10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera
MPN: 10M25SCE144A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $74.95 | $74.95 |
| 10 | $67.45 | $674.50 |
| 100 | $59.96 | $5,996.00 |
| 500 | $52.46 | $26,230.00 |
| 1,000 | $47.21 | $47,210.00 |
Drop-in alternatives for 10M25SCE144A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M25SAE144I7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$46.8 / Unit
View Datasheet β10M16SCE144A7G
β Drop-Inβ In Stock
$24.5 / Unit
View Datasheet β10M08SCE144A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M04SCE144A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$10.1 / Unit
View Datasheet β10M25SCE144A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25000 |
| User Flash Memory | 691200 bits |
| Maximum User I/O | 101 |
| Process Technology | 55 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Voltage | 3.3 V |
| Package | 144-LQFP Exposed Pad (EQFP EP) |
| Terminal Pitch | 0.5 mm |
| Mounting Type | Surface Mount |
| Operating Junction Temperature | -40 C to +125 C |
| Moisture Sensitivity Level (MSL) | 3 (168 hours) |
| Packaging | Tray |
| RoHS Status | Compliant |
| Automotive Grade | AEC-Q100 |
10M25SCE144A7G Pin Configuration
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| Pin 97 | GND β Ground (multiple GND pins distributed around package) |
| Pin 98 | VCCIO β I/O supply voltage bank |
| Pin 99 | VCCINT β Core supply voltage 1.2V |
| Pin 100 | VCCA β Analog supply for PLLs/ADC |
| Pin 101 | VCCPD β Configuration supply voltage |
| Pin 102 | GND β Ground |
| Pin 103 | TCK β JTAG test clock |
| Pin 104 | TMS β JTAG test mode select |
| Pin 105 | TDI β JTAG test data in |
| Pin 106 | TDO β JTAG test data out |
| Pin 107 | nCONFIG β Configuration active-low reset |
| Pin 108 | nSTATUS β Configuration status |
| Pin 109 | CONFIG_DONE β Configuration complete indicator |
| Pin 110 | DCLK β Configuration clock input |
| Pin 111 | DATA0 β Configuration data input |
| Pin 112 | nCE β Chip enable (active low) |
| Pin 113 | MSEL0 β Configuration mode select 0 |
| Pin 114 | MSEL1 β Configuration mode select 1 |
| Pin 115 | MSEL2 β Configuration mode select 2 |
| Pin 116 | DEV_CLRn β Device-wide clear (active low) |
| Pin 117 | DEV_OE β Device-wide output enable |
| Pin 118 | GND β Ground |
| Pin 119 | VCCIO β I/O supply voltage bank |
| Pin 120 | VCCINT β Core supply voltage 1.2V |
| Pin 121 | I/O β General-purpose user I/O bank 1 |
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| Pin 143 | I/O β General-purpose user I/O bank 6 |
| Pin 144 | I/O β General-purpose user I/O bank 6 |
| Pin EPAD | EPAD β Exposed thermal pad - must be soldered to ground plane for thermal dissipation |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25SCE144A7G is suitable for 6 applications: Industrial Motor Control and HMI, Automotive Body and Comfort Subsystems, Portable Medical Instrument Front-End, Low-Cost Video and Display Bridging, IoT Edge Sensor Aggregation, Test and Measurement Instrumentation.
Industrial Motor Control and HMI
The 10M25SCE144A7G fits industrial motor-control and human-machine interface boards where deterministic logic, on-chip ADC, and AEC-Q100 reliability are required. Its 25000 logic elements and embedded 12-bit SAR ADC blocks handle multi-axis PWM generation, encoder feedback decoding, and current sensing in a single chip, while the 691200-bit user flash stores firmware parameters and personality data. The 144-LQFP EP package simplifies low-cost two-layer PCB assembly for factory-floor controllers. Designers typically pair the FPGA with external gate drivers and op-amps for current shunt amplification, leveraging the device's 101 user I/O for parallel encoder, SPI, and UART connectivity. The instant-on capability eliminates boot-time delays, enabling safe-torque-off response in under 10 ms from power-up.
Recommended
Automotive Body and Comfort Subsystems
The 10M25SCE144A7G's AEC-Q100 qualification and -40C to +125C junction temperature range suit body controllers, lighting modules, and seat/window comfort modules. The 55nm process and integrated dual-configuration flash support fail-safe over-the-air firmware updates with rollback, a critical requirement for ISO 26262 ASIL-B subsystems. The 144-LQFP EP package withstands automotive vibration and thermal-cycling profiles better than BGA variants for underhood-adjacent placements. Engineers use the device's 25000 LEs to consolidate discrete logic, LIN/CAN transceivers' glue, and PWM drivers into one programmable platform, reducing PCB area and BOM cost by 30-50% versus discrete implementations.
Recommended
Portable Medical Instrument Front-End
Portable patient monitors, ultrasound front-ends, and point-of-care diagnostics benefit from the 10M25SCE144A7G's combination of embedded ADC blocks, DSP multipliers, and low-power non-volatile operation. The 25000 logic elements process multi-channel sensor data at rates up to 1 MSPS through the integrated SAR ADC, while DSP blocks perform filtering and feature extraction without an external DSP chip. The 144-LQFP EP package supports handheld form factors where BGA solder joint reliability is a concern, and the embedded 691200-bit flash stores calibration coefficients per device. The instant-on characteristic reduces start-up time for emergency and battery-powered use cases.
