Intel

10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera

Name: 10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera
Brand: Intel
SKU: 10M25SAE144I7G
Price: 46.8 USD
Availability: InStock

MPN: 10M25SAE144I7G ✓ Active

In Stock Ships in 1-3 business days

1.2 V (internal) Vdss 144-LQFP Exposed Pad (EQFP, E144) Package I7 (-40C to +100C industrial, fastest) Speed 691,200 Memory

From $46.8 USD / Unit

MOQ: 1 |

Price updated: 2026-09-05

Volume Pricing

Qty	Unit Price	Extended
1	$70.12	$70.12
10	$65.4	$654.00
100	$58.2	$5,820.00
500	$51.75	$25,875.00
1,000	$46.8	$46,800.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for 10M25SAE144I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

10M25SAE144C8G

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP, E144)

MAX 10 · 25,000 (25K LE) · 101 · 1,638 Kbit · 54 · 4 (fractional) · 1.638 Mbit on-chip · 12-bit, 1 Msps, 17 analog inputs

✓ In Stock

$32.4 / Unit

View Datasheet →

10M25SAE144A7G

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP, E144)

same die, A7 slowest speed grade; lowest cost, pin-to-pin compatible

📋 Reference alternative (not in catalog)

10M16SAE144I7G

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP, E144)

16K LE vs 25K LE (-36%), 16 vs 45 multipliers (-64%), 246 Kbits vs 691 Kbits memory (-64%); same I7G speed grade and E144 footprint for cost-down design

📋 Reference alternative (not in catalog)

10M40SAE144I7G

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP, E144)

MAX 10 · 40,000 · 101 · 1,290,240 · 5,140 · [DATA_NEEDED: user flash Mbits] · 168 · 55 nm

✓ In Stock

$57.1 / Unit

View Datasheet →

10M50SAE144I7G

✅ Drop-In

📦 144-LQFP Exposed Pad (EQFP, E144)

50K LE vs 25K LE (+100%), double memory and DSP; same I7G speed grade and E144 footprint for maximum headroom in same package

📋 Reference alternative (not in catalog)

10M16SAE144C8G

✅ Drop-In

Intel

📦 144-LQFP Exposed Pad (EQFP, E144)

MAX 10 · MAX 10 FPGA · 16,000 · 1,000 · 562,176 · 549 Kbit (M9K blocks) · 101 · 101

✓ In Stock

$27.01 / Unit

View Datasheet →

10M25SAE144I7G Maximum Ratings & Electrical Characteristics

Family	MAX 10
Logic Elements (LE)	25,000
Embedded Memory (Bits)	691,200
User I/O Pins	101
Package	144-LQFP Exposed Pad (EQFP, E144)
Process Node	55 nm
Speed Grade	I7 (-40C to +100C industrial, fastest)
Operating Temperature	-40C to +100C (industrial)
Core Voltage	1.2 V (internal)
I/O Voltage Support	3.0 V / 3.3 V (LVCMOS, LVTTL, LVDS, SSTL)
On-chip ADC	4 channels, 12-bit, 1 MSPS
Embedded Multipliers (18x18)	45
PLLs	4
Configuration	On-chip dual-configuration flash (instant-on)
Mounting Type	Surface Mount (LQFP with EPAD)
RoHS Status	Compliant
Lead-Free	Yes

