10M16SAE144C8G - MAX 10 FPGA 16K LE 101 I/O 144-EQFP | Intel
MPN: 10M16SAE144C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.02 | $45.02 |
| 10 | $40.52 | $405.20 |
| 100 | $36.02 | $3,602.00 |
| 500 | $31.51 | $15,755.00 |
| 1,000 | $27.01 | $27,010.00 |
Drop-in alternatives for 10M16SAE144C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M16SAE144I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M25SAE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$32.4 / Unit
View Datasheet β10M08SAE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$16.25 / Unit
View Datasheet β10M16DAE144C8G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
LCMXO2-4000HC-4TQFP144
β Drop-Inπ Reference alternative (not in catalog)
LCMXO3LF-4300C-5BG256C
β Drop-Inπ Reference alternative (not in catalog)
10M16SAE144C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements | 16,000 |
| Number of LABs/CLBs | 1,000 |
| Total RAM Bits | 562,176 |
| Embedded SRAM | 549 Kbit (M9K blocks) |
| Number of User I/O | 101 |
| Number of GPIO | 101 |
| Supply Voltage (Core) | 3.0 V / 3.3 V single supply |
| Process Technology | 55 nm TSMC with embedded flash |
| Configuration Memory | Internal dual-configuration flash (non-volatile) |
| Integrated ADC | 12-bit, 1 MSPS (MAX 10 hard IP) |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial, C8G grade) |
| Speed Grade | 8 (C8G) |
| Package | 144-LQFP Exposed Pad (EQFP-144) |
| Mounting Type | Surface Mount |
| Lead-Free / RoHS | Compliant per manufacturer product page |
| Lifecycle Status | Active |
10M16SAE144C8G 144-lqfp exposed pad (eqfp-144) Pin Configuration Guide
Complete pinout information for 10M16SAE144C8G (144-lqfp exposed pad (eqfp-144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SAE144C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SAE144C8G is suitable for 6 applications: Industrial Motor Control, LED Display and Lighting Controllers, Industrial I/O Expansion and Glue Logic, Portable Instrumentation and Test Equipment, Automotive Body Electronics and Sensor Aggregation, Video and Display Bridging.
Industrial Motor Control
The 10M16SAE144C8G is well suited to industrial motor control, where its integrated 12-bit 1 MSPS ADC samples phase currents and bus voltage without an external converter, while 16,000 logic elements handle encoder decoding (QEP), field-oriented control (FOC) loops, and PWM generation. Placed between the power stage and the host MCU, it offloads real-time control tasks at deterministic hardware latency, freeing the MCU for supervisory HMI and networking duties. Compared with a software-only implementation on a microcontroller, the MAX 10 reduces interrupt latency and CPU load by up to 70% in field-oriented control loops running at 20 kHz.
Recommended
LED Display and Lighting Controllers
The 10M16SAE144C8G drives multi-channel LED displays and architectural lighting fixtures by leveraging its 101 user I/O pins, each capable of high-speed LVCMOS signaling to FET drivers. With 16K LE, designers can implement per-pixel PWM at refresh rates above 4 kHz, eliminating visible flicker in DMX-512 or SPI-driven LED strips. The non-volatile flash allows instant-on behavior on power-up with no boot delay, critical for emergency lighting and signage. This combination of high I/O count and on-die flash makes the 10M16 a strong fit over discrete 74HC logic for medium-density lighting arrays.
Recommended
Industrial I/O Expansion and Glue Logic
The 10M16SAE144C8G is widely used as I/O expansion and protocol-bridging glue logic in industrial PCs, PLCs, and embedded SBCs. It can translate between UART, SPI, I2C, parallel bus, and proprietary protocols at wire-speed without CPU intervention. With 101 user I/O, a single MAX 10 can replace multiple 74-series logic ICs, reducing PCB area and BOM cost. The integrated dual-configuration flash enables in-field firmware updates with failsafe fallback, a feature rarely found in discrete logic implementations.
Recommended
Portable Instrumentation and Test Equipment
For portable oscilloscopes, data loggers, and bench instruments, the 10M16SAE144C8G combines signal acquisition, on-die ADC, and real-time DSP in a single low-power chip. Its integrated 12-bit ADC handles trigger and threshold detection, while 16K LE runs FIR filters, FFT pre-processing, and display refresh. The 55 nm flash process keeps active power below 200 mW typical, and the non-volatile configuration eliminates boot-time delays for handheld instruments that must start instantly when the user presses the power button.
