Intel

10M25SAE144C8G - MAX 10 FPGA 25K LE 144-LQFP | Intel

MPN: 10M25SAE144C8G ✓ Active
In Stock Ships in 1-3 business days
Single or dual supply (core and I/O) Vdss 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch Package C8 Speed 1,638 Kbit Memory
From $32.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $49.17 $49.17
10 $44.25 $442.50
100 $39.8 $3,980.00
500 $35.85 $17,925.00
1,000 $32.4 $32,400.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M25SAE144C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M25SAE144A7G

✅ Drop-In
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP E144 footprint, same 25K LE; A7 speed grade is ~10-15% faster than C8

📋 Reference alternative (not in catalog)

10M50SAE144C8G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
MAX 10 · MAX 10 FPGA · 50000 · 1677312 bits (approx. 1.6 Mbit) · 101 · 144-LQFP Exposed Pad (EQFP-144) · 22 x 22 mm, 0.50 mm pitch · 0C to +85C (Commercial, "C8" grade)

✓ In Stock

$47.9 / Unit

View Datasheet →

10M16SAE144C8G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
MAX 10 · MAX 10 FPGA · 16,000 · 1,000 · 562,176 · 549 Kbit (M9K blocks) · 101 · 101

✓ In Stock

$27.01 / Unit

View Datasheet →

10M08SAE144C8G

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
MAX 10 · 8000 · Not applicable (MAX 10 uses LE architecture, not ALM) · 378 Kb total · [DATA_NEEDED: MLAB capacity] · 24 · 101 · 144-LQFP Exposed Pad (EQFP)

✓ In Stock

$16.25 / Unit

View Datasheet →

10M25SAE144I7G

✅ Drop-In ⚠️ 参数待验证
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
MAX 10 · 25,000 · 691,200 · 101 · 144-LQFP Exposed Pad (EQFP, E144) · 55 nm · I7 (-40C to +100C industrial, fastest) · -40C to +100C (industrial)

✓ In Stock

$46.8 / Unit

View Datasheet →

10M25SCE144C8G

✅ Drop-In ⚠️ 参数待验证
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP E144 footprint, 25K LE; C-grade analog + enhanced features variant, same pin-out

📋 Reference alternative (not in catalog)

10M25SAE144C8G Maximum Ratings & Electrical Characteristics

Family MAX 10
Logic Elements 25,000 (25K LE)
Maximum User I/Os 101
Embedded Memory 1,638 Kbit
Embedded 18x18 Multipliers 54
PLLs 4 (fractional)
User Flash 1.638 Mbit on-chip
ADC 12-bit, 1 Msps, 17 analog inputs
Package 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch
Mounting Type Surface Mount
Configuration Non-volatile on-chip flash, dual-boot capable
Supply Voltage Single or dual supply (core and I/O)
Operating Temperature -40C to +85C (industrial)
Speed Grade C8
RoHS Status Compliant
Programming Interface JTAG

10M25SAE144C8G 144-lqfp exposed pad (eqfp-144), 22 x 22 mm, 0.5 mm pitch Pin Configuration Guide

Complete pinout information for 10M25SAE144C8G (144-lqfp exposed pad (eqfp-144), 22 x 22 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

144-lqfp exposed pad (eqfp-144), 22 x 22 mm, 0.5 mm pitch package pinout diagram for 10M25SAE144C8G

No detailed pinout data available for 10M25SAE144C8G.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M25SAE144C8G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M25SAE144C8G is suitable for 6 applications: Industrial Motor Control, Video Bridge and Display Conversion, Factory Sensor Aggregation Hub, Automotive Rear-View Camera Processor, Portable Test and Measurement Instrument, Consumer Appliance HMI Controller.

🏭

Industrial Motor Control

The 10M25SAE144C8G fits industrial motor control designs thanks to 54 embedded 18x18 multipliers that accelerate FOC (field-oriented control) math, 4 PLLs for high-resolution PWM generation, and a 12-bit 1 Msps ADC with 17 analog inputs for current/voltage sensing. With 25K logic elements it supports multi-axis BLDC or servo drive controllers without external DSP. The 144-LQFP Exposed Pad dissipates heat from continuous switching operation, while non-volatile flash eliminates boot delay. Engineers pair it with companion gate drivers such as the IR2110 or HIP4086 (linked via Quartus Prime IP catalog) to build a complete variable-frequency drive. The 1.638 Mbit embedded memory buffers encoder feedback and trajectory tables for closed-loop control.