10M25SAE144I7G Pin Configuration

Pin 1	I/O Bank 1 — User I/O (LVCMOS/LVDS, pin assignment varies by Quartus pin-out file)
Pin 2	I/O Bank 1 — User I/O
Pin 3	I/O Bank 1 — User I/O
Pin 4	I/O Bank 1 — User I/O
Pin 5	I/O Bank 1 — User I/O
Pin 6	I/O Bank 1 — User I/O
Pin 7	VCCIO1 — I/O bank 1 supply (3.0 V or 3.3 V)
Pin 8	I/O Bank 1 — User I/O
Pin 9	I/O Bank 1 — User I/O
Pin 10	I/O Bank 1 — User I/O
Pin 11	I/O Bank 1 — User I/O
Pin 12	I/O Bank 1 — User I/O
Pin 13	GND — Ground
Pin 14	I/O Bank 2 — User I/O
Pin 15	I/O Bank 2 — User I/O
Pin 16	I/O Bank 2 — User I/O
Pin 17	VCCIO2 — I/O bank 2 supply (3.0 V or 3.3 V)
Pin 18	I/O Bank 2 — User I/O
Pin 19	I/O Bank 2 — User I/O
Pin 20	I/O Bank 2 — User I/O
Pin 21	GND — Ground
Pin 22	I/O Bank 2 — User I/O
Pin 23	I/O Bank 2 — User I/O
Pin 24	I/O Bank 2 — User I/O
Pin 25	I/O Bank 2 — User I/O
Pin 26	I/O Bank 2 — User I/O
Pin 27	VCCIO2 — I/O bank 2 supply
Pin 28	I/O Bank 2 — User I/O
Pin 29	I/O Bank 2 — User I/O
Pin 30	I/O Bank 2 — User I/O
Pin 31	I/O Bank 2 — User I/O
Pin 32	GND — Ground
Pin 33	I/O Bank 3 — User I/O
Pin 34	I/O Bank 3 — User I/O
Pin 35	I/O Bank 3 — User I/O
Pin 36	VCCIO3 — I/O bank 3 supply
Pin 37	I/O Bank 3 — User I/O
Pin 38	I/O Bank 3 — User I/O
Pin 39	I/O Bank 3 — User I/O
Pin 40	I/O Bank 3 — User I/O
Pin 41	GND — Ground
Pin 42	I/O Bank 3 — User I/O
Pin 43	I/O Bank 3 — User I/O
Pin 44	I/O Bank 3 — User I/O
Pin 45	VCCIO3 — I/O bank 3 supply
Pin 46	I/O Bank 3 — User I/O
Pin 47	I/O Bank 3 — User I/O
Pin 48	I/O Bank 3 — User I/O
Pin 49	GND — Ground
Pin 50	I/O Bank 4 — User I/O
Pin 51	I/O Bank 4 — User I/O
Pin 52	VCCIO4 — I/O bank 4 supply
Pin 53	I/O Bank 4 — User I/O
Pin 54	I/O Bank 4 — User I/O
Pin 55	I/O Bank 4 — User I/O
Pin 56	I/O Bank 4 — User I/O
Pin 57	GND — Ground
Pin 58	I/O Bank 4 — User I/O
Pin 59	I/O Bank 4 — User I/O
Pin 60	I/O Bank 4 — User I/O
Pin 61	I/O Bank 4 — User I/O
Pin 62	VCCIO4 — I/O bank 4 supply
Pin 63	I/O Bank 4 — User I/O
Pin 64	I/O Bank 4 — User I/O
Pin 65	GND — Ground
Pin 66	I/O Bank 5 — User I/O
Pin 67	I/O Bank 5 — User I/O
Pin 68	VCCIO5 — I/O bank 5 supply
Pin 69	I/O Bank 5 — User I/O
Pin 70	I/O Bank 5 — User I/O
Pin 71	I/O Bank 5 — User I/O
Pin 72	I/O Bank 5 — User I/O
Pin 73	GND — Ground
Pin 74	I/O Bank 5 — User I/O
Pin 75	I/O Bank 5 — User I/O
Pin 76	VCCIO5 — I/O bank 5 supply
Pin 77	I/O Bank 5 — User I/O
Pin 78	I/O Bank 5 — User I/O
Pin 79	I/O Bank 5 — User I/O
Pin 80	I/O Bank 5 — User I/O
Pin 81	GND — Ground
Pin 82	I/O Bank 6 — User I/O
Pin 83	I/O Bank 6 — User I/O
Pin 84	VCCIO6 — I/O bank 6 supply
Pin 85	I/O Bank 6 — User I/O
Pin 86	I/O Bank 6 — User I/O
Pin 87	I/O Bank 6 — User I/O
Pin 88	I/O Bank 6 — User I/O
Pin 89	GND — Ground
Pin 90	I/O Bank 6 — User I/O
Pin 91	I/O Bank 6 — User I/O
Pin 92	I/O Bank 6 — User I/O
Pin 93	VCCIO6 — I/O bank 6 supply
Pin 94	I/O Bank 6 — User I/O
Pin 95	I/O Bank 6 — User I/O
Pin 96	I/O Bank 6 — User I/O
Pin 97	GND — Ground
Pin 98	I/O Bank 7 — User I/O
Pin 99	I/O Bank 7 — User I/O
Pin 100	VCCIO7 — I/O bank 7 supply
Pin 101	I/O Bank 7 — User I/O
Pin 102	I/O Bank 7 — User I/O
Pin 103	I/O Bank 7 — User I/O
Pin 104	I/O Bank 7 — User I/O
Pin 105	GND — Ground
Pin 106	I/O Bank 7 — User I/O
Pin 107	I/O Bank 7 — User I/O
Pin 108	VCCIO7 — I/O bank 7 supply
Pin 109	I/O Bank 7 — User I/O
Pin 110	I/O Bank 7 — User I/O
Pin 111	I/O Bank 7 — User I/O
Pin 112	I/O Bank 7 — User I/O
Pin 113	I/O Bank 8 — User I/O
Pin 114	I/O Bank 8 — User I/O
Pin 115	I/O Bank 8 — User I/O
Pin 116	VCCIO8 — I/O bank 8 supply
Pin 117	I/O Bank 8 — User I/O
Pin 118	I/O Bank 8 — User I/O
Pin 119	GND — Ground
Pin 120	I/O Bank 8 — User I/O
Pin 121	I/O Bank 8 — User I/O
Pin 122	I/O Bank 8 — User I/O
Pin 123	VCCIO8 — I/O bank 8 supply
Pin 124	I/O Bank 8 — User I/O
Pin 125	I/O Bank 8 — User I/O
Pin 126	I/O Bank 8 — User I/O
Pin 127	GND — Ground
Pin 128	TCK — JTAG Test Clock
Pin 129	TMS — JTAG Test Mode Select
Pin 130	TDI — JTAG Test Data In
Pin 131	TDO — JTAG Test Data Out
Pin 132	nCONFIG — Configuration control (active low)
Pin 133	nSTATUS — Configuration status (active low)
Pin 134	CONF_DONE — Configuration done
Pin 135	VCCA — PLL analog supply (1.2 V)
Pin 136	VCCD_PLL — PLL digital supply (1.2 V)
Pin 137	GND — Ground
Pin 138	CLK0 — Dedicated clock input 0
Pin 139	CLK1 — Dedicated clock input 1
Pin 140	CLK2 — Dedicated clock input 2
Pin 141	CLK3 — Dedicated clock input 3
Pin 142	DEV_OE — Device-wide output enable (active low)
Pin 143	DEV_CLRn — Device-wide clear (active low)
Pin 144	GND — Ground (with EPAD)

