10M25DCF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
MPN: 10M25DCF484A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.1 | $821.00 |
| 100 | $74.3 | $7,430.00 |
| 500 | $67.8 | $33,900.00 |
| 1,000 | $62.5 | $62,500.00 |
Drop-in alternatives for 10M25DCF484A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M25DAF484A7G
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View Datasheet →10M16DCF484A7G
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View Datasheet →10M25DCF484A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Block RAM | 1,728 Kbit |
| Multipliers (18x18) | 81 |
| Maximum User I/O | 360 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Package | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal LDO) |
| Operating Temperature | -40C to +125C (automotive AEC-Q100) |
| Speed Grade | -7 |
| Configuration Type | Dual flash, internal |
| User Flash | 12 Kbit (32 Kbyte user flash; total device flash larger) |
| ADC Block | 12-bit, 1 MSPS, 17 channels |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M25DCF484A7G 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10M25DCF484A7G (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DCF484A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DCF484A7G is suitable for 6 applications: Industrial Motor Control Drives, Programmable Logic Controller (PLC) CPU and I/O Expansion, Automotive Sensor Fusion and ADAS Pre-Processing, Industrial IoT Gateway and Edge Protocol Converter, Low-Cost Video Processing and Display Controllers, Pre-ASIC Prototyping and ASIC Emulation.
Industrial Motor Control Drives
The 10M25DCF484A7G's 25,000 logic elements and 81 dedicated 18x18 multipliers provide the DSP throughput needed for field-oriented control (FOC) of three-phase AC induction and permanent-magnet motors. The four integrated PLLs generate the high-resolution PWM carrier and quadrature encoder sampling clocks, while the integrated 12-bit 1 MSPS ADC samples motor phase currents and DC-bus voltage directly, eliminating an external ADC. The 360 user I/Os in the 484-FBGA package handle multiple encoder interfaces (EnDat, BiSS, Tamagawa), resolver excitation, and gate-driver PWM outputs simultaneously, with the AEC-Q100 -40C to +125C rating suiting drive cabinet environments.
Recommended
Programmable Logic Controller (PLC) CPU and I/O Expansion
PLC manufacturers use the 10M25DCF484A7G as an industrial bus controller and high-speed I/O expander, where 25K LE accommodates multiple IEC 61131-3 logic engines plus PROFIBUS, PROFINET, and EtherCAT slave interfaces. The 1,728 Kbit embedded block RAM buffers telegrams and process-image memory without external SRAM. Instant-on dual flash configuration is critical for deterministic PLC startup, and the integrated ADC monitors backplane voltages and temperature sensors. The 484-FBGA package's 360 I/Os interface directly to digital input modules, opto-isolated outputs, and serial high-speed links without external muxing.
Recommended
Automotive Sensor Fusion and ADAS Pre-Processing
The 10M25DCF484A7G's AEC-Q100 qualification and -40C to +125C automotive temperature grade make it suitable for in-cabin and chassis-mounted sensor-fusion ECUs that aggregate radar, ultrasonic, and camera data before forwarding to the central ADAS processor. 81 18x18 multipliers run Kalman and lane-detection pre-filters in parallel; 360 I/Os interface directly to multiple LVDS camera links and CAN-FD transceivers. The integrated ADC samples up to 17 analog sensors (steering angle, brake pressure, IMU outputs), and non-volatile instant-on ensures the ECU is operational within the engine-start latency budget.
Recommended
Industrial IoT Gateway and Edge Protocol Converter
Industrial edge gateways based on the 10M25DCF484A7G translate between legacy fieldbus protocols (Modbus RTU, CAN, RS-485) and modern Ethernet-based protocols (OPC-UA, MQTT, TSN) without an external processor. The 25K LE accommodates multiple soft-core CPUs (Nios II) plus protocol stacks; 1,728 Kbit embedded RAM buffers message queues. The integrated ADC monitors power-rail voltage and temperature, supporting predictive maintenance telemetry. The 484-FBGA package's 360 I/Os enable connection to multiple isolated serial ports, Ethernet PHYs, and 4G/5G modem modules simultaneously in a fanless industrial housing.