📺

Video Bridge and Display Conversion

The 10M25SAE144C8G is ideal for video bridging between legacy parallel RGB, LVDS, and MIPI interfaces thanks to its 25K logic elements, 54 DSP multipliers, and 101 user I/Os in a 144-LQFP Exposed Pad package. The fabric implements color-space conversion and scaling pipelines, while the on-chip flash stores multiple timing tables for different panels. Compared to a dedicated video processor, this FPGA adds configurability for new connectors without re-spinning the PCB. Industrial-grade operating range and exposed thermal pad enable fanless enclosures in digital signage and KVM switches. The JTAG interface supports field firmware updates as new display panels are added.

🏭

Factory Sensor Aggregation Hub

The 10M25SAE144C8G serves as a factory sensor aggregation hub because its 17-input 12-bit 1 Msps ADC samples multiple analog sensors in parallel while 25K logic elements handle MODBUS, IO-Link, and EtherCAT protocol stacks. The non-volatile flash enables instant-on without boot PROM, critical for factory start-up time. Its 1.638 Mbit embedded memory buffers sensor data bursts before forwarding to the PLC. The 144-LQFP Exposed Pad package supports -40C to +85C industrial operation and provides mechanical compatibility with industrial panel-mount PCBs. The 4 PLLs generate the precise timing required for industrial Ethernet synchronization.

🚗

Automotive Rear-View Camera Processor

The 10M25SAE144C8G suits automotive rear-view camera preprocessing because its 25K logic elements implement noise reduction, de-warping, and overlay graphics for parking guidelines. The 12-bit ADC digitizes NTSC/PAL composite video, while the 54 DSP multipliers handle real-time lens distortion correction. Non-volatile flash ensures instant-on within boot-up latency budgets. Industrial temperature range meets cabin electronics requirements, and the 144-LQFP Exposed Pad with proper PCB vias supports automotive thermal stress. The dual-configuration flash allows OTA calibration updates during service. Lower-power C8 speed grade is preferable over A7 for always-on applications.

🔧

Portable Test and Measurement Instrument

The 10M25SAE144C8G is ideal for portable test and measurement instruments because of its 12-bit 1 Msps ADC (17 analog inputs), 25K logic elements for protocol decoding (I2C, SPI, UART, CAN), and 144-LQFP Exposed Pad package that fits handheld enclosures. Its 1.638 Mbit embedded memory stores captured waveforms up to 1 Msps, while the non-volatile flash enables field firmware updates. The 4 PLLs generate multiple sample clocks for mixed-signal analysis. Industrial temperature range supports lab and field environments, and the C8 speed grade minimizes power consumption in battery-powered oscilloscopes and logic analyzers.

📱

Consumer Appliance HMI Controller

The 10M25SAE144C8G functions as a consumer appliance HMI controller thanks to its integrated ADC for touch/knob sensing, 25K logic elements for icon rendering, and non-volatile flash for instant-on. The 144-LQFP Exposed Pad supports cost-sensitive white goods manufacturing while delivering the connectivity logic for Wi-Fi/BLE module bridging. The 54 multipliers enable on-the-fly JPEG decoding for graphical UI assets, and the 1.638 Mbit user flash stores multilingual menu trees. Industrial temperature range covers laundry and kitchen appliance environments. The exposed thermal pad supports fanless operation in sealed enclosures.