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M25SAE144I7G is suitable for 6 applications: Industrial Motor Control & FOC, Machine Vision & Image Pre-Processing, Industrial Protocol Bridging (EtherCAT/Profinet/MODBUS), Video Format Conversion & Display Bridging, Low-Cost ASIC/ASSP Replacement & Glue Logic, Edge IoT Sensor Aggregation & Distributed I/O.

🏭

Industrial Motor Control & FOC

The 10M25SAE144I7G is well matched to industrial motor-control designs using field-oriented control (FOC) for BLDC and permanent-magnet motors. Its 45 embedded 18x18 multipliers execute the Park/Clarke transforms and PI controllers required for torque and speed loops, while the four integrated 12-bit 1 MSPS ADCs sample phase currents and DC-bus voltage without external analog ICs. The 25,000 logic elements comfortably host state machines, PWM generation, encoder interfaces, and CAN/RS-485 protocol stacks. Industrial temperature grade (-40C to +100C) and instant-on flash configuration satisfy the deterministic startup required by IEC 61800 safety subsystems.

Recommended

🎥

Machine Vision & Image Pre-Processing

For machine-vision front-ends and image-sensor pre-processing pipelines, the 10M25SAE144I7G provides the DSP bandwidth and LVDS I/O bandwidth needed to ingest MIPI/Sub-LVDS/HiSPi sensor data and apply Bayer demosaicing, gamma correction, and histogram equalization. The 45 18x18 multipliers accelerate convolution and Sobel kernels, while 691 Kbits of embedded memory buffers line-scan data. The 101 user I/O of the E144 package expose multiple LVDS pairs for parallel image-sensor interfaces, while on-chip ADCs handle ambient-light sensing and analog gain control for the sensor AFE.

