, allowing field re-programming for protocol updates. The device's industrial -40 °C to +100 °C rating suits industrial automation retrofits where legacy equipment must interface with new networked controllers without redesign.
Recommended
Industrial Sensor Aggregation
Aggregating many analog and digital sensors into an industrial Ethernet or Modbus gateway is well-suited to the 10M25DAF256I7G because the on-chip 12-bit ADC samples analog sensors directly while the 25K LE fabric handles Modbus, EtherCAT, or PROFINET framing. The 4 PLLs generate isolated timing for multiple protocol stacks. Industrial -40 °C to +100 °C operation covers cabinet environments; on-chip flash stores sensor calibration data without external EEPROM. Compared with MCU-plus-external-ADC designs, this FPGA reduces component count and PCB layers.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DAF256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF256C7G | 10M25DAF256C8G | 10M25DAF256I6G | 10M25DAF256A7G |
|---|---|---|---|---|---|
| Package | 256-FBGA (F256) | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same | 256-FBGA (F256) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 LE | 25,000 LE (identical) | 25,000 LE (identical) | 25,000 LE (identical) | 25,000 LE (identical) |
| Temperature Grade | Industrial -40 °C to +100 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Industrial -40 °C to +100 °C | Automotive -40 °C to +125 °C |
| Speed Grade | 7 | 7 (identical) | 8 (slower) | 6 (faster) | 7 (identical) |
| User I/Os | 178 | 178 (identical) | 178 (identical) | 178 (identical) | 178 (identical) |
| Embedded Multipliers | 45 (18x18) | 45 (identical) | 45 (identical) | 45 (identical) | 45 (identical) |
| Embedded Memory | 691,200 bits | 691,200 bits (identical) | 691,200 bits (identical) | 691,200 bits (identical) | 691,200 bits (identical) |
Key Differentiators
- Industrial temperature range with same die as commercial sibling (vs 10M25DAF256C7G)
- Faster speed grade than C8G variant (vs 10M25DAF256C8G)
- Industrial temp with same speed as I7G but extended range (vs 10M25DAF256A7G)
Design Notes
The 10M25DAF256I7G is a dual-supply DAF sub-family part requiring both 1.2 V VCCINT for the core and 2.5 V VCCA for the analog blocks (ADC and PLLs). Decouple each supply rail with 100 nF X7R ceramic plus 10 µF bulk tantalum or ceramic within 5 mm of the respective package balls. Power-on reset sequencing per the MAX 10 datasheet requires VCCINT to reach 1.2 V before or simultaneously with VCCA rising past 2.0 V to avoid analog block latch-up.
Estimated: at maximum toggle rate (~100 MHz core, ~200 MHz I/O) the 10M25DAF256I7G dissipates approximately 0.5-0.8 W. The 256-FBGA package has typical theta_JA of 18-22 °C/W on a 4-layer JEDEC test board. Provide at least four thermal vias in the BGA land pattern and consider a 1-oz copper ground pour directly beneath the package. Industrial temperature operation to +100 °C requires junction temperature below 125 °C, leaving roughly 25 °C margin.
BGA escape routing on the 256-FBGA is dense (1.0 mm pitch). Use 0.1 mm (4 mil) trace/space on the top layer for fan-out with via-in-pad or microvia technology for inner-row balls. Match-length tuning on LVDS pairs is critical; assign DIFFIO pairs through Quartus Prime pin planner before signal integrity closure. Keep all configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) free of stubs and route them with 50 Ω controlled impedance.
Do not mistake the DAF dual-supply variant for the SCF single-supply variant; the SCF devices operate from a single 3.3 V supply and lack the integrated 2.5 V analog rail. Mixing sub-families will result in non-functional analog blocks. Also verify MSEL[3:0] strap resistor values before board bring-up, since the wrong setting selects the wrong configuration mode (JTAG, AS, PS, FPP) and the device will not boot from on-chip flash.
Compliance Information
RoHS and REACH compliance per Altera product page; lead-free reflow compatible. For AEC-Q100 automotive qualification, choose the 10M25DAF256A7G automotive-grade variant instead. Halogen-free status not explicitly stated in the verified data.