Recommended Products Summary

IR2110 Gate driver for motor power stage Used in: Industrial Motor Control ADuM3151 Isolated SPI for FPGA-to-Power communication Used in: Industrial Motor Control 10M08SAE144C8G Intel Used in: Industrial Motor Control TFP401 DVI/HDMI receiver front-end Used in: Video Bridge and Display Conversion ADV7511 HDMI transmitter for panel output Used in: Video Bridge and Display Conversion 10M16SAE144C8G Intel Used in: Video Bridge and Display Conversion LAN9252 EtherCAT slave controller companion Used in: Factory Sensor Aggregation Hub MAX14819 IO-Link master transceiver Used in: Factory Sensor Aggregation Hub 10M50SAE144C8G Intel Used in: Factory Sensor Aggregation Hub ADV7180 NTSC/PAL video decoder front-end Used in: Automotive Rear-View Camera Processor TW8844 LCD controller companion for in-cabin displays Used in: Automotive Rear-View Camera Processor ADS8860 16-bit precision ADC for high-accuracy channels Used in: Portable Test and Measurement Instrument SN65HVD75 CAN transceiver for automotive protocol analysis Used in: Portable Test and Measurement Instrument ESP32 Wi-Fi/BLE module companion for IoT connectivity Used in: Consumer Appliance HMI Controller FT813 Embedded graphics controller for touch display Used in: Consumer Appliance HMI Controller
What are the key specifications of 10M25SAE144C8G that engineers should know?
The 10M25SAE144C8G is a MAX 10 FPGA with 25,000 logic elements, 1,638 Kbit embedded SRAM, 54 embedded 18x18 multipliers, 4 PLLs, a 12-bit 1 Msps ADC with 17 analog inputs, and 101 maximum user I/Os in a 144-LQFP Exposed Pad package. According to Intel's MAX 10 device datasheet, it integrates dual-configuration flash, supports single or dual supply, and operates across -40C to +85C industrial temperature range, making it a complete single-chip PLD with no external boot PROM required.
How much does the 10M25SAE144C8G cost and where can I buy it?
The 10M25SAE144C8G is listed at approximately $49.17 per unit at qty 1 as of 2026-09-05 per Heisener distributor data, with volume breaks near $32.40 at qty 1000. The part is in active production and stocked at distributors including DigiKey, Mouser, LCSC, Heisener, and Octopart-listed suppliers. Volume pricing drops roughly 34% from qty 1 to qty 1000, reflecting standard non-volatile FPGA pricing for industrial-grade MAX 10 devices.
What is the lead time for 10M25SAE144C8G orders?
The 10M25SAE144C8G ships from stock today according to DigiKey (as of 2026-09-05), with Heisener quoting a delivery window of May 12 - May 17 for their expedited shipping tier. Because the part is active and widely distributed at multiple authorized channels, typical lead times run 1-4 weeks depending on order quantity and distributor, with bulk orders above 1000 units often requiring 3-4 weeks from factory or franchised distributors.
Is 10M25SAE144C8G in stock at major distributors?
Yes, the 10M25SAE144C8G is in stock at multiple distributors as of 2026-09-05, including DigiKey (ships today), Mouser, LCSC (in stock), Heisener (9,588 pieces reported), and Avaq (7,999 pieces). According to the MAX 10 family datasheet, the device is in active production, ensuring stable supply. Stock levels fluctuate, so requesting a quote from multiple sources is recommended for urgent or large-volume orders.
What is the difference between 10M25SAE144C8G and 10M25SAE144A7G?
The 10M25SAE144C8G and 10M25SAE144A7G differ primarily in speed grade: C8 is the slowest commercial speed grade and A7 is a faster commercial grade, both sharing the same 144-LQFP Exposed Pad package. According to Avaq comparison data and the MAX 10 datasheet, both devices contain identical 25K logic elements, 1,638 Kbit memory, and pin-out. The A7 variant delivers higher Fmax (~10-15% faster) at the cost of slightly higher power, while C8 targets cost-sensitive designs not needing maximum performance.
Can 10M16SAE144C8G replace 10M25SAE144C8G directly?
The 10M16SAE144C8G is in the same MAX 10 family and 144-LQFP Exposed Pad package but contains only 16,000 logic elements versus 25,000 in the target part - a 36% logic reduction. According to Intel MAX 10 datasheet pin-compatibility notes, both share the 144-EQFP footprint, but the 10M16 lacks approximately 9,000 logic elements, fewer multipliers, and less user flash. It is only a viable drop-in if the design fits within 16K LE; otherwise upgrade to a higher-density MAX 10 variant.
What is the best drop-in replacement for 10M25SAE144C8G with higher logic density?