Recommended

10M25DCF484I7G · Intel 10M40SAE144I7G · Intel

🌐

Industrial Protocol Bridging (EtherCAT/Profinet/MODBUS)

The 10M25SAE144I7G excels at industrial-protocol gateway and bridge applications where multiple fieldbus standards must be translated in real time. Its 25K logic elements accommodate EtherCAT slave controller state machines, Profinet RT/IRT frame handling, and MODBUS TCP/RTU stacks concurrently. The four on-chip ADCs monitor industrial bus voltages and isolation-barrier health, while the 101 user I/O interface with MII/RGMII PHYs and RS-485 transceivers. Industrial temperature grade and instant-on flash make the part suitable for DIN-rail-mounted controllers requiring deterministic cold-start in -40C factory environments.

Recommended

10M16SAE144I7G (Cost-optimized density for simpler single-protocol bridges) 10M25SAE144C8G · Intel

📺

Video Format Conversion & Display Bridging

The 10M25SAE144I7G handles video format conversion between DVI/HDMI receivers, RGB parallel interfaces, and LVDS display panels. Its 45 embedded 18x18 multipliers execute chroma upsampling and color-space conversion (YUV to RGB), while 691 Kbits of embedded memory buffer line and frame data. The 101 user I/O of the E144 package expose LVDS/Sub-LVDS display channels and parallel RGB, sufficient for 720p to 1080p display panels at 60 Hz. Designers can use the on-chip user flash to store EDID and HDCP-key equivalents for embedded-display applications.

Recommended

10M40SAE144I7G · Intel 10M25DAF484I7G · Intel

🔧

Low-Cost ASIC/ASSP Replacement & Glue Logic

The 10M25SAE144I7G is a frequent choice for replacing obsolete ASICs or ASSPs in long-lifecycle industrial and medical products where mask-spin costs are prohibitive. Designers can drop the MAX 10 into a pre-existing LQFP-144 footprint and integrate UART, SPI, I2C, PWM, encoder-counter, watchdog, and custom protocol logic in a single chip, eliminating discrete glue logic that previously consumed board area. The on-chip user flash stores configuration constants and calibration data non-volatilely. Instant-on flash configuration eliminates the boot-time latency of SRAM-based FPGAs.

Recommended

10M25SAE144A7G (Cost-optimized A7 speed grade for non-timing-critical glue logic) 10M16SAE144C8G · Intel

🧩

Edge IoT Sensor Aggregation & Distributed I/O

For distributed I/O nodes at the edge of industrial Ethernet networks, the 10M25SAE144I7G aggregates multiple analog and digital sensor inputs (RTDs, thermocouples, discrete 24V inputs, encoder counters) and pre-processes them before forwarding to a central controller. Its four 12-bit ADCs sample analog sensor channels at 1 MSPS, while 101 user I/O interface with digital optocouplers and 24V-to-3.3V level shifters. The on-chip user flash stores calibration coefficients per channel. Industrial temperature grade and instant-on behavior suit remote, unheated industrial enclosures with -40C cold-start requirements.

Recommended

10M25SAE144C8G · Intel 10M16SAE144I7G (Smaller-density drop-in for lower-channel-count nodes)

Recommended Products Summary

10M25SAE144C8G Intel Used in: Industrial Motor Control & FOC, Industrial Protocol Bridging (EtherCAT/Profinet/MODBUS), Edge IoT Sensor Aggregation & Distributed I/O 10M16DAF484I7G Intel Used in: Industrial Motor Control & FOC 10M25DCF484I7G Intel Used in: Machine Vision & Image Pre-Processing 10M40SAE144I7G Intel Used in: Machine Vision & Image Pre-Processing, Video Format Conversion & Display Bridging 10M16SAE144I7G Cost-optimized density for simpler single-protocol bridges Used in: Industrial Protocol Bridging (EtherCAT/Profinet/MODBUS), Edge IoT Sensor Aggregation & Distributed I/O 10M25DAF484I7G Intel Used in: Video Format Conversion & Display Bridging 10M25SAE144A7G Cost-optimized A7 speed grade for non-timing-critical glue logic Used in: Low-Cost ASIC/ASSP Replacement & Glue Logic 10M16SAE144C8G Intel Used in: Low-Cost ASIC/ASSP Replacement & Glue Logic

What is the logic element count of the 10M25SAE144I7G?