Recommended
Low-Cost Video and Display Bridging
The 10M25SCE144A7G serves as a low-cost video format converter or display bridge in industrial HMI panels, digital signage, and machine-vision pre-processors. The 25000 LEs and DSP blocks handle up to 1080p60 color-space conversion, scaling, and LVDS-to-LVCMOS bridging within the available logic budget. The 144-LQFP EP package provides 101 user I/O - sufficient for 24-bit RGB plus control signals - and the embedded flash eliminates external boot memory that would otherwise inflate the bill of materials. Designers integrate the device with external HDMI or MIPI bridge chips when higher bandwidth is required.
Recommended
IoT Edge Sensor Aggregation
The 10M25SCE144A7G is well-suited as an edge aggregator for industrial IoT nodes requiring deterministic sensor fusion, on-chip flash storage, and minimal cloud dependency. Its embedded ADC blocks digitize multiple analog sensor channels simultaneously, while 25000 LEs run protocol stacks like Modbus, IO-Link, and EtherCAT slave controllers concurrently. The 144-LQFP EP package simplifies through-hole-compatible assembly for retrofit installations, and the dual-configuration flash enables remote firmware rollback for OTA update safety. Designers pair the FPGA with external Wi-Fi, NB-IoT, or Ethernet PHYs depending on connectivity requirements.
Recommended
Test and Measurement Instrumentation
The 10M25SCE144A7G supports bench-top and rack-mount test equipment where reconfigurable logic enables product-line flexibility. Its 25000 LEs implement custom stimulus generators, protocol-aware pattern checkers, and timing-critical trigger logic with sub-nanosecond resolution. The 691200-bit embedded user flash stores test pattern libraries and calibration constants, while the integrated ADC samples DUT analog signals for closed-loop verification. The 144-LQFP EP package's exposed pad provides adequate thermal dissipation for continuous full-utilization operation at room temperature, simplifying mechanical design in lab instrumentation.
Recommended
Recommended Products Summary
Engineering reference data for 10M25SCE144A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25SAE144I7G | 10M16SCE144A7G | 10M08SCE144A7G | 10M04SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25000 | 25000 | 16000 (-36%) | 8000 (-68%) | 4000 (-84%) |
| User Flash Memory | 691200 bits | 691200 bits | 500000 bits | 300000 bits | 200000 bits |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 |
| Speed Grade | -A7 | -I7 (industrial) | -A7 | -A7 | -A7 |
| Operating Temperature | -40C to +125C | -40C to +100C (industrial) | -40C to +125C | -40C to +125C | -40C to +125C |
| Automotive Grade | AEC-Q100 | Industrial (not AEC-Q100) | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Unit Price (1 pc) | $74.95 | $78.50 (est.) | $45.00 (est.) | $28.00 (est.) | $18.00 (est.) |
Key Differentiators
- Highest logic density in 144-LQFP EP MAX 10 family (vs 10M16SCE144A7G)
- AEC-Q100 qualified for automotive applications (vs 10M25SAE144I7G)
- Single-chip non-volatile integration eliminates external boot memory (vs Xilinx Spartan-6)
Design Notes
Estimated: The 144-LQFP exposed-pad package has a junction-to-ambient thermal resistance of approximately 23 C/W with the EPAD soldered to a 4-layer PCB with 16 thermal vias. At typical utilization (~50% LE, ~30% RAM, junction temp 85C), self-heating is minimal, but sustained full-utilization operation in enclosed industrial enclosures can push junction to 110C. Add thermal vias under the EPAD and connect them to an inner ground plane for adequate dissipation in sealed enclosures.
Place all decoupling capacitors as close as possible to the VCCINT, VCCIO, VCCA, and VCCPD pins. Use 0.1uF ceramic capacitors for high-frequency decoupling and a 10uF bulk capacitor near each supply pin. The exposed pad must be soldered to the PCB ground plane with at least 16 thermal vias for proper thermal and electrical grounding per the MAX 10 Hardware Design Guidelines.
Do not apply 3.3V to any I/O bank when the corresponding VCCIO is powered down - this causes I/O latch-up. Always sequence the VCCIO supply before applying input signals, or use the MAX 10 hot-socketing feature for live insertion designs. Also note that the 144-LQFP EP package has only 101 user I/O - designs requiring more I/O must step up to F256 or F484 BGA MAX 10 packages, which require PCB redesign.
Differential pairs (LVDS) require 100-ohm differential impedance and matched trace lengths within 20 mil. Place JTAG signals (TCK, TMS, TDI, TDO) away from high-frequency switching traces to avoid coupling noise during programming. The MSEL pins must be tied to the correct voltage levels (or left floating) to select the desired configuration mode per the MAX 10 pin connection guidelines.
Compliance Information
AEC-Q100 qualified per Altera/Intel product page. RoHS compliant per datasheets.com and Arrow listings. Halogen-free status not explicitly stated in the verified web data - set to unknown.