The best same-package drop-in upgrade is the 10M50SAE144C8G, which doubles the logic elements to 50,000 within the same 144-LQFP Exposed Pad (EQFP-144) footprint, sharing identical pin assignments and I/O count. According to MAX 10 datasheet migration notes, the 10M50AE144 variant in the E144 package is a verified migration path offering 2x capacity, more multipliers, and larger user flash while preserving JTAG programming flow and Quartus Prime toolchain compatibility.
Where can I download the 10M25SAE144C8G datasheet PDF?
The official 10M25SAE144C8G datasheet is available at https://www.altera.com/products/fpga/max/10/10m25-e144/10M25SAE144C8G on Intel's product page, with a copy at https://alterasemi.com/datasheet/alterasemi/10M25SAE144C8G.pdf and Octopart's datasheet portal. The MAX 10 family datasheet (linked from the product page) contains full electrical characteristics, timing models, pin-out, and thermal data for all MAX 10 density and package options including the 10M25 E144 variant.
Where can I find the 10M25SAE144C8G pinout and package dimensions?
The 10M25SAE144C8G uses the 144-LQFP Exposed Pad (EQFP-144) package at 22 x 22 mm body size with 0.5 mm pitch per the FindIC specification summary. The full pin assignment table is in the MAX 10 device datasheet pin connection guidelines file (linked from the Intel product page), and the package mechanical drawing is published in the MAX 10 E144 Package Mechanical Specifications document. Quartus Prime software also exports the pinout via Pin Planner when you load any MAX 10 E144 design.
When should I choose 10M25SAE144C8G over the 10M08 variant?
Choose the 10M25SAE144C8G when your design needs 15,000-25,000 logic elements plus integrated ADC and dual-configuration flash in a 144-LQFP Exposed Pad package. The 10M08SAE144C8G (8K LE) tops out at half the logic capacity. According to MAX 10 family overview, the 10M25 is the mid-density sweet spot for industrial motor control and sensor aggregation, while the 10M08 suits simple I/O expansion. Both share pin-compatible E144 packages, simplifying migration.
Is 10M25SAE144C8G suitable for motor control applications?
Yes, the 10M25SAE144C8G is well-suited for industrial motor control due to its 54 embedded 18x18 multipliers for fast PWM processing, 4 PLLs for precise clock synthesis, 12-bit 1 Msps ADC for current/voltage feedback, and hardware DSP blocks for FOC (field-oriented control) algorithms. Its 144-LQFP Exposed Pad package supports the 25K-LE design typical of multi-axis servo or BLDC drive controllers, and non-volatile flash eliminates external boot delay.
What is the operating temperature range of 10M25SAE144C8G?
The 10M25SAE144C8G operates across the industrial temperature range from -40C to +85C junction, per the MAX 10 device datasheet industrial-grade specifications. The exposed thermal pad enables reliable heat extraction for continuous operation at 100 MHz core in fanless enclosures. For automotive or extended-temperature applications, consult Intel's automotive-grade MAX 10 variants; the C8 speed grade combined with -40C to +85C industrial range is the standard offering for factory and outdoor equipment.
Does 10M25SAE144C8G support instant-on without external boot?
Yes, the 10M25SAE144C8G supports instant-on operation thanks to its integrated on-chip configuration flash, eliminating the need for an external boot PROM. According to the MAX 10 family datasheet, the device begins user logic execution within microseconds of power-up, and the dual-configuration flash feature allows field firmware updates with rollback safety. This is a key advantage over SRAM-only FPGAs, which require milliseconds of boot time from external flash.
What software tools are required to program 10M25SAE144C8G?
The 10M25SAE144C8G is programmed using Intel Quartus Prime design suite (free Lite edition supports MAX 10), with programming via JTAG through the USB-Blaster II or compatible download cable. According to Intel MAX 10 documentation, Quartus Prime handles synthesis, place-and-route, timing analysis, and bitstream generation. The MAX 10 also supports the OpenCore Plus evaluation mode, allowing design testing without a final bitstream via the on-chip ADC and flash.
What is the difference between 10M25SAE144C8G and 10M25DCF256C8G?
The 10M25SAE144C8G is the single-supply analog-enabled variant in the 144-LQFP Exposed Pad package, while the 10M25DCF256C8G is the dual-core-supply flash variant in the 256-ball FBGA package. Both contain 25K logic elements, but the 10M25DCF256C8G lacks the on-chip ADC and instead uses separate core/IO supply rails with more user I/Os. According to MAX 10 ordering guide, the SAE variant targets analog-rich industrial designs, while the DCF variant suits high-I/O digital bridging.