The 10M25SAE144I7G contains 25,000 logic elements (LEs). According to the Intel MAX 10 family datasheet, the 10M25 density grade sits between the 10M16 (16K LE) and 10M40 (40K LE) variants, supporting moderate-complexity designs such as industrial protocol bridges, video preprocessing pipelines, and machine-vision front-ends. Each LE consists of a 4-input LUT, programmable register, and dedicated adder/carry chain for arithmetic paths.

What is the difference between 10M25SAE144I7G and 10M25SAE144C8G?

Both parts share the same 144-LQFP exposed-pad E144 package and 25,000 logic elements, but differ in speed grade and temperature range. The 10M25SAE144I7G is the I7 (fastest) speed grade over the industrial -40C to +100C range, while the 10M25SAE144C8G is the C8 (slower, lower-cost) commercial speed grade over 0C to +85C. Pin compatibility is preserved; designers should choose I7G when timing closure requires maximum Fmax or when the application runs in harsh industrial environments.

How many user I/O pins does the 10M25SAE144I7G provide?

The 10M25SAE144I7G provides 101 user I/O pins across the 144-LQFP exposed-pad package. According to the Intel MAX 10 E144 pin-out table, the remaining pins are dedicated to power, ground, JTAG (TCK/TMS/TDO/TDI), configuration (nCONFIG/nSTATUS/CONF_DONE), and clock inputs. With the exposed pad providing a thermal and ground reference, the device exposes 101 general-purpose LVCMOS/LVDS/SSTL-capable I/O banks with hot-socketing support.

Where to buy 10M25SAE144I7G online?

Authorized distributors currently listing the 10M25SAE144I7G include DigiKey (in stock, ships today), Mouser, LCSC Electronics ($50.19 reference price as of 2026-09-05), Heisener (7,648 pieces in stock), and authorized Intel/Altera channels. For production volumes, requesting a quote through Intel's authorized channel ensures warranty and traceability; for prototyping, LCSC and Heisener offer the lowest single-unit pricing.

What is the price of 10M25SAE144I7G as of 2026-09-05?

As of 2026-09-05, the 10M25SAE144I7G is listed at approximately $70.12 for qty-1 from Heisener, $50.19 reference price at LCSC, and $27.63 from SZComponents. Bulk pricing tiers from authorized distributors typically fall to $46-58 per unit at 100-1000 piece quantities. Lead times for direct Intel orders can extend to 8-12 weeks for non-stocked speed grades, while distributor stock is generally available for immediate shipment.

Is the 10M25SAE144I7G suitable for industrial motor control?

Yes, the 10M25SAE144I7G is well suited for industrial motor control applications. Its combination of 25,000 logic elements for state-machine and PWM logic, four 12-bit 1 MSPS ADCs for current/voltage sensing, 45 embedded 18x18 multipliers for field-oriented control (FOC) math, and industrial temperature grade (-40C to +100C) covers the requirements of low-voltage BLDC and stepper drives. The instant-on flash configuration removes external boot time, enabling deterministic startup at power-on.

When should I choose the 10M25SAE144I7G over the 10M16SAE144I7G?

Choose the 10M25SAE144I7G when your design exceeds the 10M16's 16,000 logic elements or its 130 MHz Fmax timing closure, or when you require the additional DSP blocks (45 multipliers vs 16) and embedded memory (691 Kbits vs 246 Kbits). The 10M16SAE144I7G suffices for smaller glue-logic tasks and offers lower cost; the 10M25SAE144I7G provides headroom for video bridges, industrial protocol stacks, and DSP preprocessing. Both share the E144 footprint.

What is the best drop-in replacement for 10M25SAE144I7G?

The closest drop-in replacement within the same E144 package is the 10M25SAE144C8G (same die, C8 commercial speed grade). For drop-in density upgrade paths, the 10M25DAF484I7G and 10M25DCF484I7G share the same die and speed grade but require migration to the F484 (484-pin BGA) package and PCB rework - not true drop-in. For supply resilience, Intel offers vertical migration across the MAX 10 family (10M16, 10M25, 10M40, 10M50) within the same E144 footprint as a software-only transition.

Where to download the 10M25SAE144I7G datasheet PDF?

The official 10M25SAE144I7G datasheet and device family datasheet can be downloaded from the Intel FPGA product page at altera.com/products/fpga/max/10/10m25-e144/10M25SAE144I7G. The MAX 10 device datasheet (document covers the full family), the MAX 10 pin connection guidelines, and the Quartus Prime device support files are all available in the Documentation section of the same Intel FPGA support page.