Recommended
Low-Cost Video Processing and Display Controllers
The 10M25DCF484A7G with 25K LE and 81 multipliers handles 720p/1080p video pipelines including color-space conversion, scaling, and on-screen display overlay in medical imaging, industrial HMIs, and digital signage. The 1,728 Kbit embedded block RAM stores frame buffers for partial image processing. Four PLLs generate pixel clocks for HDMI, LVDS, and RGB panel interfaces. The 360 I/Os interface directly to camera sensor MIPI bridges and parallel LCD panels, with the integrated ADC providing touch-screen and backlight voltage monitoring.
Recommended
Pre-ASIC Prototyping and ASIC Emulation
The 10M25DCF484A7G serves as a pre-silicon validation platform for ASIC designs, where 25K LE accommodates RTL modules for functional verification and firmware-hardware co-debug before tape-out. Quartus Prime supports incremental compilation and SignalTap logic analyzer, enabling real-time RTL-level debug. The 484-FBGA package exposes enough I/Os to map the full ASIC pad ring. The integrated ADC supports analog mixed-signal ASIC verification, and non-volatile instant-on behavior allows fast design-iteration cycles without reconfiguring external boot memories.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DCF484A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF484A7G | 10M25DCF484C8G | 10M25DCF484I7G | 10M16DCF484A7G |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 |
| Embedded Block RAM | 1,728 Kbit | 1,728 Kbit | 1,728 Kbit | 1,728 Kbit | 1,152 Kbit |
| Multipliers (18x18) | 81 | 81 | 81 | 81 | 45 |
| Maximum User I/O | 360 | 360 | 360 | 360 | 320 |
| Operating Temperature | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (AEC-Q100) |
| Speed Grade | -7 | -7 | -8 | -7 | -7 |
Key Differentiators
- Highest logic-element density in same 484-FBGA footprint with AEC-Q100 grade (vs 10M16DCF484A7G)
- Automotive temperature grade -40C to +125C (vs 10M25DCF484C8G)
- Lower-cost same-package downgrade path (vs 10M25DCF484A7G (this part))
Design Notes
Estimated: at 25C ambient and full logic utilization with 50% toggle rate, the 10M25DCF484A7G typically dissipates 1.2-1.8 W. The 484-FBGA package uses a 1.0 mm ball pitch; a minimum 4-layer PCB with dedicated inner GND plane is required for heat spreading. Place thermal vias in a grid pattern directly under the BGA to reduce junction-to-ambient thermal resistance. For designs approaching +85C ambient or with sustained high toggle rates, attach a small heatsink or use forced airflow.
The 484-FBGA with 1.0 mm pitch requires 0.5 mm pad diameter and 0.4 mm solder-mask openings per IPC-7351. Use ENIG surface finish for fine-pitch BGA and reflow in nitrogen atmosphere to prevent solder-ball oxidation. Implement at least 6 ground vias in the central ball-grid region to stitch the top GND pour to internal planes. Series-dampening resistors on clock outputs should be placed within 5 mm of the BGA balls to control signal-integrity reflections.
MAX 10 FPGAs operate from a single 3.3 V supply; the internal LDO generates 1.2 V for the core, eliminating the need for an external core regulator. Decouple the VCCIO bank supplies (1.2 V to 3.3 V depending on I/O standard) with one 100 nF X7R ceramic capacitor per bank plus one 10 uF bulk capacitor near the FPGA. Place the bulk capacitor within 10 mm of the supply balls. Program the MAX 10 device features in Quartus Prime to enable the internal temperature-sensing diode for thermal monitoring.
Do not confuse the 10M25DCF484A7G (automotive temp) with the 10M25DCF484C8G (commercial temp) - the C8 variant operates only 0C to +85C and will fail in chassis-mounted industrial installations. When migrating between MAX 10 density points, verify that the I/O bank voltage assignments match the new device's pinout - bank 1A, 1B, 2, 3, 4, 5, 6, 7, 8 placements differ slightly across 10M08/10M16/10M25/10M50 in the same F484 package. Always re-run pin assignment in Quartus Prime after density migration.
Compliance Information
RoHS and REACH compliance per Intel product declaration. AEC-Q100 qualified for automotive applications per ordering code 'A' suffix. Lead-free and halogen-free per Intel MAX 10 family datasheet environmental specifications.