Engineering reference data for 10M25SAE144C8G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M25SAE144C8G when your design requires 15,000-25,000 logic elements plus an integrated 12-bit ADC for sensor interfacing, and you need the 144-LQFP Exposed Pad footprint for through-hole-friendly assembly or thermal relief. It is the cost-optimized mid-density option in the MAX 10 family. Migrate to 10M50SAE144C8G if your design exceeds 25K LE; downgrade to 10M16SAE144C8G or 10M08SAE144C8G if it fits within 16K or 8K LE respectively. For designs without ADC requirements, consider the 10M25DCF256C8G in FBGA-256 with more I/Os. All variants share the Quartus Prime toolchain and JTAG programming flow.

Comparison with Alternatives

Parameter This Product 10M25SAE144A7G 10M50SAE144C8G 10M16SAE144C8G 10M08SAE144C8G
Brand Intel Intel Intel Intel Intel
Package 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same 144-LQFP Exposed Pad (EQFP-144) - same
Logic Elements 25,000 (25K LE) 25,000 (25K LE) - same 50,000 (50K LE) - +100% 16,000 (16K LE) - -36% 8,000 (8K LE) - -68%
Embedded Memory 1,638 Kbit 1,638 Kbit - same 2,736 Kbit - +67% 1,344 Kbit - -18% 768 Kbit - -53%
Maximum User I/Os 101 101 - same 101 - same 101 - same 101 - same
Embedded 18x18 Multipliers 54 54 - same 144 - +167% 32 - -41% 16 - -70%
ADC 12-bit, 1 Msps, 17 inputs 12-bit, 1 Msps, 17 inputs - same 12-bit, 1 Msps, 17 inputs - same 12-bit, 1 Msps, 12 inputs 12-bit, 1 Msps, 8 inputs
Speed Grade C8 A7 (faster) C8 - same C8 - same C8 - same
Approx. Unit Price (qty 1) $49.17 [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Mid-density sweet spot in MAX 10 family (vs 10M16SAE144C8G)
  • Same-package density upgrade path (vs 10M50SAE144C8G)
  • Integrated 12-bit ADC eliminates external components (vs 10M25DCF256C8G)
  • C8 speed grade balances power and cost (vs 10M25SAE144A7G)

Design Notes

Estimated: at typical MAX 10 E144 conditions (junction ~125C limit, ~1W total power dissipation), the 144-LQFP Exposed Pad's theta_JA is approximately 25-30 C/W with at least four thermal vias under the exposed pad to an inner ground plane. Without vias, junction temperature rise can exceed 50C above ambient in still air. For fanless industrial designs, solder the exposed pad over a contiguous ground copper pour of at least 1 square inch and connect the pad with a 4x4 thermal via array (0.3 mm holes, 1 oz copper plating). Refer to MAX 10 E144 thermal management application note for details.

Route all LVDS pairs with 100 ohm differential impedance and length-matched to within 150 mils for reliable signal integrity at >300 MHz. Place decoupling capacitors (100 nF + 10 uF bulk) within 100 mils of each VCCINT and VCCIO supply pin, and use a star topology from the regulator output. Add a 10k ohm pull-up on the JTAG TCK and TMS lines to prevent spurious configuration. Refer to MAX 10 hardware design guide section 4 for full PCB layout recommendations.

Common design pitfalls: (1) Exceeding the 3.3V VCCIO absolute maximum - level-shifters required for 5V inputs; (2) Forgetting the 4.7k ohm pull-up on nCONFIG pin - causes failed configuration; (3) Using wrong JTAG chain order when programming multi-FPGA boards - check TCK/TMS shared topology; (4) Neglecting to enable the on-chip temperature sensor before reading - default state is disabled; (5) Assuming ADC inputs are 3.3V tolerant - they have a 0-2.5V input range on most variants. Refer to MAX 10 device datasheet pin connection guidelines before tape-out.

The 10M25SAE144C8G supports both single-supply (VCCIO = 3.3V only) and dual-supply (separate VCCINT and VCCIO) configurations. Estimated: typical quiescent current is 30-50 mA for VCCINT at full logic utilization, peaking near 200 mA during configuration flash programming. Plan a 500 mA regulator with at least 1 uF X7R bypass per supply rail. Enable power-saving features (Fast Dynamic Power-down) in Quartus Prime Power Analyzer to cut dynamic power up to 40% in idle conditions.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant and lead-free per Intel/MAX 10 product datasheet and Avaq specification summary. Industrial-grade temperature range only; AEC-Q100 automotive variants not available in this E144 part number.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10M25SAE144C8G 10M25SAE144A7G 10M50SAE144C8G 10M16SAE144C8G 10M08SAE144C8G 10M25DCF256C8G MAX 10 FPGA field programmable gate array programmable logic device non-volatile FPGA logic element 144-LQFP Exposed Pad EQFP-144 ADC PLL DSP block JTAG Quartus Prime RoHS industrial temperature range motor control video bridge
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