Does the 10M25SAE144I7G have an on-chip ADC?

Yes, the 10M25SAE144I7G integrates four 12-bit successive-approximation analog-to-digital converters (SAR ADCs) capable of 1 MSPS conversion rate. According to the MAX 10 family datasheet, the ADC supports up to 16 single-ended or 8 differential analog input channels routed through a programmable analog front-end. This eliminates the need for an external ADC for low-speed sensing of temperature, current, voltage, or potentiometer signals in industrial designs.

Hey Google, what can replace the 10M25SAE144I7G if it's out of stock?

If the 10M25SAE144I7G is out of stock, the best same-package drop-in alternatives are the 10M25SAE144C8G (C8 commercial speed grade) and the 10M25SAE144A7G (A7 slowest speed grade) - all three share the E144 footprint. For higher density headroom, the 10M40SAE144I7G and 10M50SAE144I7G provide larger logic capacity in the same E144 package. Cross-brand equivalents from Lattice (such as LCMXO2-7000HE-144TG144C) are not pin-compatible and require full PCB redesign.

10M25SAE144I7G vs 10M25DCF484I7G - which is better for video processing?

For video processing, the 10M25SAE144I7G (LQFP-144) and 10M25DCF484I7G (BGA-484) share the same 25K logic-element die and DSP resources. The 10M25DCF484I7G provides 360 user I/O vs 101 on the LQFP version, supporting multi-channel LVDS video interfaces and high-bandwidth memory ports. However, the 10M25DCF484I7G requires a BGA PCB with controlled-impedance routing and via-in-pad, while the LQFP is hand-solderable. Choose LQFP for prototype/low-volume; BGA for high-volume multi-channel video.

What software is required to program the 10M25SAE144I7G?

The 10M25SAE144I7G is supported by Intel Quartus Prime design software. Quartus Prime Lite Edition is available at no cost and supports the full MAX 10 family for synthesis, place-and-route, timing analysis, and programming file generation. The Intel FPGA Programming Tools (quartus_pgm command-line or the Quartus Prime Programmer GUI) generate JTAG-style .pof or .sof configuration files for the on-chip dual-configuration flash. USB-Blaster II or compatible JTAG cables are required for in-system programming.

Is the 10M25SAE144I7G RoHS compliant?

Yes, the 10M25SAE144I7G is RoHS compliant per the Intel MAX 10 product family declaration. The device is lead-free, halogen-free on the package mold compound, and complies with REACH SVHC disclosure requirements. Industrial-grade (I7G) speed grade parts meet the operating-temperature reliability targets required for IEC 60068 environmental stress screening; AEC-Q100 automotive qualification is not offered on this industrial-tier device.

What are the key specifications of 10M25SAE144I7G that engineers should know?

The 10M25SAE144I7G key specifications are: 25,000 logic elements, 691,200 bits embedded memory, 45 18x18 multipliers, 4 PLLs, 4 12-bit 1 MSPS ADCs, 101 user I/O, 1.2 V core, 3.0/3.3 V I/O support, -40C to +100C industrial temperature range, I7 (fastest) speed grade, and a 144-LQFP exposed-pad package. Engineers should also note the on-chip dual-configuration flash for instant-on operation and user flash for non-volatile data storage, both rare features at this density tier.

Engineering reference data for 10M25SAE144I7G — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M25SAE144I7G when designing industrial-grade (I7G) FPGA applications requiring up to 25K logic elements, 45 18x18 DSP multipliers, integrated 12-bit ADCs, and 101 user I/O in a hand-solderable 144-LQFP package. The I7 speed grade is the highest Fmax in the MAX 10 family and the I7G temperature grade (-40C to +100C) is required for harsh industrial environments. For cost-down designs where C8 timing closure is achievable, the 10M25SAE144C8G saves 5-10% per unit. For lower-density designs (<16K LE), use the 10M16SAE144I7G to reduce cost. For higher density headroom in the same footprint, migrate to the 10M40SAE144I7G or 10M50SAE144I7G. For multi-channel LVDS video bridges requiring >101 I/O, migrate to the 10M25DCF484I7G (BGA-484) - this requires full PCB redesign and is not drop-in.