Recommended
Automotive Body Electronics and Sensor Aggregation
The 10M16SAE144C8G aggregates multiple sensor inputs (temperature, pressure, position) in body control modules and small sensor hubs, replacing several discrete microcontrollers and ADCs with a single chip. Its 16K LE handles CAN/LIN message filtering and PWM actuator control, while the integrated 12-bit ADC reads analog sensors directly. Designers should select the industrial or automotive MAX 10 variant for under-hood or chassis deployments; the standard C8G grade is suitable only for cabin and infotainment applications where ambient temperature stays within 0-85 Β°C.
Recommended
Video and Display Bridging
The 10M16SAE144C8G bridges legacy parallel RGB or LVDS displays to modern MIPI-DSI or HDMI sources in industrial HMIs and kiosks. Its 16K LE is sufficient for color-space conversion and pixel-rate FIFO buffering, and the 549 Kbit embedded RAM acts as line buffers for deinterlacing or scaling. Designers targeting multi-lane LVDS benefit from the device's LVDS-capable I/O bank, eliminating external serializer/deserializer chips. Compared with an ASSP bridge, the MAX 10 offers programmable timing margins and quick customization for non-standard display resolutions.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SAE144C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SAE144I7G | 10M25SAE144C8G | 10M08SAE144C8G | 10M16DAE144C8G | LCMXO2-4000HC-4TQFP144 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Lattice Semiconductor |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP (TQFP-144) - same footprint, exposed-pad variants available |
| Logic Elements | 16,000 | 16,000 | 25,000 (+56%) | 8,000 (-50%) | 16,000 | 4,000 LUTs (-75%) |
| Embedded RAM | 549 Kbit (562,176 bits) | 549 Kbit | 675 Kbit (+23%) | 378 Kbit (-31%) | 549 Kbit | 92 Kbit (-83%) |
| User I/O | 101 | 101 | 101 | 101 | 101 | 115 (+14%) |
| Temperature Grade | Commercial 0 Β°C to +85 Β°C | Industrial -40 Β°C to +100 Β°C | Commercial 0 Β°C to +85 Β°C | Commercial 0 Β°C to +85 Β°C | Commercial 0 Β°C to +85 Β°C | Commercial 0 Β°C to +85 Β°C |
| Speed Grade | 8 | 7 (faster) | 8 | 8 | 8 | 4 |
| Integrated ADC | 12-bit 1 MSPS (MAX 10 hard IP) | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | None |
| Configuration Memory | Internal dual-image flash (non-volatile) | Internal dual-image flash | Internal dual-image flash | Internal dual-image flash | Internal dual-image flash | Internal flash (single image) |
Key Differentiators
- Higher logic density in the same EQFP-144 footprint (vs 10M08SAE144C8G)
- Integrated 12-bit ADC eliminates external converter (vs LCMXO2-4000HC-4TQFP144)
- Dual-image flash for failsafe field updates (vs LCMXO2-4000HC-4TQFP144)
Design Notes
Solder the exposed thermal pad (EP) of the EQFP-144 package to a continuous ground copper pour with at least 1 square inch of area to meet the package thermal resistance rating. The EP is electrically tied to GND inside the package; missing or insufficient EP soldering raises junction temperature and may cause thermal shutdown under high I/O switching loads. Add thermal vias (0.3 mm drill, 1.2 mm pitch, 4x4 array minimum) beneath the EP to inner ground planes for improved heat spreading.
Decouple each VCC and VCCIO supply pin with a 0.1 Β΅F X7R ceramic capacitor placed within 2 mm of the pin, plus a bulk 10 Β΅F tantalum or polymer capacitor per power rail. MAX 10 FPGAs have multiple VCCIO banks; tie each bank to its own regulator or filter if mixing 3.3 V and 1.8 V logic. Use the Intel Quartus Prime PowerPlay tool to estimate dynamic current, which scales with toggle rate and is often underestimated during early design.
Do not assume the MAX 10 E144 footprint is pin-compatible across all density variants; the 10M04/10M08/10M16/10M25 E144 packages share the same pinout but differ in I/O count and pin function. Always re-run Quartus pin assignments when migrating between densities. Also note that JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) have fixed pin locations and cannot be reassigned as user I/O in user mode.
Compliance Information
RoHS and lead-free status confirmed per Altera/Intel product page. REACH, halogen-free, and conflict-mineral compliance not explicitly listed in the verified web data. The MAX 10 10M16SAE144C8G is a commercial-grade part and is not AEC-Q100 qualified; for automotive deployments, consult Intel's automotive-grade MAX 10 variants.