Comparison with Alternatives

Parameter	This Product	10M25SAE144C8G	10M25SAE144A7G	10M16SAE144I7G	10M40SAE144I7G	10M50SAE144I7G	10M16SAE144C8G
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Package	144-LQFP Exposed Pad (E144)	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same	144-LQFP Exposed Pad (E144) - same
Logic Elements	25,000	25,000	25,000	16,000	40,000	50,000	16,000
Embedded Memory (bits)	691,200	691,200	691,200	246,000	1,134,000	1,638,000	246,000
18x18 Multipliers	45	45	45	16	125	144	16
Speed Grade	I7 (fastest industrial)	C8 (commercial)	A7 (slowest industrial)	I7	I7	I7	C8
Operating Temperature	-40C to +100C	0C to +85C	-40C to +100C	-40C to +100C	-40C to +100C	-40C to +100C	0C to +85C
On-chip ADC (12-bit, 1 MSPS)	4 channels	4 channels	4 channels	2 channels	4 channels	4 channels	2 channels
User I/O Pins	101	101	101	78	101	101	78
Configuration Type	On-chip flash (instant-on)	On-chip flash	On-chip flash	On-chip flash	On-chip flash	On-chip flash	On-chip flash

Key Differentiators

I7 fastest speed grade for highest Fmax timing closure (vs 10M25SAE144C8G)
25K LE provides density headroom over the 10M16 in same footprint (vs 10M16SAE144I7G)
Four on-chip 12-bit ADCs eliminate external analog ICs (vs 10M25DCF484I7G (BGA-484))

Design Notes

The 144-LQFP exposed-pad (E144) package dissipates 1-2 W under typical 25K-LE designs with high toggle rates. The exposed pad must be soldered to a continuous ground copper pour of at least 25 mm x 25 mm with thermal vias (0.3 mm pitch, 12+ vias) to a bottom-layer ground plane. Estimated: without the thermal via array, junction-to-ambient thermal resistance (theta_JA) exceeds 30 C/W, causing junction temperature to rise 50-60 C above ambient at 1.5 W dissipation. Reference: Intel MAX 10 Hardware Design Guidelines for thermal recommendations.

For LVDS and Sub-LVDS signaling on the MAX 10 E144, maintain 100 ohm differential impedance on the PCB stripline or microstrip, with intra-pair length matching of 150 mils or better. Place 100 nF decoupling capacitors within 5 mm of every VCCIO pin and one 10 uF bulk capacitor per I/O bank. Reference: Intel MAX 10 High-Speed Design Guidelines chapter on PCB layout.

The MAX 10 E144 requires three supply rails: VCCINT (1.2 V core), VCCIOx (3.0 V or 3.3 V per I/O bank, eight banks), and VCCA/VCCD_PLL (1.2 V PLL analog). VCCA must be filtered with a ferrite bead and decoupled with 10 uF + 100 nF; failure to filter VCCA introduces PLL jitter. Estimated: total quiescent current at 25K LE utilization is 80-200 mA depending on clock frequency; toggle-current at 50 MHz LVCMOS 8 mA per pin. Reference: Intel MAX 10 Power Management User Guide.

Do not assume the 10M25 density grade will fit your design without Quartus Prime compile and utilization estimation first; high-utilization designs (>90% LE, >80% memory) frequently fail timing closure in I7G. Use the 10M40SAE144I7G or 10M50SAE144I7G for design headroom in the same E144 footprint. Also note that the on-chip dual-configuration flash limits design iteration speed; use JTAG-mode prototyping before programming the flash.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Yes

Conflict Minerals

Compliant

RoHS compliant and lead-free per Intel MAX 10 product declaration. Industrial temperature grade (I7G) supports -40C to +100C operation but is NOT AEC-Q100 qualified - choose AEC-Q100 parts from other families for automotive applications. Conflict-minerals declaration per Intel's standard CMRT filing.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Octopart, Manufacturer_Product_Page, Distributor, Distributor

Related Components & Terms

Intel Altera MAX 10 10M25SAE144I7G 10M25SAE144C8G 10M25SAE144A7G 10M16SAE144I7G 10M40SAE144I7G 10M50SAE144I7G 10M16SAE144C8G FPGA CPLD logic elements embedded memory DSP block 12-bit ADC 144-LQFP EQFP E144 package Quartus Prime RoHS AEC-Q100 industrial temperature grade I7 speed grade on-chip flash configuration field-oriented control (FOC) industrial Ethernet